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74LVX157MTR

STMicroelectronics

74LVX157MTR by STMicroelectronics

74LVX157MTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 14 ns, supporting up to 4 functions and operating b/w 2.0V and 3.6V. Its compact SO package makes it ideal for space-constrained applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

$14.493

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 78 parts In-Stock

1+ parts

$0.400

100+ parts

$0.246

1k+ parts

-

10k+ parts

$0.164

78

$0.400

$0.246

-

$0.164

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$28.586

100+ parts

$26.013

1k+ parts

$23.441

10k+ parts

-

3,000

$28.586

$26.013

$23.441

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,218 parts In-Stock

1+ parts

$0.380

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4,218

$0.380

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R&J Components

USA . 5,000 parts In-Stock

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5,000

-

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Vyrian

USA . 4,659 parts In-Stock

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4,659

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Zilex Electronics Inc.

Canada . 2,500 parts In-Stock

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2,500

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Anansix

USA . 192 parts In-Stock

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192

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Distributors (Availability)

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Corphita

USA . 919 parts In-Stock

1+ parts

$0.360

100+ parts

-

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919

$0.360

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IDEA Electronic Components Group

UK . 1,104 parts In-Stock

1+ parts

$17.676

100+ parts

-

1k+ parts

$15.908

10k+ parts

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1,104

$17.676

-

$15.908

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Corohmni

South Africa . 312 parts In-Stock

1+ parts

$20.350

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312

$20.350

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$28.586

100+ parts

$26.013

1k+ parts

$23.441

10k+ parts

-

3,000

$28.586

$26.013

$23.441

-

MKK Technologies

India . 839 parts In-Stock

1+ parts

$33.238

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839

$33.238

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DigiPath Technology Company

USA . 839 parts In-Stock

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$33.238

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839

$33.238

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Native Components

USA . 908 parts In-Stock

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$36.320

100+ parts

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$34.867

908

$36.320

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$34.867

Northwest PG Solutions

USA . 1,016 parts In-Stock

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$39.952

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1,016

$39.952

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Microchip USA

USA . 5,697 parts In-Stock

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5,697

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QUARKTWIN TECHNOLOGY LTD

USA . 4,084 parts In-Stock

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4,084

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Parana Technologies

USA . 2,027 parts In-Stock

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$21.134

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2,027

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$21.134

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Perfect Parts

USA . 748 parts In-Stock

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748

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Overview

Unlock the potential of your designs with the 74LVX157MTR multiplexer from STMicroelectronics. Renowned for its reliability and performance, this compact device ensures rapid data switching with low power consumption. Ideal for a wide range of applications—from telecom to automotive—its robust design stands up to demanding environments. Elevate your projects with ST’s commitment to quality, delivering exceptional value and efficiency that drives innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and protection of the internal components, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 14 ns

A low propagation delay ensures fast signal transmission, increasing overall circuit speed and efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it ideal for high-density applications.

No. of Functions: 4

With four functions available, this device increases versatility, enabling multiple circuit configurations in one package.

No. of Inputs: 2

Having two inputs allows for simplified data routing and selection, which is essential in various digital applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout efficiency on PCBs, facilitating better space utilization.

Nominal Supply Voltage / Vsup (V): 2.7

Operates efficiently at a low nominal supply voltage, contributing to lower power consumption and extended battery life.

Load Capacitance (CL): 50 pF

A low load capacitance minimizes signal distortion, enhancing overall circuit performance.

Power Supplies (V): 3.3

Compatible with common power supply standards, making it easier to integrate into existing systems.

No. of Terminals: 16

The availability of 16 terminals provides ample connectivity options for a variety of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces PCB real estate, making it suitable for compact devices.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amp, this product can handle significant load requirements, enhancing its applicability in high-power systems.

Propagation Delay (tpd): 20 ns

Maintaining a low propagation delay allows for quick data processing, making it ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this device is reliable for use in demanding environments.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures reliable operation in extreme climates, making it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides routing flexibility, facilitating easier PCB design and layout.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial for low-profile applications, keeping designs compact.

Width: 3.9 mm

A narrow width allows for greater density and flexibility in circuit design.

Output Polarity: TRUE

True output polarity makes integration straightforward in standard logic applications.

Minimum Supply Voltage (Vsup): 2 V

Allows operation at low voltages, further enhancing power efficiency and flexibility in circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard reflow soldering processes, simplifying assembly.

Peak Reflow Temperature °C: 260

High peak temperature tolerance facilitates robust soldering without damaging the component.

Length: 9.9 mm

A compact length promotes space-efficient designs, which is increasingly important in modern electronics.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and durability under extreme conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a preferred choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint integrity, ensuring reliable performance in various applications.

Packing Method: TR

Tape and reel packing streamlines the assembly process, facilitating automated electronics manufacturing.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for easy interfacing with existing PCB designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable handling requirements, simplifying integration into production lines.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows flexibility for various power source applications while maintaining stable operation.

Technical Specifications

Multiplexer & Demultiplexer 74LVX157MTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LVX157MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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