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74VCX16240TTR

STMicroelectronics

74VCX16240TTR by STMicroelectronics

74VCX16240TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3.5 ns, supporting dual ports and up to 24 A output. It operates b/w 1.8 V and 3.6 V, making it ideal for industrial applications in compact designs. Its thin profile and surface mount package enhance space efficiency in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,514 parts In-Stock

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3,514

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Anansix

USA . 1,643 parts In-Stock

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1,643

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Digiode

USA . 1,482 parts In-Stock

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1,482

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

1+ parts

$14.133

100+ parts

-

1k+ parts

$12.720

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-

1,716

$14.133

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$12.720

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AZTECH Wire

Italy . 221 parts In-Stock

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$16.450

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221

$16.450

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Microchip USA

USA . 243 parts In-Stock

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$22.267

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243

$22.267

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MKK Technologies

India . 596 parts In-Stock

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$26.576

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596

$26.576

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DigiPath Technology Company

USA . 596 parts In-Stock

1+ parts

$26.576

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596

$26.576

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QUARKTWIN TECHNOLOGY LTD

USA . 7,992 parts In-Stock

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Parana Technologies

USA . 2,168 parts In-Stock

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$16.898

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2,168

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$16.898

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Northwest PG Solutions

USA . 1,970 parts In-Stock

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$4.771

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1,970

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$4.771

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Corphita

USA . 1,825 parts In-Stock

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1,825

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Native Components

USA . 566 parts In-Stock

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$4.722

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566

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$4.722

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Overview

Elevate your designs with the 74VCX16240TTR from STMicroelectronics, a leading name in quality and innovation. This high-performance bus driver seamlessly enhances communication in devices while maintaining exceptional reliability across various applications, from industrial automation to consumer electronics. With its low propagation delay and versatile features, you gain efficiency and power savings, ensuring your projects stand out in performance and longevity. Choose STMicroelectronics for cutting-edge solutions that deliver value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and robust design, enhancing durability and reliability in various environments.

Propagation Delay At Nominal Supply: 3.5 ns

A low propagation delay allows for faster data transmission rates, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology facilitates automation in manufacturing processes, leading to smaller and more efficient overall designs.

No. of Functions: 4

Multiple functions within a single device maximize versatility and reduce the need for additional components in a circuit.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, contributing to compact designs in electronic assemblies.

No. of Bits: 4

With 4 bits, this product can handle a wide range of applications while optimizing performance and efficiency.

Nominal Supply Voltage / Vsup (V): 2.3

Operating at a nominal supply voltage of 2.3V promotes energy efficiency, making it suitable for battery-operated devices.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies is ideal for integration with modern digital systems, ensuring seamless interoperability.

No. of Terminals: 48

A high terminal count allows for comprehensive connectivity options in complex systems, enhancing flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This packaging style is beneficial for space-constrained applications, enabling compact placement on PCBs.

Maximum I (ol): 24 Amp

A high output current capability supports demanding applications, allowing for effective management of high-power signals.

Propagation Delay (tpd): 5 ns

A low propagation delay ensures rapid signal processing, catering to high-frequency applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this device is suitable for industrial environments, ensuring longevity and performance.

Output Characteristics: 3-STATE

3-state output characteristics enhance the product's ability to manage multiple data lines efficiently, reducing conflicts.

Minimum Operating Temperature: -40 °C

A wide minimum operating temperature ensures functionality in extreme conditions, making it reliable for outdoor applications.

Terminal Finish: TIN LEAD

A tin lead finish improves solderability, making assembly easier and more effective in manufacturing processes.

Terminal Position: DUAL

Dual terminal positioning enables easier mounting options and better layout flexibility on the PCB.

No. of Ports: 2

Having two ports enhances capability for multi-channel data communications, ideal for complex system integrations.

Maximum Seated Height: 1.2 mm

A low seated height helps in maintaining a slim profile for the device, suitable for compact and low-profile applications.

Width: 6.1 mm

The narrow width allows for space-efficient designs, ideal for densely populated PCB layouts.

Output Polarity: INVERTED

Inverted output polarity can be particularly advantageous in certain applications for logical signal inversion.

Minimum Supply Voltage (Vsup): 1.8 V

This flexibility in supply voltage makes the product ideal for use in a variety of operating conditions, including low-power scenarios.

Length: 12.5 mm

Compact dimensions make this device suitable for applications where space is at a premium, such as in portable electronics.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product ensures reliability and performance under rigorous conditions.

Technology: CMOS

CMOS technology offers low power consumption and high integration, making it ideal for modern highly-efficient applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved electrical connectivity, thus enhancing overall reliability.

Packing Method: TR

Tape and reel packaging streamlines the assembly process, enabling high-speed manufacturing and efficiency.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for higher density layouts on PCBs, meeting the demands of advanced electronic designs.

Control Type: ENABLE LOW

Low enable control provides simplicity in design, facilitating easy integration into existing systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of existing components in digital circuits.

Technical Specifications

Bus Driver & Transceivers 74VCX16240TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VCX16240TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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