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74VCXHQ163245TTR

STMicroelectronics

74VCXHQ163245TTR by STMicroelectronics

74VCXHQ163245TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 7.7 ns, supporting voltage translation b/w 1.8V and 3.3V. It features a compact SO package and operates in industrial temperatures from -40 °C to 85 °C, ideal for high-speed data applications. With a max output current of 2.1A, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,900 parts In-Stock

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9,900

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ComSIT USA

USA . 9,900 parts In-Stock

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9,900

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Vyrian

USA . 3,600 parts In-Stock

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3,600

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Digiode

USA . 3,098 parts In-Stock

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Halfin

Belgium . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,933 parts In-Stock

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Microchip USA

USA . 281 parts In-Stock

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$15.639

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281

$15.639

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AZTECH Wire

Italy . 269 parts In-Stock

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$16.250

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269

$16.250

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IDEA Electronic Components Group

UK . 2,170 parts In-Stock

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$16.470

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$14.823

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2,170

$16.470

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$14.823

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MKK Technologies

India . 1,456 parts In-Stock

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$30.970

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1,456

$30.970

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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$30.970

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1,456

$30.970

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A-Z Elektronik GmbH

Germany . 5,258 parts In-Stock

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5,258

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 1,763 parts In-Stock

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1,763

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Parana Technologies

USA . 1,438 parts In-Stock

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$19.692

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$19.692

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Corphita

USA . 1,170 parts In-Stock

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Northwest PG Solutions

USA . 1,019 parts In-Stock

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Native Components

USA . 887 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 787 parts In-Stock

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787

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Overview

Unlock unparalleled performance with the 74VCXHQ163245TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality bus driver and transceiver offers exceptional speed and versatility for your advanced digital applications. With its robust design, it ensures reliable data transfer across various voltage levels, making it perfect for automotive, industrial, and consumer electronics. Experience enhanced efficiency and reliability, elevating your next project to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 7.7 ns

A low propagation delay enhances the performance of the device by enabling faster signal transmission, ideal for high-speed data applications.

Surface Mount: YES

Being surface mount allows for compact designs and automated assembly, resulting in lower manufacturing costs and improved reliability.

No. of Functions: 2

Having multiple functions increases the versatility of the device, allowing for more complex designs without adding additional components.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, making it easier to integrate into various layouts.

No. of Bits: 8

An 8-bit width is versatile enough for multiple applications, accommodating a variety of data formats and communication protocols.

Translation: 1.8/2.5V & 3.3V

The ability to translate between multiple voltage levels ensures compatibility with a wide range of devices, promoting interoperability.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal voltage of 2.5V provides a balance between performance and power consumption, making it energy efficient.

Load Capacitance (CL): 30 pF

A low load capacitance improves circuit performance by maintaining signal integrity even under varying load conditions.

Power Supplies (V): 1.8/2.5, 2.5/3.3

Supporting multiple power supply configurations enhances flexibility and eases integration into existing designs.

No. of Terminals: 48

Having 48 terminals allows for a wide range of inputs and outputs, facilitating complex connectivity requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for high-density mounting, making it ideal for space-constrained applications.

Maximum I (ol): 2.1 Amp

A high output drive capability of up to 2.1A supports demanding applications requiring strong signal drivers.

Propagation Delay (tpd): 7.7 ns

Reiterating a short propagation delay, this further ensures minimal latency in high-speed digital communication.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the device is suitable for industrial and outdoor applications where high heat is prevalent.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state outputs allow multiple signals to share the same line, enhancing flexibility in circuit designs.

Minimum Operating Temperature: -40 °C

A low operating temperature range enables deployment in extreme environments, expanding potential applications.

Terminal Finish: MATTE TIN

Matte tin termination provides good solderability and durability for various assembly processes.

Terminal Position: DUAL

Dual terminal positioning allows for easier PCB layout and improved thermal management in high-density designs.

No. of Ports: 2

Having two ports enables bi-directional communication, making it suitable for both input and output applications.

Maximum Seated Height: 1.2 mm

A low height design is ideal for applications requiring low-profile components, helping meet stringent design criteria.

Width: 6.1 mm

The compact width saves space on PCBs without compromising on performance.

Output Polarity: TRUE

True output polarity simplifies device interfacing and integration into existing systems.

Minimum Supply Voltage (Vsup): 2.3 V

The low minimum supply voltage allows for operation in low-power applications, contributing to overall energy savings.

Maximum Time At Peak Reflow Temperature (s): 30

With a generous maximum reflow time, the device is more resilient during soldering processes, ensuring reliability in assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance ensures compatibility with advanced soldering techniques and components.

Length: 12.5 mm

The length of 12.5 mm strikes a balance between compactness and functionality, making it suitable for various designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environments, ideal for industrial applications.

Technology: CMOS

Utilizing CMOS technology promotes low power consumption with high-speed operation, making it an efficient choice.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, improving manufacturability.

Packing Method: TR

Using tape and reel (TR) packaging streamlines automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.5 mm

A tight 0.5 mm terminal pitch supports high-density designs, making it ideal for modern compact electronic devices.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities expand the versatility of the device in different applications.

Control Type: COMMON CONTROL

Common control enables simplified circuit design and integration with other components, enhancing overall system efficiency.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate handling precautions, ensuring reliability in various conditions.

Maximum Supply Voltage (Vsup): 3.6 V

A high maximum supply voltage allows for flexibility in design, accommodating a wide range of applications.

Technical Specifications

Bus Driver & Transceivers 74VCXHQ163245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A; 1.65V TO 2.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

2.1 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA42,6X7,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

7.7 ns

Propagation Delay (tpd):

7.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/2.5V&3.3V

Width:

6.1 mm

Trade Compliance

74VCXHQ163245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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