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74LVX02MTR

STMicroelectronics

74LVX02MTR by STMicroelectronics

74LVX02MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 13 ns and operates at a supply voltage of 2.7-3.6 V. It features 4 functions and supports surface mount applications in compact designs. Ideal for military-grade electronics, it withstands temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,429 parts In-Stock

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5,429

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Digiode

USA . 2,841 parts In-Stock

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Anansix

USA . 839 parts In-Stock

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839

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Microchip USA

USA . 295 parts In-Stock

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$0.306

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295

$0.306

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Native Components

USA . 927 parts In-Stock

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$1.082

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927

$1.082

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Northwest PG Solutions

USA . 545 parts In-Stock

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$1.190

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$1.190

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IDEA Electronic Components Group

UK . 122 parts In-Stock

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$13.494

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$12.144

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122

$13.494

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$12.144

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AZTECH Wire

Italy . 74 parts In-Stock

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$13.550

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74

$13.550

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MKK Technologies

India . 283 parts In-Stock

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$25.374

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DigiPath Technology Company

USA . 283 parts In-Stock

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$25.374

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Component Stockers USA

USA . 588 parts In-Stock

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$99.990

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Corphita

USA . 2,393 parts In-Stock

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Parana Technologies

USA . 1,440 parts In-Stock

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$16.134

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Overview

Unlock the potential of your projects with the 74LVX02MTR from STMicroelectronics—a leader in high-quality semiconductor solutions. This cutting-edge logic gate offers unmatched speed and reliability, essential for a diverse range of applications from automotive to industrial automation. With its compact design and exceptional thermal performance, it ensures efficient operation even in demanding environments. Elevate your designs with a trusted partner that delivers both value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 13 ns

With a low propagation delay, this logic gate provides faster signal processing, enhancing overall system performance.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space, enabling more compact and streamlined electronic designs.

No. of Functions: 4

Offering multiple functions increases versatility, allowing for more complex logical operations without needing additional components.

No. of Inputs: 2

With dual inputs, this logic gate supports diverse logic configurations, making it adaptable for various applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier integration into circuit designs and simplifies soldering in production.

Nominal Supply Voltage / Vsup (V): 2.7

This nominal supply voltage provides a balance between performance and power consumption, optimizing efficiency.

Load Capacitance (CL): 50 pF

A manageable load capacitance ensures compatibility with a wide range of applications while maintaining signal integrity.

Power Supplies (V): 3.3

The standard power supply voltage is widely supported in modern electronics, simplifying design and implementation.

No. of Terminals: 14

With 14 terminals, this product allows for multiple connections, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline design allows for high-density mounting on PCBs, making it ideal for space-constrained applications.

Maximum I (ol): 4 Amp

A high output current capability (4A) supports driving larger loads, increasing the component's versatility in various systems.

Propagation Delay (tpd): 19 ns

Though slightly higher than the nominal delay, this propagation delay is still competitive, ensuring reliable operation in high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate is suitable for demanding environments, enhancing its usability.

Minimum Operating Temperature: -55 °C

A very low minimum operating temperature ensures reliable performance in extreme conditions, making it a robust choice for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and provides excellent protection against corrosion, enhancing durability.

Terminal Position: DUAL

The dual terminal position optimizes space usage and simplifies PCB layout, making assembly easier.

Maximum Seated Height: 1.75 mm

The low seated height contributes to a compact design, enabling the integration of complex circuits in smaller spaces.

Width: 3.9 mm

The narrow width accommodates high-density layouts, essential for modern electronic devices.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for operation in energy-efficient designs, contributing to reduced power consumption.

Maximum Time At Peak Reflow Temperature (s): 40

The manageable reflow time allows for efficient soldering processes during production, enhancing manufacturing reliability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures compatibility with advanced soldering technologies, improving assembly processes.

Length: 8.65 mm

The compact length promotes easy integration into various PCBs, which is critical for modern electronic assemblies.

Temperature Grade: MILITARY

The military temperature grade indicates high reliability and robustness against extreme environmental conditions.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, further enhancing the product's efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates straightforward soldering, improving assembly productivity and reliability.

Packing Method: TR

The TR packing method offers optimal protection during shipping and handling, ensuring components arrive in excellent condition.

Terminal Pitch: 1.27 mm

A common terminal pitch simplifies PCB design and component placement, ensuring compatibility with various manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility across a range of devices while maintaining efficient performance.

Technical Specifications

Logic Gates 74LVX02MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX02MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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