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ACST6-7ST

STMicroelectronics

ACST6-7ST by STMicroelectronics

ACST6-7ST by STMicroelectronics is a snubberless TRIAC ideal for controlling AC loads. It features a max RMS on-state current of 6A, repetitive peak off-state voltage of 700V, and operates b/w -30 °C to 125°C. Perfect for efficient power management in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Lantek

USA . 8,476 parts In-Stock

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8,476

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Vyrian

USA . 4,616 parts In-Stock

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4,616

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Anansix

USA . 2,863 parts In-Stock

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2,863

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Digiode

USA . 2,400 parts In-Stock

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2,400

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Corel Iberica Componentes, S.L.

Spain . 2,034 parts In-Stock

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2,034

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ComSIT Distribution GmbH

Germany . 700 parts In-Stock

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700

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

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$2.564

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-

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$2.308

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2,107

$2.564

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$2.308

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MKK Technologies

India . 204 parts In-Stock

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$4.822

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204

$4.822

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DigiPath Technology Company

USA . 204 parts In-Stock

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$4.822

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204

$4.822

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AZTECH Wire

Italy . 340 parts In-Stock

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$19.740

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340

$19.740

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Component Stockers USA

USA . 373 parts In-Stock

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$99.990

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373

$99.990

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A-Z Elektronik GmbH

Germany . 7,358 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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RC Electronics

USA . 5,690 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,905 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 2,325 parts In-Stock

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Assy Fe

Spain . 2,034 parts In-Stock

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Northwest PG Solutions

USA . 1,676 parts In-Stock

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Native Components

USA . 763 parts In-Stock

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Corphita

USA . 461 parts In-Stock

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461

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Parana Technologies

USA . 164 parts In-Stock

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$3.066

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$3.066

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Overview

Unlock superior performance with the ACST6-7ST by STMicroelectronics, a snubberless TRIAC designed for seamless operation in various applications. Renowned for exceptional quality and reliability, STMicroelectronics ensures this triode delivers consistent performance even in demanding conditions, from -30 °C to 125°C. With its compact design and efficient gate triggering, experience enhanced energy savings and robust control in your electric systems, maximizing value and peace of mind. Choose ACST6-7ST—where innovation meets dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

A low gate trigger current requirement allows for easy interfacing with low-power control circuits.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it versatile for many applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, making it easier to design compact systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and reliability during soldering and use.

Maximum Leakage Current: 0.5 mA

Low leakage current ensures efficient operation with minimal energy loss, enhancing overall system performance.

No. of Terminals: 3

Having three terminals allows for straightforward connections and flexibility in circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy installation and secure mounting in various environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can perform reliably in demanding thermal conditions.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces component count and minimizes voltage spikes, allowing quieter operation.

Minimum Operating Temperature: -30 °C

Operating effectively in low-temperature conditions expands its application range, making it suitable for colder environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and contributes to long-term reliability through corrosion resistance.

Terminal Position: SINGLE

Single terminal position simplifies design and reduces the potential for assembly errors.

Maximum RMS On-state Current: 6 A

A 6 A on-state current rating makes this TRIAC capable of handling substantial loads in switching applications.

Maximum DC Gate Trigger Voltage: 1.5 V

A low gate trigger voltage supports compatibility with low-voltage control circuits, enhancing versatility.

Case Connection: MAIN TERMINAL 2

The specific case connection ensures clear and reliable connections in the circuit, facilitating efficient operation.

Repetitive Peak Off-state Voltage: 700 V

The ability to withstand up to 700 V makes this TRIAC suitable for high-voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/us

A high minimum critical rate of rise indicates robustness against rapid voltage changes, providing reliability in fast-switching environments.

Maximum Holding Current: 25 mA

A holding current of 25 mA enables stable operation in applications requiring low maintenance current for continuous conduction.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST6-7ST attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

25 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

ACST6-7ST Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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