Loading...

74LVX32MTR

STMicroelectronics

74LVX32MTR by STMicroelectronics

74LVX32MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 12.5 ns and operates at supply voltages b/w 2V and 3.6V. It features four functions with two inputs, ideal for compact electronic applications. Its robust design supports military-grade temperatures from -55 °C to 125 °C.

Median Price

$0.938

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,446 parts In-Stock

1+ parts

$0.938

100+ parts

$0.375

1k+ parts

$0.263

10k+ parts

$0.244

1,446

$0.938

$0.375

$0.263

$0.244

Digiode

USA . 4,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,923

-

-

-

-

Vyrian

USA . 2,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,394

-

-

-

-

Anansix

USA . 1,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,962

-

-

-

-

Microfarads

USA . 1,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 809 parts In-Stock

1+ parts

$0.036

100+ parts

-

1k+ parts

-

10k+ parts

$0.035

809

$0.036

-

-

$0.035

Microchip USA

USA . 136 parts In-Stock

1+ parts

$6.990

100+ parts

$6.990

1k+ parts

$6.990

10k+ parts

$6.990

136

$6.990

$6.990

$6.990

$6.990

AZTECH Wire

Italy . 91 parts In-Stock

1+ parts

$14.710

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$14.710

-

-

-

IDEA Electronic Components Group

UK . 924 parts In-Stock

1+ parts

$28.612

100+ parts

-

1k+ parts

$25.751

10k+ parts

-

924

$28.612

-

$25.751

-

MKK Technologies

India . 1,804 parts In-Stock

1+ parts

$53.803

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$53.803

-

-

-

DigiPath Technology Company

USA . 1,804 parts In-Stock

1+ parts

$53.803

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$53.803

-

-

-

Component Stockers USA

USA . 477 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

477

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,026

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,249

-

-

-

-

Parana Technologies

USA . 1,573 parts In-Stock

1+ parts

-

100+ parts

$34.210

1k+ parts

-

10k+ parts

-

1,573

-

$34.210

-

-

Perfect Parts

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

-

-

-

-

Metaverse IC Inc.

Canada . 720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

720

-

-

-

-

Northwest PG Solutions

USA . 197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197

-

-

-

-

Corphita

USA . 192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

192

-

-

-

-

Overview

Unlock unparalleled performance with the 74LVX32MTR from STMicroelectronics, a leader in semiconductor innovation. This versatile logic gate boasts fast propagation delays and robust operation across a wide temperature range, making it the perfect choice for demanding applications in automotive, industrial, and consumer electronics. Enjoy enhanced reliability and energy efficiency, ensuring your designs are future-ready while benefiting from ST's commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability in various applications.

Propagation Delay At Nominal Supply: 12.5 ns

Low propagation delay allows for faster signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables easier and more efficient PCB designs, saving space and costs in manufacturing.

No. of Functions: 4

Supports multiple logic functions in a single package, reducing component count and complexity in circuit design.

No. of Inputs: 2

Two-input configuration is versatile and widely used in a variety of logic circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and straightforward placement.

Nominal Supply Voltage / Vsup: 2.7 V

Optimized for low voltage operation, making it ideal for battery-powered devices and energy-efficient designs.

Load Capacitance (CL): 50 pF

A moderate load capacitance helps maintain performance and stability in various circuit conditions.

Power Supplies (V): 3.3 V

Common power supply voltage, ensuring compatibility with a wide array of electronic systems.

No. of Terminals: 14

Provides ample connections for versatile configurations and functions in circuit integration.

Package Style (Meter): SMALL OUTLINE

Compact design enhances space efficiency in modern electronics, fitting easily into tighter layouts.

Maximum I (ol): 4 Amp

High output current capability supports demanding applications without compromising performance.

Propagation Delay (tpd): 18 ns

A slightly longer propagation delay gives the possibility of more complex switching operations without significant lag.

Maximum Operating Temperature: 125 °C

High-temperature rating ensures reliable operation in demanding environments, such as automotive or military applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range guarantees performance in extreme conditions, expanding its application potential.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish enhances reliability and longevity against corrosion and wear.

Terminal Position: DUAL

Dual terminal position facilitates easier soldering and integration into compact layouts.

Maximum Seated Height: 1.75 mm

Low profile height allows for stacking and fitting into compact assembly designs.

Width: 3.9 mm

Narrow width is ideal for high-density boards, maximizing circuit design options.

Minimum Supply Voltage (Vsup): 2 V

Flexibility in voltage requirements supports diverse applications and design strategies.

Maximum Time At Peak Reflow Temperature: 40 s

Extended time at peak temperature allows for more robust soldering processes, improving assembly success.

Peak Reflow Temperature: 260 °C

High peak reflow temperature compatibility ensures reliability during assembly in surface mount applications.

Length: 8.65 mm

Compact length optimizes layout and integrates well within a variety of electronic products.

Temperature Grade: MILITARY

Military grade specification ensures durability and reliability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering surface, enhancing connection strength and reliability.

Packing Method: TR

Tape and reel packaging simplifies handling and automates assembly processes for efficient production.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows ease of integration and soldering with existing systems.

Maximum Supply Voltage (Vsup): 3.6 V

Offering a higher supply voltage limit ensures compatibility with various circuitry requirements.

Technical Specifications

Logic Gates 74LVX32MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX32MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20