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74VCX162245TTR

STMicroelectronics

74VCX162245TTR by STMicroelectronics

74VCX162245TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3.3 ns, supporting bidirectional data flow. It operates at a nominal voltage of 2.5V and features 48 terminals in a compact SOIC package. Ideal for military applications, it ensures reliable performance across extreme temperatures from -55 °C to 125°C.

Median Price

$1.298

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,474 parts In-Stock

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6,474

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Digiode

USA . 4,278 parts In-Stock

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4,278

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Component Sense

UK . 1,297 parts In-Stock

1+ parts

-

100+ parts

$1.298

1k+ parts

$0.880

10k+ parts

$0.880

1,297

-

$1.298

$0.880

$0.880

Anansix

USA . 387 parts In-Stock

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387

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Distributors (Availability)

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Native Components

USA . 592 parts In-Stock

1+ parts

$1.150

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592

$1.150

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Northwest PG Solutions

USA . 2,338 parts In-Stock

1+ parts

$1.265

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2,338

$1.265

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Andel Nordic

Denmark . 487 parts In-Stock

1+ parts

$7.007

100+ parts

-

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$6.726

10k+ parts

$6.726

487

$7.007

-

$6.726

$6.726

AZTECH Wire

Italy . 541 parts In-Stock

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$10.130

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-

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541

$10.130

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Microchip USA

USA . 135 parts In-Stock

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$12.821

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135

$12.821

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IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$16.884

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-

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$15.195

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779

$16.884

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$15.195

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MKK Technologies

India . 291 parts In-Stock

1+ parts

$31.749

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291

$31.749

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DigiPath Technology Company

USA . 291 parts In-Stock

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$31.749

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291

$31.749

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Ampacity Inc.

Singapore . 569 parts In-Stock

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$64.000

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569

$64.000

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Corphita

USA . 4,675 parts In-Stock

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4,675

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Parana Technologies

USA . 356 parts In-Stock

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$20.187

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356

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$20.187

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Experience the power of seamless communication with the 74VCX162245TTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for precision and reliability, this robust bus driver & transceiver excels in various applications, from automotive to industrial systems. Its exceptional speed and efficiency ensure optimal performance, while its durable construction withstands extreme conditions. Elevate your projects with a trusted component that delivers unmatched quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, the plastic/epoxy material ensures long-lasting performance in various applications.

Propagation Delay At Nominal Supply: 3.3 ns

With a low propagation delay, this product enables fast signal transmission, enhancing overall system performance.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and facilitates automated assembly processes.

No. of Functions: 2

Offering dual functions, this component increases versatility and simplifies circuit design in complex applications.

Package Shape: RECTANGULAR

The rectangular package shape promotes easy integration into various layouts and configurations on PCB.

No. of Bits: 8

An 8-bit capability is ideal for handling data interfaces that require efficient transmission and processing.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal voltage of 2.5V ensures energy efficiency and compatibility with modern low-power applications.

Load Capacitance (CL): 30 pF

A low load capacitance allows for quicker transitions and reduces signal distortion, making it suitable for high-speed applications.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies makes this product ideal for interfacing with standard digital systems.

No. of Terminals: 48

The abundance of terminals provides flexibility in connection options, enabling more complex configurations and functions.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on PCBs, making it easier to design compact electronic devices.

Maximum I (ol): 12 Amp

With a maximum output current of 12 A, it supports high load applications, making it suitable for robust designs.

Propagation Delay (tpd): 6.2 ns

A moderate propagation delay of 6.2 ns enhances performance in applications requiring rapid data handling.

Maximum Operating Temperature: 125 °C

Operating at high temperatures up to 125 °C suits this product for harsh environments and demanding applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output characteristics with series resistors provide flexibility in bus communication, minimizing interference.

Minimum Operating Temperature: -55 °C

Capability to operate in extreme cold makes it suitable for aerospace and military applications where conditions are harsh.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal position facilitates versatile design options and easier integration with existing systems.

No. of Ports: 2

Two ports allow for bi-directional communication, increasing functionality in communication circuits.

Maximum Seated Height: 1.2 mm

The low seated height is advantageous for projects requiring a slim profile without compromising functionality.

Width: 6.1 mm

A compact width of 6.1 mm aids in designing space-efficient and organized circuit layouts.

Output Polarity: TRUE

TRUE output polarity allows for straightforward compatibility with other circuits using standard logic levels.

Minimum Supply Voltage (Vsup): 1.8 V

Supporting a minimum supply voltage of 1.8V enhances its capability to be integrated into low-voltage designs.

Length: 12.5 mm

The length of 12.5 mm fits well within various layout dimensions, providing a balanced design solution.

Temperature Grade: MILITARY

Military-grade ratings ensure reliability and performance in critical applications, enhancing trust in extreme conditions.

Technology: CMOS

CMOS technology delivers low power consumption and high-speed performance, making it a preferred choice for many applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, enhancing the reliability of electrical connections.

Packing Method: TR

Through-hole packing method allows for easy handling and integration into a variety of PCB designs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch meets modern standards for dense PCB layouts, allowing for more compact designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction increases the versatility of the device in data handling applications.

Control Type: COMMON CONTROL

Common control type simplifies management of multiple inputs/outputs, streamlining system design.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows for broad compatibility with contemporary digital electronics.

Technical Specifications

Bus Driver & Transceivers 74VCX162245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VCX162245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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