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74VHC20MTR

STMicroelectronics

74VHC20MTR by STMicroelectronics

74VHC20MTR by STMicroelectronics is a dual 4-input CMOS logic gate with an 8 ns propagation delay, ideal for high-speed applications. It operates at a supply voltage of 2-5.5 V and features a compact SOIC package. With a max temp of 125 °C, it's suitable for military-grade use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,922 parts In-Stock

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Digiode

USA . 2,734 parts In-Stock

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Anansix

USA . 1,390 parts In-Stock

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Bristol Electronics

USA . 100 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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$0.368

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260

$0.368

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AZTECH Wire

Italy . 474 parts In-Stock

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$15.730

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474

$15.730

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IDEA Electronic Components Group

UK . 1,116 parts In-Stock

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$23.851

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$21.466

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$23.851

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MKK Technologies

India . 579 parts In-Stock

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$44.850

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579

$44.850

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DigiPath Technology Company

USA . 579 parts In-Stock

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$44.850

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$44.850

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Corphita

USA . 4,894 parts In-Stock

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Northwest PG Solutions

USA . 1,718 parts In-Stock

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Parana Technologies

USA . 1,655 parts In-Stock

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$28.518

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Native Components

USA . 715 parts In-Stock

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Overview

Elevate your designs with the 74VHC20MTR from STMicroelectronics—a reliable logic gate that combines exceptional performance and versatility. With a lightning-fast propagation delay of just 8 ns, this compact device ensures your applications run smoothly and efficiently. Renowned for their quality and innovation, STMicroelectronics delivers unmatched reliability, making it ideal for automotive, industrial, and consumer electronics. Experience the power of precision with 74VHC20MTR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and cost-effectiveness, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay enables faster switching speeds, improving overall circuit performance.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly processes.

No. of Functions: 2

Multiple functions in a single package reduce board space and component count, enhancing design efficiency.

No. of Inputs: 4

Four inputs provide flexibility in designing more complex logic circuits without needing additional components.

Package Shape: RECTANGULAR

The rectangular package shape aids in better board layout and organization of components.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V ensures compatibility with most modern digital circuits.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for efficient power usage and reduces signal degradation.

Power Supplies (V): 2/5.5

Support for a range of supply voltages (2 to 5.5V) increases versatility in various electronic environments.

No. of Terminals: 14

14 terminals provide ample connection options for integrating the chip into complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on a PCB, suitable for compact electronic designs.

Maximum I (ol): 8 Amp

A high output current capability (up to 8 A) allows this logic gate to drive significant loads.

Propagation Delay (tpd): 11.5 ns

This acceptable propagation delay can still be beneficial for applications where timing is less critical.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in challenging environments.

Minimum Operating Temperature: -55 °C

Operation at low temperatures makes this product ideal for applications in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions support flexible PCB routing and reduce impedance mismatches.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for designs requiring low-profile components.

Width: 3.9 mm

The compact width allows it to fit easily into space-constrained designs.

Minimum Supply Voltage (Vsup): 2 V

Lower minimum supply voltage enhances compatibility with battery-operated or low-power devices.

Length: 8.65 mm

Short length aids in saving space and enables dense circuit design.

Temperature Grade: MILITARY

Military-grade specifications guarantee resilience and reliability in demanding applications.

Technology: CMOS

CMOS technology offers high noise immunity and low power consumption, making it efficient for modern circuits.

Terminal Form: GULL WING

Gull wing terminals simplify PCB assembly and improve mechanical stability.

Packing Method: TR

Tape and reel packing promotes efficient handling and automatic feeding during assembly.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates easy integration with existing PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The flexibility in maximum supply voltage allows compatibility with a wide range of systems and applications.

Technical Specifications

Logic Gates 74VHC20MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHC20MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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