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74VHC14MTR

STMicroelectronics

74VHC14MTR by STMicroelectronics

74VHC14MTR by STMicroelectronics is a CMOS Schmitt Trigger with a propagation delay of 12 ns and operates b/w 2-5.5 V. It features 6 functions in a compact SOIC package, ideal for high-speed logic applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,420 parts In-Stock

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R&J Components

USA . 5,000 parts In-Stock

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,478 parts In-Stock

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Dan-Mar Components

USA . 2,478 parts In-Stock

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Inventory MP

USA . 1,963 parts In-Stock

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Anansix

USA . 1,422 parts In-Stock

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Digiode

USA . 1,088 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 636 parts In-Stock

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$10.870

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636

$10.870

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Native Components

USA . 933 parts In-Stock

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$13.109

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933

$13.109

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Northwest PG Solutions

USA . 1,218 parts In-Stock

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$14.420

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$12.978

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$14.420

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IDEA Electronic Components Group

UK . 2,331 parts In-Stock

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$20.049

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$18.044

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MKK Technologies

India . 1,034 parts In-Stock

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$37.700

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$37.700

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QUARKTWIN TECHNOLOGY LTD

USA . 23,061 parts In-Stock

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Lixinc

USA . 13,191 parts In-Stock

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Microchip USA

USA . 7,133 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 3,727 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 250 parts In-Stock

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$23.971

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Perfect Parts

USA . 64 parts In-Stock

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Overview

Elevate your designs with the 74VHC14MTR from STMicroelectronics, a top-tier logic gate solution that combines unmatched quality with enduring reliability. Perfect for a variety of applications, from consumer electronics to automotive systems, this versatile component ensures rapid signal processing and superior performance. With ST’s renowned commitment to innovation, experience enhanced efficiency and peace of mind knowing you're backed by a leader in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 12 ns

A low propagation delay indicates faster switching times, enhancing the performance of digital circuits.

Surface Mount: YES

Surface mount capability allows for compact design and ease of integration into modern electronic systems.

No. of Functions: 6

Having multiple functions in a single package provides versatility and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement on PCBs, optimizing layout and space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this product compatible with low-power applications, enhancing energy efficiency.

Load Capacitance (CL): 50 pF

A moderate load capacitance contributes to stable operation and minimizes signal distortion in high-speed applications.

Power Supplies (V): 2/5.5

The flexible power supply range increases the product's adaptability across various applications and systems.

No. of Terminals: 14

Having 14 terminals offers multiple connections, enabling complex circuit designs and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it suitable for compact electronic devices.

Maximum I (ol): 8 Amp

The ability to handle a maximum output current of 8 Amp allows for robust performance in high-power applications.

Propagation Delay (tpd): 18.5 ns

The propagation delay of 18.5 ns allows for high-speed operation, which is critical in many digital and communication applications.

Maximum Operating Temperature: 125 °C

This product can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this device is ideal for use in extreme environments, ensuring reliability under various conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances conductivity and prevents corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for better routing options on PCBs, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial for space-constrained applications and allows for compact design.

Width: 3.9 mm

The compact width aids in fitting the component into dense layouts, crucial for modern electronics.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage supports battery-operated and energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 40

This specification allows for compatibility with various soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature supports lead-free soldering processes, adhering to modern manufacturing standards.

Length: 8.65 mm

The manageable length contributes to an overall compact design, which is essential for modern efficient PCB layouts.

Temperature Grade: MILITARY

The military-grade temperature classification ensures suitability for demanding environments, reinforcing product reliability.

Schmitt Trigger: YES

Incorporating a Schmitt Trigger feature enhances signal integrity, making it ideal for noisy environments.

Technology: CMOS

The CMOS technology offers high noise immunity and low static power consumption, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable solder joints, enhancing assembly durability.

Packing Method: TR

The tape and reel packing method allows for easy handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm aids in compatibility with a wide range of PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for flexibility in versatile power supply configurations.

Technical Specifications

Logic Gates 74VHC14MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHC14MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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