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74VHC132TTR

STMicroelectronics

74VHC132TTR by STMicroelectronics

74VHC132TTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of 11 ns and operates at a supply voltage of 3.3 V. It features four functions, two inputs, and is ideal for high-speed applications in compact designs. Its military-grade specs ensure reliability in extreme temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,582 parts In-Stock

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7,582

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Pegasus Components GmbH

Germany . 6,400 parts In-Stock

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6,400

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Digiode

USA . 3,485 parts In-Stock

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Anansix

USA . 1,808 parts In-Stock

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Microchip USA

USA . 489 parts In-Stock

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$0.259

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489

$0.259

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Native Components

USA . 79 parts In-Stock

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$6.790

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79

$6.790

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IDEA Electronic Components Group

UK . 417 parts In-Stock

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$10.198

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$9.178

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417

$10.198

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$9.178

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AZTECH Wire

Italy . 863 parts In-Stock

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$14.490

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863

$14.490

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MKK Technologies

India . 1,146 parts In-Stock

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$19.177

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$19.177

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DigiPath Technology Company

USA . 1,146 parts In-Stock

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$19.177

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$19.177

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Component Stockers USA

USA . 544 parts In-Stock

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$99.990

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Perfect Parts

USA . 6,674 parts In-Stock

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Corphita

USA . 3,027 parts In-Stock

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Northwest PG Solutions

USA . 2,200 parts In-Stock

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$6.654

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Parana Technologies

USA . 1,329 parts In-Stock

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$12.194

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$12.194

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Overview

Unlock unparalleled performance with the 74VHC132TTR from STMicroelectronics, a leader in innovative logic gate solutions. This compact, reliable Schmitt Trigger boasts rapid propagation delays and low power consumption, perfect for precision applications across automotive, industrial, and consumer electronics. Trust in STMicroelectronics' commitment to quality and experience the advantage of enhanced system efficiency and robust operation in your designs. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast switching speeds, which is essential for high-performance electronics.

Surface Mount: YES

Surface mount technology allows for space-saving designs and efficient manufacturing processes.

No. of Functions: 4

Multiple functions in a single package reduce complexity in circuit design and save board space.

No. of Inputs: 2

Two input configurations allow for flexible design options, enabling the implementation of a variety of logic functions.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of space on a PCB and allows for easier placement and routing.

Nominal Supply Voltage / Vsup (V): 3.3

3.3V operation is standard in modern digital applications, making this part compatible with many systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF makes the product suitable for a wide range of applications without significant performance degradation.

Power Supplies (V): 2/5.5

Versatile power supply range allows the product to be integrated into various systems that require different voltage levels.

No. of Terminals: 14

A higher number of terminals provides flexibility for connections in complex designs and supports the integration of multiple functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design minimizes space on circuit boards, making it ideal for compact electronic devices.

Maximum I (ol): 8 Amp

High output current capability makes this product suitable for driving loads directly in various applications.

Propagation Delay (tpd): 17.5 ns

Still a competitive propagation delay that supports high-speed applications while maintaining stability.

Maximum Operating Temperature: 125 °C

High temperature rating ensures reliability in demanding environments and enhances the product's durability.

Minimum Operating Temperature: -55 °C

Wide temperature range means the product can function effectively in extreme weather conditions, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing and layout optimization on circuit boards.

Maximum Seated Height: 1.2 mm

Low seated height enhances compatibility with low-profile devices, ideal for modern compact designs.

Width: 4.4 mm

A compact width allows for effective use of space on PCBs and supports tighter layouts.

Minimum Supply Voltage (Vsup): 2 V

Flexible minimum supply voltage makes it adaptable for low-power applications.

Length: 5 mm

Small length contributes to the product's compact footprint, facilitating small-scale design implementations.

Temperature Grade: MILITARY

Military-grade specifications guarantee high reliability and performance under harsh conditions.

Schmitt Trigger: YES

Inclusion of Schmitt Trigger functionality provides improved noise immunity and reliable switching in digital applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance reliability in manufacturing.

Packing Method: TR

Tape and reel packaging eases automated assembly processes, enhancing production efficiency.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for more integration in smaller packages, accommodating more complex circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

Support for higher supply voltage allows greater flexibility in various applications, maintaining compatibility with a broad range of systems.

Technical Specifications

Logic Gates 74VHC132TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC132TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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