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74VHC16245TTR

STMicroelectronics

74VHC16245TTR by STMicroelectronics

74VHC16245TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.5 ns, operating at a nominal voltage of 3.3 V. It features dual ports and supports bidirectional data flow, ideal for high-speed communication in compact designs. Its military-grade specs ensure reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,737 parts In-Stock

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8,737

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Digiode

USA . 3,959 parts In-Stock

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3,959

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Anansix

USA . 1,668 parts In-Stock

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1,668

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Prism Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,210 parts In-Stock

1+ parts

$5.278

100+ parts

-

1k+ parts

$5.067

10k+ parts

$5.067

2,210

$5.278

-

$5.067

$5.067

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$12.980

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792

$12.980

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Microchip USA

USA . 404 parts In-Stock

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$25.184

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404

$25.184

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$26.702

100+ parts

-

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$24.032

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-

167

$26.702

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$24.032

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MKK Technologies

India . 1,757 parts In-Stock

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$50.212

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1,757

$50.212

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DigiPath Technology Company

USA . 1,757 parts In-Stock

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$50.212

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1,757

$50.212

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Corphita

USA . 1,541 parts In-Stock

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1,541

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Native Components

USA . 777 parts In-Stock

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777

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Parana Technologies

USA . 756 parts In-Stock

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$31.926

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756

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$31.926

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Northwest PG Solutions

USA . 718 parts In-Stock

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718

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Perfect Parts

USA . 22 parts In-Stock

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Overview

Elevate your design with the 74VHC16245TTR from STMicroelectronics, a premier choice for reliable bus driving and transceiving. Crafted with precision, this robust component ensures exceptional performance in demanding environments while maintaining low propagation delays. STMicroelectronics’ commitment to quality means you can trust its durability and efficiency, making it ideal for applications in automotive, industrial, and consumer electronics. Experience the advantage of seamless data transfer and enhanced system reliability—choose 74VHC16245TTR for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and suitable for various environments.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this product enables faster data transmission, enhancing overall system performance.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact electronic designs.

No. of Functions: 2

Having multiple functions provides versatility, making this product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on circuit boards, facilitating more efficient layouts.

No. of Bits: 8

An 8-bit architecture is ideal for a range of applications, providing a balance of data handling capacity.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage aligns well with modern low-power electronic standards.

Power Supplies (V): 2/5.5

Support for wide power supply ranges ensures compatibility with different system requirements.

No. of Terminals: 48

A greater number of terminals allows for more connections and functionalities in complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design enhance space efficiency, critical for modern electronic devices.

Maximum I (ol): 8 Amp

An 8 Amp output limit provides significant current handling capability for demanding applications.

Propagation Delay (tpd): 13.5 ns

A propagation delay of 13.5 ns ensures reliable and timely signal processing crucial in high-speed circuits.

Maximum Operating Temperature: 125 °C

Rated for high temperatures, it is suitable for operation in harsh environments.

Output Characteristics: 3-STATE

3-state output capability enhances flexibility in connections, allowing for easier bus management.

Minimum Operating Temperature: -55 °C

The wide temperature range from -55 °C to 125 °C ensures reliability in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent corrosion resistance, enhancing longevity.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and component placement.

No. of Ports: 2

Having two ports allows the chip to manage multiple communication channels, increasing its utility.

Maximum Seated Height: 1.2 mm

A low seated height supports compact design requirements, ideal for space-constrained applications.

Width: 6.1 mm

The compact width makes it suitable for high-density PCB designs without sacrificing performance.

Output Polarity: TRUE

True output polarity can simplify design considerations in specific circuit configurations.

Minimum Supply Voltage (Vsup): 2 V

The minimal supply voltage requirement ensures flexibility in system design and power management.

Length: 12.5 mm

The moderate length is advantageous for avoiding complex routing issues while fitting into tight spaces.

Temperature Grade: MILITARY

The military grade rating guarantees high reliability and performance under demanding conditions.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal design enhances the soldering process, ensuring strong connections on PCBs.

Packing Method: TR

Tape and reel packing facilitates easy handling and automated assembly processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for closer component placement, optimizing board layouts.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances the versatility of the device in various data processing applications.

Control Type: COMMON CONTROL

Common control ensures synchrony in operation, which is beneficial in multi-device setups.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum supply voltage of 5.5V allows for compatibility with various power sources.

Technical Specifications

Bus Driver & Transceivers 74VHC16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VHC16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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