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74VCX162244TTR

STMicroelectronics

74VCX162244TTR by STMicroelectronics

74VCX162244TTR by STMicroelectronics is a CMOS bus driver with a 4 ns propagation delay, supporting 3.3V power supply and operating from -55 °C to 125°C. It features dual ports and handles up to 12A output current. Ideal for high-speed data transmission in compact applications.

Median Price

$1.814

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,669 parts In-Stock

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3,669

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Component Sense

UK . 1,891 parts In-Stock

1+ parts

-

100+ parts

$1.814

1k+ parts

$1.230

10k+ parts

$1.230

1,891

-

$1.814

$1.230

$1.230

Anansix

USA . 1,026 parts In-Stock

1+ parts

-

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1,026

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Digiode

USA . 602 parts In-Stock

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602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 543 parts In-Stock

1+ parts

$0.542

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-

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543

$0.542

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Northwest PG Solutions

USA . 629 parts In-Stock

1+ parts

$0.596

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629

$0.596

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Andel Nordic

Denmark . 152 parts In-Stock

1+ parts

$6.487

100+ parts

-

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$6.227

10k+ parts

$6.227

152

$6.487

-

$6.227

$6.227

IDEA Electronic Components Group

UK . 890 parts In-Stock

1+ parts

$10.738

100+ parts

-

1k+ parts

$9.664

10k+ parts

-

890

$10.738

-

$9.664

-

AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$17.010

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413

$17.010

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MKK Technologies

India . 861 parts In-Stock

1+ parts

$20.193

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861

$20.193

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DigiPath Technology Company

USA . 861 parts In-Stock

1+ parts

$20.193

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861

$20.193

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Corohmni

South Africa . 29 parts In-Stock

1+ parts

$22.504

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29

$22.504

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$35.851

100+ parts

$32.624

1k+ parts

$29.398

10k+ parts

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5,000

$35.851

$32.624

$29.398

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Microchip USA

USA . 3,597 parts In-Stock

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3,597

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Corphita

USA . 1,839 parts In-Stock

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1,839

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Parana Technologies

USA . 1,425 parts In-Stock

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$12.839

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1,425

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$12.839

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Overview

Elevate your designs with the 74VCX162244TTR from STMicroelectronics, a premier choice in bus driver and transceiver solutions. Renowned for their unmatched quality and reliability, STMicroelectronics delivers products engineered for excellence. This versatile device enhances signal integrity across various applications, offering robust performance with low power consumption. Experience superior efficiency and peace of mind as you innovate with a trusted leader in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 4 ns

A low propagation delay of 4 ns provides swift signal processing, which is essential for high-speed data applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance in space-constrained applications.

No. of Functions: 4

With four functions integrated, this product can handle multiple tasks, increasing efficiency and versatility in circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on PCBs, beneficial for modern electronics.

No. of Bits: 4

Supporting 4 bits can process more data simultaneously, enhancing the throughput for digital systems.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5 V is ideal for low-power applications while maintaining performance.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF helps optimize signal integrity and reduce power consumption.

Power Supplies (V): 3.3

Operating at 3.3 V makes this device compatible with commonly used digital logic in many systems.

No. of Terminals: 48

A higher number of terminals allows for more connections and functionality within a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch minimize the amount of board space needed, catering to modern compact device designs.

Maximum I (ol): 12 Amp

The ability to handle up to 12 Amps makes this device suitable for high-power applications.

Propagation Delay (tpd): 6.2 ns

A propagation delay of 6.2 ns contributes to the overall speed and responsiveness in high-speed communication systems.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C ensures reliability in demanding environments.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with a series resistor enhances versatility, supporting tri-state logic applications.

Minimum Operating Temperature: -55 °C

Operating as low as -55 °C ensures this device is suitable for military and harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout designs, facilitating easy integration.

No. of Ports: 2

Dual ports allow for increased connectivity and throughput, making it ideal for multi-device communication.

Maximum Seated Height: 1.2 mm

A maximum seated height of only 1.2 mm aids in low-profile designs for slim electronics.

Width: 6.1 mm

With a width of 6.1 mm, it maintains a compact form factor conducive to modern electronics.

Output Polarity: TRUE

True output polarity ensures compatibility with commonly used logic levels for easy integration.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V is ideal for low-power designs, extending battery life in portable devices.

Length: 12.5 mm

Compact length of 12.5 mm contributes to saving valuable PCB space which is essential in high-density designs.

Temperature Grade: MILITARY

MILITARY temperature grade ensures reliability and performance in critical and harsh environments.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and increase reliability in PCB assembly.

Packing Method: TR

Tape and reel packing method facilitates efficient automated assembly processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm reflects modern design standards allowing for higher density packaging.

Control Type: ENABLE LOW

ENABLE LOW control type aids in power management by allowing devices to stay in a low-power state when not active.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V ensures compatibility with a variety of electronic systems.

Technical Specifications

Bus Driver & Transceivers 74VCX162244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VCX162244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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