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ACS102-5TA

STMicroelectronics

ACS102-5TA by STMicroelectronics

ACS102-5TA by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max DC gate trigger current of 5 mA, non-repetitive peak on-state current of 8 A, and operates b/w -30 °C to 125°C. Ideal for switching applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,064 parts In-Stock

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7,064

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ECAB

Sweden . 4,300 parts In-Stock

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4,300

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Digiode

USA . 2,216 parts In-Stock

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2,216

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Anansix

USA . 1,867 parts In-Stock

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1,867

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Flip Electronics

USA . 350 parts In-Stock

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350

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LittleDiode

UK . 1 parts In-Stock

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1

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

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$3.195

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-

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$2.876

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2,137

$3.195

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$2.876

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MKK Technologies

India . 1,713 parts In-Stock

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$6.008

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1,713

$6.008

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DigiPath Technology Company

USA . 1,713 parts In-Stock

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$6.008

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1,713

$6.008

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AZTECH Wire

Italy . 46 parts In-Stock

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$10.910

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46

$10.910

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Native Components

USA . 253 parts In-Stock

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$11.440

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$11.440

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Northwest PG Solutions

USA . 492 parts In-Stock

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$12.584

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$11.325

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492

$12.584

$11.325

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Component Stockers USA

USA . 479 parts In-Stock

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$99.990

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479

$99.990

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Kepictronics

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,190 parts In-Stock

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Parana Technologies

USA . 946 parts In-Stock

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$3.820

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946

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Perfect Parts

USA . 797 parts In-Stock

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Corphita

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 348 parts In-Stock

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348

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Assy Fe

Spain . 47 parts In-Stock

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Overview

Unlock the potential of your projects with the ACS102-5TA from STMicroelectronics, a leader in high-quality semiconductor solutions. This snubberless TRIAC offers superior reliability and robust performance for controlling AC loads, making it ideal for home automation, motor control, and lighting applications. With its compact design and user-friendly features, it's perfect for engineers seeking efficiency without compromise. Experience innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body offers enhanced durability and resistance to environmental stresses, making it suitable for various applications.

Maximum DC Gate Trigger Current: 5 mA

A low trigger current requirement means reduced power consumption, allowing for energy-efficient designs.

Configuration: SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

This configuration simplifies the circuit design, making it easy to integrate into existing systems.

Non Repetitive Peak On-state Current: 8 A

High peak current handling capabilities allow the TRIAC to be used in high-power applications without failure.

Package Shape: ROUND

The round shape facilitates efficient space usage in PCB designs and allows for easier component placement.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are ideal for applications requiring robustness.

Maximum On-state Current: 0.2 A

This specification enables effective control of lower power devices, enhancing the versatility of applications.

No. of Terminals: 3

The three-terminal design simplifies connections and provides flexibility in circuit configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical style is beneficial for heat dissipation and compact layouts in electronic applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding environments.

Trigger Device Type: SNUBBERLESS TRIAC

As a snubberless TRIAC, it minimizes the need for external components, reducing overall system complexity.

Minimum Operating Temperature: -30 °C

The wide temperature range allows this component to be used in a variety of climates and conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and resistance to corrosion, ensuring long-lasting connections.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for space-constrained PCB designs and enhances thermal performance.

Maximum RMS On-state Current: 0.2 A

This ensures stable and reliable operation for applications requiring consistent power delivery.

Maximum DC Gate Trigger Voltage: 0.9 V

A low gate trigger voltage enhances compatibility with low-voltage control circuits, allowing for versatile applications.

Repetitive Peak Off-state Voltage: 500 V

The high off-state voltage capability makes this TRIAC suitable for applications involving significant voltage variations.

Technical Specifications

Triode For Alternating Current (TRIAC) ACS102-5TA attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

WITH BUILT IN CLAMPING STRUCTURE AND GATE LEVEL SHIFTER DRIVER

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

.9 V

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

.2 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.2 A

Repetitive Peak Off-state Voltage:

500 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

ACS102-5TA Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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