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74VHC05TTR

STMicroelectronics

74VHC05TTR by STMicroelectronics

74VHC05TTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 8.5 ns and operates b/w 2-5.5 V. It features an open-drain output and supports up to 8 A, making it ideal for high-speed digital applications in compact designs. Its small outline package ensures efficient space utilization.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 8,953 parts In-Stock

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Anansix

USA . 2,721 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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2,500

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Digiode

USA . 2,412 parts In-Stock

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EMSNET

USA . 1,787 parts In-Stock

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Connector Distribution Corp

USA . 1,072 parts In-Stock

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Right Parts Inc.

USA . 1,072 parts In-Stock

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Prism Electronics

USA . 189 parts In-Stock

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Microchip USA

USA . 413 parts In-Stock

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$9.887

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

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$13.402

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$12.061

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AZTECH Wire

Italy . 323 parts In-Stock

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$16.110

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MKK Technologies

India . 1,529 parts In-Stock

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$25.201

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DigiPath Technology Company

USA . 1,529 parts In-Stock

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Component Stockers USA

USA . 536 parts In-Stock

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$99.990

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Native Components

USA . 736 parts In-Stock

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$576.800

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$565.264

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$559.496

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$553.728

736

$576.800

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$553.728

Northwest PG Solutions

USA . 2,238 parts In-Stock

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$634.480

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Assy Fe

Spain . 7,500 parts In-Stock

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Corphita

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Parana Technologies

USA . 2,377 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance and reliability with the 74VHC05TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality logic gate excels in diverse applications, from automotive to consumer electronics, ensuring swift signal processing with minimal delay. Its compact design and robust temperature resilience make it perfect for tough environments. Choose STMicroelectronics for cutting-edge technology that empowers your projects, delivering lasting value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material providing reliable performance.

Propagation Delay At Nominal Supply: 8.5 ns

Fast response time making it suitable for high-speed applications.

Surface Mount: YES

Ideal for modern PCB designs that require compact and efficient layouts.

No. of Functions: 6

Versatile functionality within a single chip, reducing component count.

Package Shape: RECTANGULAR

Standard package shape that supports easier handling and placement.

Nominal Supply Voltage / Vsup: 3.3 V

Compatible with many systems, making it a flexible choice for circuit design.

Load Capacitance (CL): 50 pF

Low load capacitance enables better switching performance.

Power Supplies (V): 2/5.5

Wide supply range allows for diverse application compatibility.

No. of Terminals: 14

Adequate number of connections supports various functionalities and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Space-efficient design perfect for compact electronics.

Maximum I (ol): 8 Amp

High output current capability suits demanding applications.

Propagation Delay (tpd): 12 ns

Ensures swift logic operations for speed-critical applications.

Maximum Operating Temperature: 125 °C

Can operate in extreme conditions, making it suitable for harsh environments.

Output Characteristics: OPEN-DRAIN

Flexibility in interfacing with various devices and logic levels.

Minimum Operating Temperature: -55 °C

Suitable for use in cold environments, increasing design freedom.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality material ensures excellent conductivity and reliability.

Terminal Position: DUAL

Allows for easy integration on PCBs with limited space.

Maximum Seated Height: 1.2 mm

Ultra-low profile saves space in compact designs.

Width: 4.4 mm

Narrow footprint ideal for dense PCB layouts.

Minimum Supply Voltage (Vsup): 2 V

Allows operation in low-power circuits, enhancing energy efficiency.

Length: 5 mm

Compact length contributes to space-saving designs.

Temperature Grade: MILITARY

Designed to meet strict military standards, ensuring robust performance.

Technology: CMOS

Low power consumption coupled with high-speed performance.

Terminal Form: GULL WING

Provides ease of mounting and good solderability.

Packing Method: TR

Facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

Fine pitch allows for dense packing on PCB, beneficial for modern designs.

Maximum Supply Voltage (Vsup): 5.5 V

Versatile power handling capabilities for multiple applications.

Technical Specifications

Logic Gates 74VHC05TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC05TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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