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74VHC138TTR

STMicroelectronics

74VHC138TTR by STMicroelectronics

74VHC138TTR from STMicroelectronics is a CMOS decoder/driver with a fast propagation delay of 11.5 ns and operates at supply voltages b/w 2-5.5 V. It features a compact SOIC package, ideal for space-constrained applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 4,272 parts In-Stock

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Bristol Electronics

USA . 2,610 parts In-Stock

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2,610

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Dan-Mar Components

USA . 2,610 parts In-Stock

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2,610

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ACDS - Activité Composants Distribution Service

France . 2,069 parts In-Stock

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2,069

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Martec Srl

Italy . 1,375 parts In-Stock

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1,375

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Digiode

USA . 729 parts In-Stock

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729

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Anansix

USA . 640 parts In-Stock

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640

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Cogito LLC

Ukraine . 95 parts In-Stock

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95

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Distributors (Availability)

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Microchip USA

USA . 405 parts In-Stock

1+ parts

$1.618

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405

$1.618

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AZTECH Wire

Italy . 780 parts In-Stock

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$15.130

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780

$15.130

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IDEA Electronic Components Group

UK . 136 parts In-Stock

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$21.683

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$19.514

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136

$21.683

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$19.514

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MKK Technologies

India . 1,495 parts In-Stock

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$40.773

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1,495

$40.773

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DigiPath Technology Company

USA . 1,495 parts In-Stock

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$40.773

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$40.773

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Component Stockers USA

USA . 797 parts In-Stock

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$99.990

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Perfect Parts

USA . 2,802 parts In-Stock

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GreenTree Electronics

Israel . 2,379 parts In-Stock

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Corphita

USA . 1,889 parts In-Stock

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Northwest PG Solutions

USA . 999 parts In-Stock

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999

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Parana Technologies

USA . 846 parts In-Stock

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$25.925

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Native Components

USA . 830 parts In-Stock

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Assy Fe

Spain . 792 parts In-Stock

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Overview

Unlock the potential of your designs with the 74VHC138TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance decoder delivers lightning-fast response times and exceptional reliability, making it ideal for a plethora of applications—from industrial automation to consumer electronics. With its compact design and robust operational capabilities, elevate your projects while enjoying peace of mind that comes from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 11.5 ns

The low propagation delay ensures fast signal processing, which is essential for high-performance applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and facilitates automated assembly.

Input Conditioning: STANDARD

Standard input conditioning simplifies integration with other components, enhancing compatibility.

Package Shape: RECTANGULAR

A rectangular shape optimizes layout flexibility on PCB, making it easier to design compact circuits.

Nominal Supply Voltage / Vsup (V): 3.3

Working at a nominal supply of 3.3V is ideal for modern low-power digital applications.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for reliable performance in typical signal processing scenarios.

Power Supplies (V): 2/5.5

Dual power supply capability adds flexibility to the design, accommodating a variety of power sources.

No. of Terminals: 16

With 16 terminals, this product supports a wide range of connections, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact packaging style is perfect for tight spaces, promoting space-efficient design.

Maximum I (ol): 8 Amp

A high output current capability of 8A makes this product suitable for driving larger loads.

Propagation Delay (tpd): 18 ns

Propagation delay of 18 ns ensures minimal latency in signal transmission, enhancing performance.

Maximum Operating Temperature: 125 °C

This high thermal endurance allows for reliable operation in demanding environments.

Minimum Operating Temperature: -55 °C

The capability to operate at very low temperatures expands the range of applications for this product.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures excellent corrosion resistance and reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances the electrical performance and reliability of the connections.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact PCB designs, accommodating space-constrained applications.

Width: 4.4 mm

A narrow width helps in designing multi-functional boards with limited real estate.

Output Polarity: INVERTED

Inverted output polarity can be advantageous in specific digital logic applications where signal inversion is needed.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2V provides flexibility for battery-powered devices and low-voltage systems.

Length: 5 mm

A short length contributes to a compact profile, ideal for high-density assemblies.

Temperature Grade: MILITARY

Military grade ensures high reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this product energy-efficient and fast.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and enhance the structural integrity of the connections.

Packing Method: TR

Tape and reel packing supports automated manufacturing processes, improving assembly efficiency.

Terminal Pitch: 0.65 mm

A tighter terminal pitch allows for a higher density of components on the PCB, essential for miniaturized electronics.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle up to 5.5V allows for a broader range of applications, including many logic circuits.

Technical Specifications

Decoder & Drivers 74VHC138TTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC138TTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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