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74LVX132TTR

STMicroelectronics

74LVX132TTR by STMicroelectronics

74LVX132TTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 10 ns, operating at a nominal voltage of 3.3V. It features four functions and two inputs in a compact 14-terminal package. Ideal for high-speed applications, it operates within -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,246 parts In-Stock

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5,246

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 856 parts In-Stock

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856

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Dan-Mar Components

USA . 856 parts In-Stock

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856

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Anansix

USA . 467 parts In-Stock

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467

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Digiode

USA . 124 parts In-Stock

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Microchip USA

USA . 276 parts In-Stock

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$0.537

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276

$0.537

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AZTECH Wire

Italy . 1,050 parts In-Stock

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$13.450

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$13.450

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IDEA Electronic Components Group

UK . 304 parts In-Stock

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$18.729

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$16.856

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304

$18.729

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$16.856

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MKK Technologies

India . 2,161 parts In-Stock

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$35.219

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$35.219

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DigiPath Technology Company

USA . 2,161 parts In-Stock

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$35.219

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$35.219

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Native Components

USA . 485 parts In-Stock

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$107.176

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$102.889

485

$107.176

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$102.889

Northwest PG Solutions

USA . 304 parts In-Stock

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$117.893

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304

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Perfect Parts

USA . 10,020 parts In-Stock

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Corphita

USA . 4,928 parts In-Stock

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Parana Technologies

USA . 121 parts In-Stock

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$22.394

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$22.394

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Overview

Unlock unparalleled performance with the 74LVX132TTR from STMicroelectronics, a trusted leader in innovation. This advanced logic gate ensures lightning-fast response times and unmatched reliability, making it ideal for critical applications in automotive, industrial, and consumer electronics. With its compact design and robust features, you gain versatility without compromising quality. Elevate your projects with a component designed for excellence—where precision meets enduring value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 10 ns

A low propagation delay means faster signal processing, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact PCB designs.

No. of Functions: 4

Multiple functions increase versatility, enabling a single package to serve various logical operations.

No. of Inputs: 2

The two inputs provide flexibility in circuit design, allowing for simple integration into existing systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, making the design more efficient.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3 V is standard for many modern digital circuits, ensuring compatibility.

Load Capacitance (CL): 50 pF

A low load capacitance allows for quicker switching speeds and reduced power loss.

Power Supplies (V): 3.3

Standard power supply requirements simplify the integration process in typical applications.

No. of Terminals: 14

The 14 terminals facilitate multiple connections, enhancing the device's utility in complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications and allow dense PCB layouts.

Maximum I (ol): 4 Amp

High output current capability allows the device to drive loads directly, which is beneficial in power-sensitive applications.

Propagation Delay (tpd): 13.5 ns

While slightly higher than the nominal, this propagation delay still supports efficient operation in many digital applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in extreme heat environments.

Minimum Operating Temperature: -55 °C

The ability to function in low temperatures guarantees performance in cold conditions, suitable for military or aerospace applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances corrosion resistance and improves solderability for robust connections.

Terminal Position: DUAL

Dual terminal positioning aids in flexible PCB layout design, supporting varied assembly processes.

Maximum Seated Height: 1.2 mm

The low seated height allows for low-profile designs, contributing to compact electronic components.

Width: 4.4 mm

A narrow width makes it suitable for densely packed PCB designs, optimizing space utilization.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate down to 2 V increases design flexibility for low-power applications.

Length: 5 mm

Short length helps maintain a compact footprint in electronic devices.

Temperature Grade: MILITARY

Military-grade certification indicates reliability and durability in challenging environments.

Schmitt Trigger: YES

Inclusion of Schmitt trigger functionality ensures clean, stable signal transitions, reducing noise susceptibility.

Technology: CMOS

CMOS technology offers lower power consumption and higher noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals enable easier soldering and assembly, enhancing manufacturing efficiency.

Packing Method: TR

Tape and reel packing method simplifies storage and automated assembly processes.

Terminal Pitch: 0.65 mm

A narrow terminal pitch allows for high-density layouts, ideal for modern electronics.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V adds safety margins for circuit design, ensuring the component does not exceed rated values.

Technical Specifications

Logic Gates 74LVX132TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX132TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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