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74VHC125MTCX

Onsemi

74VHC125MTCX by Onsemi

74VHC125MTCX by Onsemi is a bus driver & transceiver with 4 functions. It has a propagation delay of 8.5 ns and operates at a nominal voltage of 3.3V. This component is commonly used in industrial applications due to its small size and high performance capabilities.

Median Price

$0.243

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 732 parts In-Stock

1+ parts

$0.252

100+ parts

$0.197

1k+ parts

$0.191

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732

$0.252

$0.197

$0.191

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DigiKey

USA . 2,111 parts In-Stock

1+ parts

$0.330

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$0.172

1k+ parts

$0.145

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$0.134

2,111

$0.330

$0.172

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$0.134

Mouser Electronics

USA . 604 parts In-Stock

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$0.330

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$0.173

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$0.152

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604

$0.330

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Newark

USA . 2,294 parts In-Stock

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$0.340

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$0.177

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$0.148

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Rochester

USA . 78,930 parts In-Stock

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$0.159

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$0.132

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$0.117

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Verical

USA . 48,622 parts In-Stock

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Master Electronics

USA . 7,500 parts In-Stock

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Chip1Stop

Japan . 3,895 parts In-Stock

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$0.206

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Avnet

USA . 2,500 parts In-Stock

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Farnell

UK . 2,494 parts In-Stock

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Element14

Singapore . 2,494 parts In-Stock

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$0.243

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RS (Exports)

UK . 700 parts In-Stock

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$0.275

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700

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$0.269

$0.254

Distributors (In-Stock)

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Freelance Electronics

USA . 500 parts In-Stock

1+ parts

$0.083

100+ parts

$0.087

1k+ parts

$0.082

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500

$0.083

$0.087

$0.082

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Digiode

USA . 713 parts In-Stock

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$0.124

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DF Sales Co.

USA . 172 parts In-Stock

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DF Sales Co.

USA . 172 parts In-Stock

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Nova Conductors

Japan . 20 parts In-Stock

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$0.232

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Bristol Electronics

USA . 19,377 parts In-Stock

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$0.412

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$0.165

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$0.116

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19,377

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$0.165

$0.116

$0.107

DigiKey Marketplace

USA . 77,312 parts In-Stock

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Vyrian

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Dan-Mar Components

USA . 11,937 parts In-Stock

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Component Sense

UK . 8,075 parts In-Stock

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IBS Electronics

USA . 7,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 7,288 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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VNN

France . 4,571 parts In-Stock

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Sea View Technologies

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ACDS - Activité Composants Distribution Service

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Flip Electronics

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Greenchips

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Anansix

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Sensible Micro Corp

USA . 2,162 parts In-Stock

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Prism Electronics

USA . 2,022 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,622 parts In-Stock

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PC Components Company LLC

USA . 54 parts In-Stock

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A2Z Electronics, Inc.

USA . 50 parts In-Stock

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LWI Electronics Inc

India . 46 parts In-Stock

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Speed Components Ltd

Israel . 4 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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$0.083

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443

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Semicontronic

India . 21,955 parts In-Stock

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$0.111

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$0.108

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$0.108

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Ampacity Inc.

Singapore . 17,639 parts In-Stock

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$0.111

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Corphita

USA . 1,616 parts In-Stock

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Component Stockers USA

USA . 53,883 parts In-Stock

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$0.200

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$0.140

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$0.130

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$0.140

53,883

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$0.140

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$0.140

Argo Parts USA

USA . 2,761 parts In-Stock

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$0.232

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$0.225

2,761

$0.232

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$0.225

Aztec Data Supply Inc.

USA . 43,995 parts In-Stock

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$16.454

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Metaverse IC Inc.

Canada . 246,000 parts In-Stock

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Continental Prestige Electronics

USA . 78,930 parts In-Stock

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Perfect Parts

USA . 53,897 parts In-Stock

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XScomponents

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,912 parts In-Stock

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Formix International (Excess)

India . 10,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 7,477 parts In-Stock

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Kulean Microsystems

USA . 7,337 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,639 parts In-Stock

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Lixinc

USA . 4,523 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,125 parts In-Stock

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TANS Electronics

Latvia . 4,007 parts In-Stock

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SupplyDigital Components

Austria . 3,052 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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Computer Components Inc. - USA

USA . 2,086 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,549 parts In-Stock

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1,549

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Allen Electronics Distributors

