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AVS08CB/F2

STMicroelectronics

AVS08CB/F2 by STMicroelectronics

STMicroelectronics AVS08CB/F2 is a TRIAC with 500V repetitive peak off-state voltage and 5A max RMS on-state current. It operates b/w -10 °C to 125°C, ideal for AC power control applications. The package is surface mountable with GULL WING terminals in a RECTANGULAR shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,292 parts In-Stock

1+ parts

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2,292

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Anansix

USA . 1,161 parts In-Stock

1+ parts

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1,161

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Vyrian

USA . 769 parts In-Stock

1+ parts

-

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769

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,059 parts In-Stock

1+ parts

$2.383

100+ parts

-

1k+ parts

-

10k+ parts

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2,059

$2.383

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IDEA Electronic Components Group

UK . 1,363 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

$3.758

10k+ parts

-

1,363

$4.176

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$3.758

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MKK Technologies

India . 2,032 parts In-Stock

1+ parts

$7.852

100+ parts

-

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2,032

$7.852

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DigiPath Technology Company

USA . 2,032 parts In-Stock

1+ parts

$7.852

100+ parts

-

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10k+ parts

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2,032

$7.852

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Corphita

USA . 3,894 parts In-Stock

1+ parts

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3,894

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Parana Technologies

USA . 547 parts In-Stock

1+ parts

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$4.993

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547

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$4.993

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Native Components

USA . 101 parts In-Stock

1+ parts

-

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$2.102

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101

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$2.102

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Overview

Upgrade your electronics with the AVS08CB/F2 by STMicroelectronics, a high-quality TRIAC designed for a wide range of applications. With a reputation for reliability and innovation, STMicroelectronics delivers superior performance and durability in every product. Ideal for controlling AC power in various devices, this TRIAC offers customers unmatched value, benefits, and advantages. Say goodbye to subpar electronics and experience the difference with the AVS08CB/F2 today.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for various applications.

Configuration SINGLE

The single configuration simplifies the setup and installation process, making it user-friendly.

Surface Mount YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Package Shape RECTANGULAR

The rectangular shape of the package provides a compact design, saving space in the application.

Terminal Form GULL WING

The gull wing terminal form offers good mechanical strength and solderability, ensuring reliable connections.

Maximum Repetitive Peak Off-state Leakage Current 10 uA

The low off-state leakage current helps in reducing power consumption and improving overall efficiency.

No. of Terminals 3

Having three terminals allows for convenient connections and functionality in the circuit.

Package Style (Meter) FLANGE MOUNT

The flange mount package style provides secure mounting options and enhances thermal conductivity for better performance.

Maximum Operating Temperature 125 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions and operate reliably.

Trigger Device Type TRIAC

Being a TRIAC trigger device offers precise control over the switching of alternating current, making it suitable for a wide range of AC applications.

Minimum Operating Temperature -10 °C

The low minimum operating temperature allows the product to function effectively even in colder environments.

Terminal Position SINGLE

Having a single terminal position simplifies the wiring process and improves usability.

Maximum RMS On-state Current 5 A

With a maximum RMS on-state current of 5A, the product can handle high current loads efficiently.

Repetitive Peak Off-state Voltage 500 V

The high repetitive peak off-state voltage makes the product suitable for applications requiring voltage control and regulation.

Technical Specifications

Triode For Alternating Current (TRIAC) AVS08CB/F2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

KIT COMPOSED OF TRIAC AND CONTROLLER

Configuration:

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

5 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

500 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

AVS08CB/F2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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