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74VHCT02AMTR

STMicroelectronics

74VHCT02AMTR by STMicroelectronics

74VHCT02AMTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9 ns, operating b/w 4.5V and 5.5V. It features four functions with dual inputs and is ideal for high-speed applications in military environments. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,934 parts In-Stock

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Zilex Electronics Inc.

Canada . 5,000 parts In-Stock

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Digiode

USA . 3,222 parts In-Stock

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Anansix

USA . 948 parts In-Stock

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Microchip USA

USA . 118 parts In-Stock

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$5.138

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118

$5.138

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AZTECH Wire

Italy . 843 parts In-Stock

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$8.360

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843

$8.360

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$23.902

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$21.511

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Native Components

USA . 76 parts In-Stock

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$41.706

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$40.038

76

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$40.038

MKK Technologies

India . 553 parts In-Stock

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$44.945

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DigiPath Technology Company

USA . 553 parts In-Stock

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$44.945

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$44.945

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Northwest PG Solutions

USA . 1,406 parts In-Stock

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$45.877

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$45.877

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Corphita

USA . 2,787 parts In-Stock

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Parana Technologies

USA . 2,043 parts In-Stock

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$28.578

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Overview

Elevate your designs with the 74VHCT02AMTR from STMicroelectronics, a trusted leader in the semiconductor industry. This high-quality dual-input logic gate ensures rapid performance and exceptional reliability, making it ideal for automotive, industrial, and consumer applications. With its compact surface-mount design and military-grade temperature tolerance, enhance your circuits while enjoying low power consumption and minimal propagation delay—perfect for projects that demand efficiency without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

With a propagation delay of just 9 ns, this product offers fast switching times, enhancing overall circuit performance.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, saving space on PCBs.

No. of Functions: 4

Supports multiple logic functions, making it versatile and cost-effective for various applications.

No. of Inputs: 2

Featuring two inputs enables the product to handle simple binary logic operations efficiently.

Package Shape: RECTANGULAR

The rectangular shape allows for optimized PCB layout and efficient use of space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard digital logic levels.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures reliable performance in various electronic circuits.

Power Supplies (V): 5

Standard power supply requirement simplifies the design process and reduces component count.

No. of Terminals: 14

Having 14 terminals allows for numerous connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact designs that are increasingly important in modern electronics.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amp, it can drive significant loads, suitable for power applications.

Propagation Delay (tpd): 9 ns

Reiterating a low propagation delay enhances timing accuracy for high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -55 °C

The wide temperature range allows for operation in extreme conditions, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and high reliability in terms of electrical connections.

Terminal Position: DUAL

Dual terminal positions enhance layout options on the PCB, allowing for efficient routing.

Maximum Seated Height: 1.75 mm

A low seated height contributes to space-saving designs, perfect for compact electronic devices.

Width: 3.9 mm

A narrow width allows for higher-density layouts on PCBs, maximizing design efficiency.

Minimum Supply Voltage (Vsup): 4.5 V

Operating down to 4.5 V allows for flexibility in available power supplies.

Length: 8.65 mm

A short length aids in compact circuit designs, reducing overall board size.

Temperature Grade: MILITARY

MILITARY grade certification guarantees high durability and reliability under extreme conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals make for easier soldering and provide reliable mechanical stability.

Packing Method: TR

Tape and reel packing ensures efficient handling and automatic assembly, streamlining the manufacturing process.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with many PCB designs and simplifies layout planning.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a buffer for variations in power supply, ensuring stable operation.

Technical Specifications

Logic Gates 74VHCT02AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHCT02AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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