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74VHCU04MTR

STMicroelectronics

74VHCU04MTR by STMicroelectronics

74VHCU04MTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 8 ns, operating b/w 2-5.5 V. It features six functions in a compact 14-terminal package, ideal for military applications requiring high reliability and performance. With a max temp of 125 °C, it suits harsh environments.

Median Price

$0.078

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,490 parts In-Stock

1+ parts

$0.078

100+ parts

-

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-

10k+ parts

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2,490

$0.078

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Verical

USA . 2,490 parts In-Stock

1+ parts

-

100+ parts

$0.078

1k+ parts

-

10k+ parts

-

2,490

-

$0.078

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-

Chip1Stop

Japan . 2,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,490

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 638 parts In-Stock

1+ parts

$0.074

100+ parts

-

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638

$0.074

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Vyrian

USA . 3,768 parts In-Stock

1+ parts

-

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3,768

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Anansix

USA . 1,349 parts In-Stock

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1,349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,754 parts In-Stock

1+ parts

$0.070

100+ parts

-

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-

10k+ parts

-

4,754

$0.070

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-

-

Microchip USA

USA . 115 parts In-Stock

1+ parts

$4.390

100+ parts

$4.390

1k+ parts

$4.390

10k+ parts

$4.390

115

$4.390

$4.390

$4.390

$4.390

AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$9.480

100+ parts

-

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-

882

$9.480

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-

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Native Components

USA . 475 parts In-Stock

1+ parts

$23.010

100+ parts

-

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475

$23.010

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Northwest PG Solutions

USA . 1,825 parts In-Stock

1+ parts

$25.311

100+ parts

$22.780

1k+ parts

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1,825

$25.311

$22.780

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$27.734

100+ parts

-

1k+ parts

$24.961

10k+ parts

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1,327

$27.734

-

$24.961

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MKK Technologies

India . 1,282 parts In-Stock

1+ parts

$52.153

100+ parts

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1,282

$52.153

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DigiPath Technology Company

USA . 1,282 parts In-Stock

1+ parts

$52.153

100+ parts

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1,282

$52.153

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

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100+ parts

$33.161

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1,922

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$33.161

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Overview

Unlock the power of precision with the 74VHCU04MTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for unmatched reliability and superior performance in logic applications, this CMOS hex inverter delivers rapid signal processing with low propagation delays. Ideal for automotive, industrial, and consumer electronics, its compact design ensures seamless integration while enhancing energy efficiency. Elevate your projects with a trusted partner renowned for quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay ensures fast signal processing, making this logic gate ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient space usage on PCBs and supports automated assembly processes.

No. of Functions: 6

With multiple functions integrated into a single IC, this product provides versatility and reduces component count in designs.

Package Shape: RECTANGULAR

The rectangular package shape is standard for easy mounting and integration into various electronic assemblies.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low nominal supply voltage of 3.3V enhances power efficiency and compatibility with modern low-power devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF contributes to minimized signal distortion, ensuring signal integrity in high-frequency applications.

Power Supplies (V): 2/5.5

Wide power supply range allows for flexible design options and compatibility with different circuit voltages.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for complex circuitry requirements.

Package Style (Meter): SMALL OUTLINE

Small outline packaging optimizes space efficiency, making it ideal for compact electronic designs.

Maximum I (ol): 8 Amp

High output current capability (8 Amps) enables the driving of loads effectively, ideal for powerful applications.

Propagation Delay (tpd): 13 ns

Low propagation delay enhances the speed of operation, making it suitable for fast digital circuits.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance (up to 125 °C) ensures reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

Ability to function at extremely low temperatures (-55 °C) makes this product suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances longevity and reliability of the connections, ensuring better electrical performance.

Terminal Position: DUAL

Dual terminal position allows for better routing in PCB layouts and simplifies the design process.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact footprint, further aiding in space-constrained designs.

Width: 3.9 mm

The narrow width keeps design profiles slim, maximizing layout flexibility.

Minimum Supply Voltage (Vsup): 2 V

Lower minimum supply voltage enhances compatibility with a variety of modern digital circuits.

Length: 8.65 mm

Compact length contributes to efficient usage of PCB space, making it suitable for portable devices.

Temperature Grade: MILITARY

Designed for military applications, this component meets stringent standards for reliability and performance in critical environments.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices and enhancing thermal efficiency.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improves assembly efficiency on PCBs.

Packing Method: TR

Tape and reel packing method simplifies automated assembly and handling in high-volume production.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm ensures compatibility with a wide range of PCB designs and assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for integration into a variety of electronic systems without risk of damage.

Technical Specifications

Logic Gates 74VHCU04MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHCU04MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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