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74VCX1632245TTR

STMicroelectronics

74VCX1632245TTR by STMicroelectronics

74VCX1632245TTR by STMicroelectronics is a 16-bit bus driver with a propagation delay of just 5.8 ns, supporting voltage translation b/w 1.8V and 3.3V. It features a compact SO package and operates in industrial temperatures from -40 °C to 85 °C, ideal for high-speed data applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,663 parts In-Stock

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2,663

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Vyrian

USA . 2,577 parts In-Stock

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2,577

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Digiode

USA . 1,346 parts In-Stock

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1,346

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Mil-Aero Solutions, Inc.

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Native Components

USA . 340 parts In-Stock

1+ parts

$0.696

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-

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340

$0.696

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Northwest PG Solutions

USA . 1,920 parts In-Stock

1+ parts

$0.765

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1,920

$0.765

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Andel Nordic

Denmark . 1,999 parts In-Stock

1+ parts

$11.512

100+ parts

-

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$11.052

10k+ parts

$11.052

1,999

$11.512

-

$11.052

$11.052

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$13.346

100+ parts

$13.212

1k+ parts

$12.679

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-

50

$13.346

$13.212

$12.679

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Microchip USA

USA . 446 parts In-Stock

1+ parts

$19.993

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446

$19.993

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AZTECH Wire

Italy . 655 parts In-Stock

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$20.980

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655

$20.980

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$21.670

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$19.503

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162

$21.670

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$19.503

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MKK Technologies

India . 912 parts In-Stock

1+ parts

$40.748

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912

$40.748

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DigiPath Technology Company

USA . 912 parts In-Stock

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$40.748

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912

$40.748

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Component Stockers USA

USA . 769 parts In-Stock

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$99.990

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769

$99.990

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A-Z Elektronik GmbH

Germany . 6,101 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,639 parts In-Stock

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$25.909

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1,639

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$25.909

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Corphita

USA . 1,508 parts In-Stock

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1,508

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Overview

Experience unparalleled performance with the 74VCX1632245TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced bus driver and transceiver excels in delivering seamless communication across varied voltage levels, ensuring your designs are efficient and reliable. With its compact size and robust quality, it's perfect for demanding applications in consumer electronics, automotive, and industrial sectors. Elevate your projects with STMicroelectronics—where excellence meets technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay enhances the speed of data transmission, making this product ideal for high-performance applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit designs and enhances manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, allowing for more compact design layouts.

No. of Bits: 16

With a 16-bit data path, this product supports high data throughput, suitable for applications requiring large data handling.

Translation: 1.8/2.5V & 3.3V

The ability to operate with multiple voltage levels provides versatility for interfacing with different logic families.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage contributes to reduced power consumption, aligning with energy-efficient designs.

Load Capacitance (CL): 30 pF

Optimal load capacitance minimizes signal distortion and maintains integrity in fast-switching applications.

Power Supplies (V): 1.8/2.5, 2.5/3.3

Supports multiple power supply configurations, providing flexibility for design engineers.

No. of Terminals: 48

A higher number of terminals supports more connections, enhancing functionality and reducing PCB real estate.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim package style is excellent for space-constrained designs, allowing for high-density assembly.

Maximum I (ol): 6 Amp

High output current capability allows this product to drive larger loads, making it suitable for demanding applications.

Propagation Delay (tpd): 6.2 ns

Another low propagation delay ensures rapid signal processing, vital for high-frequency data communications.

Maximum Operating Temperature: 85 °C

A higher operating temperature rating ensures reliability in harsher environments, making it ideal for industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output allows multiple devices to share the same bus, enhancing design flexibility and efficiency.

Minimum Operating Temperature: -40 °C

Extended operating temperature range ensures reliable performance in extreme conditions and applications.

Terminal Finish: MATTE TIN

Matte tin finish promotes excellent solderability and reduces the risk of tin whiskers, enhancing production reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates more straightforward PCB layout and better electrical performance.

No. of Ports: 2

Having two ports allows for versatile communication paths, essential for bidirectional data transmission.

Maximum Seated Height: 1.2 mm

Low seated height minimizes space usage within the assembly, critical for compact designs.

Width: 6.1 mm

A narrow width helps in saving PCB space, allowing designers to optimize layout further.

Output Polarity: TRUE

True output polarity simplifies design and reduces complexity in signal processing.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage enhances compatibility with low-voltage circuits, supporting modern low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A generous reflow time ensures successful soldering in manufacturing, improving yield rates.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility means this device can endure standard assembly processes without damage.

Length: 12.5 mm

Compact length aids in space-efficient designs, allowing for higher circuit density.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, ensuring reliability in demanding environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for modern digital applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve assembly reliability in automated processes.

Packing Method: TR

Tape and reel packing simplifies automated assembly processes, boosting manufacturing efficiency.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density packaging, accommodating more functions in a smaller footprint.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enhances versatility for various data handling configurations.

Control Type: COMMON CONTROL

Common control type streamlines system coordination and reduces complexity in signal management.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, informative for handling and storage conditions.

Maximum Supply Voltage (Vsup): 2.7 V

The wide operating voltage range allows flexibility in design while accommodating various signal levels.

Technical Specifications

Bus Driver & Transceivers 74VCX1632245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/2.5V&3.3V

Width:

6.1 mm

Trade Compliance

74VCX1632245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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