USA . 1,100 parts In-Stock

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$0.221

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$0.190

1,100

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$0.221

$0.190

Supply Digital

USA . 901 parts In-Stock

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901

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Netroflash

USA . 500 parts In-Stock

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$0.227

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$0.220

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$0.216

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$0.227

$0.220

$0.216

UHIMA Technologies

Türkiye . 237 parts In-Stock

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Overview

Experience the ultimate in quality and performance with the 74VHC125MTCX from Onsemi. As a leading manufacturer in the industry, Onsemi is known for delivering top-notch products that exceed customer expectations. In the category of Bus Driver & Transceivers, this product stands out with its impressive features and capabilities. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, it is designed to perform flawlessly even in demanding conditions. Whether you're looking to enhance your communication systems or improve data transmission, the 74VHC125MTCX offers unparalleled reliability and efficiency. Its compact design and surface mount feature make it easy to integrate into any project. Don't settle for less when you can have the best. Choose Onsemi's 74VHC125MTCX and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and resistance to harsh environmental conditions, making this product suitable for demanding applications.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this product ensures fast and efficient bus driver and transceiver operations, leading to improved data transmission speeds.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation, making this product convenient for use in compact and densely populated circuit boards.

No. of Functions: 4

With four functions integrated into a single component, this product offers cost savings and space efficiency, reducing the need for multiple discrete components.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration and placement within electronic systems, ensuring compatibility with standard board layouts.

No. of Bits: 1

This product supports single-bit data transmission, making it suitable for applications requiring simple and efficient communication protocols.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage offers compatibility with a wide range of systems, providing flexibility and ensuring reliable performance under different operating conditions.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can drive capacitive loads efficiently, ensuring reliable and accurate data transmission over longer bus lines.

Power Supplies (V): 2/5.5

The wide power supply range of 2V to 5.5V allows for compatibility with a variety of systems, enhancing flexibility and ease of integration.

No. of Terminals: 14

The 14 terminals provide ample connectivity options, facilitating easy connection to other components and ensuring seamless integration within the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving advantages, making this product suitable for applications with limited board space.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amps, this product can drive high loads effectively, ensuring stable and reliable signal transmission in demanding scenarios.

Propagation Delay (tpd): 13 ns

The 13 ns propagation delay ensures fast and efficient signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

This product can operate reliably at temperatures up to 85°C, making it suitable for use in harsh industrial environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for high impedance when not actively transmitting, preventing bus contention and ensuring smooth and efficient data communication.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions, making it suitable for various environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the longevity and performance of the product.

Terminal Position: DUAL

The dual terminal position allows for flexible board mounting options, facilitating seamless integration within the system's circuitry.

No. of Ports: 2

With two ports, this product offers dual-channel functionality, allowing for simultaneous multi-directional data transfer, improving system throughput.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures compatibility with low-profile applications, contributing to space-saving designs and improved airflow within electronic systems.

Width: 4.4 mm

The compact width of 4.4 mm provides space efficiency, enabling the product to be utilized in size-constrained designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, reducing the risk of errors and enhancing compatibility with other components and systems.

Minimum Supply Voltage (Vsup): 2 V

This product can operate reliably at a low supply voltage of 2V, allowing for energy-efficient designs and extended battery life in portable applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures secure and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees effective solder joint formation, ensuring the reliability and mechanical strength of the product.

Length: 5 mm

The compact length of 5 mm provides versatility and compatibility with various board sizes, making this product suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand and operate reliably under demanding temperature conditions, ensuring robust performance.

Technology: CMOS

The CMOS technology employed in this product offers low power consumption, high noise immunity, and wide operating voltage range, making it an excellent choice for energy-efficient and reliable applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering, ensuring reliable electrical connections and reducing the risk of potential signal degradation.

Packing Method: TR

This product comes in tape and reel (TR) packaging, providing ease of handling, transportation, and compatibility with automated assembly processes.

Terminal Pitch: 0.65 mm

With a compact terminal pitch of 0.65 mm, this product supports high-density board designs, maximizing functionality in space-constrained applications.

Control Type: ENABLE LOW

The enable low control type allows for easy and straightforward system integration, providing a convenient interface for activating the bus driver and transceiver functions.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product has minimal susceptibility to moisture-related issues during storage and assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for compatibility with various power sources, offering flexibility and broadening the range of potential applications.

Technical Specifications

Bus Driver & Transceivers 74VHC125MTCX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC125MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-519-2617, 5962015192617

NIIN

015192617

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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