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74VHCT05ATTR

STMicroelectronics

74VHCT05ATTR by STMicroelectronics

74VHCT05ATTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11.3 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and features an open-drain output. This compact, surface-mount device is suitable for military-grade environments with temperatures ranging from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,888 parts In-Stock

1+ parts

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5,888

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Anansix

USA . 2,429 parts In-Stock

1+ parts

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2,429

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Digiode

USA . 1,804 parts In-Stock

1+ parts

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1,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$12.445

100+ parts

-

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-

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172

$12.445

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Microchip USA

USA . 223 parts In-Stock

1+ parts

$17.266

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-

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223

$17.266

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IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$18.762

100+ parts

-

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$16.886

10k+ parts

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1,608

$18.762

-

$16.886

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AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$19.860

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413

$19.860

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$35.185

100+ parts

$32.018

1k+ parts

$28.852

10k+ parts

-

500

$35.185

$32.018

$28.852

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MKK Technologies

India . 89 parts In-Stock

1+ parts

$35.282

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89

$35.282

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DigiPath Technology Company

USA . 89 parts In-Stock

1+ parts

$35.282

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89

$35.282

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Component Stockers USA

USA . 710 parts In-Stock

1+ parts

$99.990

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710

$99.990

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Native Components

USA . 47 parts In-Stock

1+ parts

$255.160

100+ parts

$250.057

1k+ parts

$247.505

10k+ parts

$244.954

47

$255.160

$250.057

$247.505

$244.954

Northwest PG Solutions

USA . 1,818 parts In-Stock

1+ parts

$280.676

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1,818

$280.676

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 3,542 parts In-Stock

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3,542

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Parana Technologies

USA . 1,519 parts In-Stock

1+ parts

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$22.433

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1,519

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$22.433

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Overview

Unlock the potential of your designs with the 74VHCT05ATTR from STMicroelectronics, a trusted name in high-quality logic gates. This advanced device ensures fast, reliable performance in diverse applications, from automotive to industrial electronics. With its compact, surface-mount packaging and military-grade durability, you gain impressive efficiency without compromising on reliability. Elevate your projects and enjoy peace of mind with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various operating conditions.

Propagation Delay At Nominal Supply: 11.3 ns

Fast propagation delay enhances the overall speed of digital circuits, making the product suitable for high-frequency applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, optimizing space on electronic boards.

No. of Functions: 6

Multiple functions in a single package reduce the need for additional components, facilitating streamlined circuit design.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, ensuring compatibility with various PCB designs.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage compatibility allows for easy integration into existing systems.

Load Capacitance (CL): 50 pF

A lower load capacitance leads to faster switching times, improving circuit responsiveness.

Power Supplies (V): 5

Uniform power supply requirement simplifies the design and reduces potential for power issues.

No. of Terminals: 14

Adequate number of terminals allowing versatile connections without crowding the PCB layout.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile minimizes space usage and meets modern compact electronic design requirements.

Maximum I (ol): 8 Amp

High output current capability ensures the product can drive loads effectively without issues.

Propagation Delay (tpd): 11.3 ns

Consistent propagation delay figures contribute to predictable performance in time-sensitive applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes it suitable for harsh environments and ensures reliability.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for flexible interfacing with various voltage levels and simplifies wiring in certain designs.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures enhances reliability in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options and ease of PCB layout adjustments.

Maximum Seated Height: 1.2 mm

Low profile aids in space-constrained designs, beneficial for compact electronic assemblies.

Width: 4.4 mm

Narrow width fits well in space-limited applications while providing effective performance.

Minimum Supply Voltage (Vsup): 4.5 V

Lower supply voltage ensures compatibility with a range of power supplies, improving design flexibility.

Length: 5 mm

Compact length helps in achieving smaller PCB footprints, aligning with modern electronic design trends.

Temperature Grade: MILITARY

Military-grade specifications guarantee robustness and reliability for critical applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals aid in automated assembly processes, enhancing production efficiency.

Packing Method: TR

Tape and reel packing facilitates automated handling and smooth integration into high-speed production lines.

Terminal Pitch: 0.65 mm

Standard terminal pitch supports high-density PCB designs, offering flexibility in layout choices.

Maximum Supply Voltage (Vsup): 5.5 V

Ability to support a range of supply voltages enhances versatility for various application requirements.

Technical Specifications

Logic Gates 74VHCT05ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.3 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHCT05ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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