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74LVXC4245MTR

STMicroelectronics

74LVXC4245MTR by STMicroelectronics

74LVXC4245MTR by STMicroelectronics is an 8-bit bus driver/transceiver with a propagation delay of just 8 ns, supporting bidirectional translation b/w 3/5V and 5V. It operates within -40 °C to 85°C and features a compact SO package. Ideal for industrial applications requiring efficient data transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,537 parts In-Stock

1+ parts

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8,537

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Digiode

USA . 3,386 parts In-Stock

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3,386

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Anansix

USA . 1,415 parts In-Stock

1+ parts

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1,415

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ComSIT USA

USA . 180 parts In-Stock

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180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,007 parts In-Stock

1+ parts

$6.133

100+ parts

-

1k+ parts

$5.888

10k+ parts

$5.888

4,007

$6.133

-

$5.888

$5.888

AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$15.520

100+ parts

-

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428

$15.520

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Microchip USA

USA . 172 parts In-Stock

1+ parts

$25.677

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-

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172

$25.677

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

1+ parts

$29.195

100+ parts

-

1k+ parts

$26.276

10k+ parts

-

2,147

$29.195

-

$26.276

-

MKK Technologies

India . 251 parts In-Stock

1+ parts

$54.900

100+ parts

-

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251

$54.900

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DigiPath Technology Company

USA . 251 parts In-Stock

1+ parts

$54.900

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251

$54.900

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 2,347 parts In-Stock

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2,347

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Northwest PG Solutions

USA . 2,038 parts In-Stock

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2,038

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Parana Technologies

USA . 1,797 parts In-Stock

1+ parts

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100+ parts

$34.907

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1,797

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$34.907

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Native Components

USA . 449 parts In-Stock

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449

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Overview

Unlock seamless communication in your designs with the 74LVXC4245MTR from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this versatile bus driver and transceiver, perfect for bridging 3V and 5V systems. Its compact design, minimal propagation delays, and robust temperature range ensure reliability across various applications—ideal for automotive, industrial, and consumer electronics. Elevate your projects with a trusted component that promises efficiency and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 8 ns

A low propagation delay indicates fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for more efficient space utilization on PCBs, ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and aligns well with standard layouts.

No. of Bits: 8

An 8-bit configuration allows for substantial data handling capabilities in a single package.

Translation: 3/5V & 5V

This flexibility in supply voltage translation makes it compatible with a wider range of devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes it more energy-efficient and suitable for modern low-power systems.

Power Supplies (V): 3/5, 5

Support for multiple power supplies enhances versatility for different circuit designs.

No. of Terminals: 24

A higher terminal count offers more connectivity options, facilitating complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and suits high-density applications.

Maximum I (ol): 24 Amp

This high output current handling capability allows it to drive larger loads effectively.

Propagation Delay (tpd): 8.5 ns

The minimal additional propagation delay ensures quick data communication, essential for performance.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes it suitable for industrial applications, where conditions can be harsh.

Output Characteristics: 3-STATE

3-state outputs enhance bus efficiency by allowing multiple devices to share the same bus.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold ensures reliability in outdoor and cold environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances corrosion resistance and improves connection reliability over time.

Terminal Position: DUAL

Dual terminal positioning increases flexibility in PCB layout and ease of soldering.

No. of Ports: 2

Two ports enable bidirectional data flow, accommodating various device configurations.

Maximum Seated Height: 2.65 mm

A low seated height allows for better compatibility with space-constrained designs.

Width: 7.5 mm

This compact width is beneficial for tight spaces and helps in reducing board area.

Output Polarity: TRUE

True output polarity ensures compatibility with common signaling needs in digital circuits.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V supports battery-operated devices and enhances efficiency.

Length: 15.4 mm

This manageable length facilitates easier integration into various application layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees robust performance in demanding environments.

Technology: CMOS

CMOS technology leads to low power consumption and high-speed performance, suitable for modern applications.

Terminal Form: GULL WING

Gull wing terminals are designed for reliable soldering and are commonly used in automated assembly.

Packing Method: TR

Tape and reel packing facilitates automated handling and assembly, making it production-friendly.

Terminal Pitch: 1.27 mm

A 1.27mm pitch offers compatibility with a variety of PCB layouts and designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting allows for versatility in data transmission, enhancing application flexibility.

Control Type: COMMON CONTROL

Having a common control type simplifies the design and integration process for multi-device systems.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5V ensures compatibility with a broad range of electronic components.

Technical Specifications

Bus Driver & Transceivers 74LVXC4245MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

PORT A OPERATES AT 4.5V TO 5.5V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3/5,5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

3/5V & 5V

Width:

7.5 mm

Trade Compliance

74LVXC4245MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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