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74VHC139MTR

STMicroelectronics

74VHC139MTR by STMicroelectronics

74VHC139MTR from STMicroelectronics is a CMOS dual decoder/driver with a propagation delay of 10.5 ns and operates at a supply voltage range of 2-5.5 V. It features a compact SO package, ideal for space-constrained applications. With a max load current of 8 A, it's perfect for driving high-performance circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,626 parts In-Stock

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4,626

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Tectiva GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT Distribution GmbH

Germany . 1,927 parts In-Stock

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1,927

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Anansix

USA . 939 parts In-Stock

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939

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Digiode

USA . 434 parts In-Stock

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434

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Distributors (Availability)

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Microchip USA

USA . 128 parts In-Stock

1+ parts

$0.394

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-

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128

$0.394

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

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$15.910

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-

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$14.319

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1,433

$15.910

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$14.319

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AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$20.030

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275

$20.030

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MKK Technologies

India . 261 parts In-Stock

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$29.919

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261

$29.919

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DigiPath Technology Company

USA . 261 parts In-Stock

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$29.919

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261

$29.919

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Native Components

USA . 228 parts In-Stock

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$65.430

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$62.813

228

$65.430

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$62.813

Northwest PG Solutions

USA . 148 parts In-Stock

1+ parts

$71.973

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148

$71.973

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Component Stockers USA

USA . 563 parts In-Stock

1+ parts

$99.990

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563

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,675 parts In-Stock

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9,675

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Corphita

USA . 3,348 parts In-Stock

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3,348

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Kepictronics

USA . 2,350 parts In-Stock

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2,350

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Parana Technologies

USA . 2,134 parts In-Stock

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$19.023

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2,134

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$19.023

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Overview

Unlock the potential of your designs with the 74VHC139MTR from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance CMOS decoder delivers rapid operation and reliability, perfect for applications ranging from data routing to signal processing. With its compact surface mount package and robust quality, it ensures seamless integration into your projects while maximizing efficiency and performance. Experience enhanced functionality with every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides protection from environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

With a low propagation delay, this decoder/driver offers fast switching speeds, essential for high-speed electronic applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern compact circuit designs and enhances production efficiency.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile in various applications.

No. of Functions: 2

Having multiple functions in a single device maximizes utility and minimizes board space, beneficial for complex designs.

Package Shape: RECTANGULAR

The rectangular package shape promotes efficient layout and design flexibility on PCBs, allowing for optimized space usage.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in low-power applications, making it suitable for energy-efficient designs.

Load Capacitance (CL): 50 pF

A lower load capacitance minimizes power consumption and improves signal integrity, making it suitable for high-frequency applications.

Power Supplies (V): 2/5.5

The wide range of power supply voltages (2 to 5.5V) adds flexibility in system design and allows adaptation to various power requirements.

No. of Terminals: 16

Having 16 terminals provides ample connections for inputs and outputs, enhancing overall functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact circuit designs and saves board space, making it suitable for space-constrained applications.

Maximum I (ol): 8 Amp

With a high output current capacity of 8 Amps, this device can drive substantial loads, making it appropriate for demanding applications.

Propagation Delay (tpd): 16.5 ns

A propagation delay of 16.5 ns still ensures prompt operation, making this device capable for various timing-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliability in extreme environments, suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

The capability to operate at temperatures as low as -55 °C ensures functionality in harsh cold environments, vital for aerospace and military uses.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish not only enhances corrosion resistance but also ensures reliable electrical contact over time.

Terminal Position: DUAL

Dual terminal positioning allows for more versatile PCB design, enabling better spatial distribution of components.

Maximum Seated Height: 1.75 mm

The low seated height allows for cleaner and more compact board designs, promoting improved airflow and thermal management.

Width: 3.9 mm

The compact width promotes space-efficient PCB design, making it ideal for small electronic devices.

Output Polarity: INVERTED

Inverted output polarity can simplify circuit designs in certain configurations, providing flexibility in implementation.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V enhances compatibility with low-voltage applications, ensuring optimal performance in varied scenarios.

Length: 9.9 mm

The compact length facilitates the integration of the device into tight spaces, making it ideal for portable and compact electronic devices.

Temperature Grade: MILITARY

The military-grade temperature tolerance indicates high reliability and robustness, suitable for critical electronic applications.

Technology: CMOS

CMOS technology provides low static power consumption and high noise immunity, making it an excellent choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and improve mounting stability, ensuring reliable connections on PCBs.

Packing Method: TR

Tape and reel packaging allows for automated assembly processes, enhancing manufacturing efficiency and reducing production costs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm aids in precise placement and alignment, improving manufacturability and assembly accuracy.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this device is compatible with a wide range of typical electronic systems, offering design flexibility.

Technical Specifications

Decoder & Drivers 74VHC139MTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74VHC139MTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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