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74LVC573AMTR

STMicroelectronics

74LVC573AMTR by STMicroelectronics

74LVC573AMTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.2 ns, ideal for high-speed applications. It operates b/w 1.65V and 3.6V, supporting military-grade temperatures from -55 °C to 125°C. This compact surface-mount device features a true output polarity and is suitable for various digital communication tasks.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 429 parts In-Stock

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$1.250

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429

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$1.250

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Distributors (In-Stock)

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Digiode

USA . 1,668 parts In-Stock

1+ parts

$1.672

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1,668

$1.672

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Zilex Electronics Inc.

Canada . 6,000 parts In-Stock

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Vyrian

USA . 5,847 parts In-Stock

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Anansix

USA . 1,568 parts In-Stock

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1,568

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Semi Source

USA . 50 parts In-Stock

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50

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Prism Electronics

USA . 8 parts In-Stock

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8

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Corphita

USA . 53 parts In-Stock

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$1.584

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-

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53

$1.584

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Component Stockers USA

USA . 463 parts In-Stock

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$1.750

100+ parts

$1.370

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463

$1.750

$1.370

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Andel Nordic

Denmark . 4,827 parts In-Stock

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$2.107

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$2.023

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$2.023

4,827

$2.107

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$2.023

Microchip USA

USA . 447 parts In-Stock

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$12.699

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447

$12.699

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

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$14.197

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$12.778

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$14.197

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MKK Technologies

India . 210 parts In-Stock

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$26.697

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210

$26.697

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DigiPath Technology Company

USA . 210 parts In-Stock

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$26.697

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210

$26.697

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Native Components

USA . 24 parts In-Stock

1+ parts

$572.020

100+ parts

$560.580

1k+ parts

$554.859

10k+ parts

$549.139

24

$572.020

$560.580

$554.859

$549.139

Northwest PG Solutions

USA . 831 parts In-Stock

1+ parts

$629.222

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831

$629.222

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Parana Technologies

USA . 1,790 parts In-Stock

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$16.975

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Perfect Parts

USA . 1,161 parts In-Stock

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Overview

Elevate your designs with the 74LVC573AMTR from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for their commitment to quality, STMicroelectronics delivers unparalleled reliability and performance. This 8-bit device effortlessly enhances data communication in demanding applications, ensuring swift propagation delays and robust operation across a wide temperature range. Choose the 74LVC573AMTR and empower your projects with efficiency and confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and allows for various surface mount applications, making it suitable for compact electronic designs.

Propagation Delay At Nominal Supply: 8.2 ns

A low propagation delay improves the speed of data transmission, making this product ideal for high-performance applications.

Surface Mount: YES

Surface mount technology allows for higher circuit density and improved performance, which is beneficial for modern compact devices.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient PCB layout, facilitating easier integration into circuit boards.

No. of Bits: 8

An 8-bit configuration is versatile for a variety of digital applications, catering to standard data transmission needs.

Nominal Supply Voltage / Vsup: 2.7 V

Operating at a nominal voltage of 2.7 V allows compatibility with low power systems, resulting in energy-efficient designs.

Load Capacitance (CL): 50 pF

A low load capacitance facilitates faster switching speeds, enhancing overall circuit performance.

Power Supplies (V): 3.3

Compatibility with 3.3 V power supplies ensures integration with a wide range of existing electronic systems.

No. of Terminals: 20

With 20 terminals, it provides ample connections for versatility in complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on PCB, making it ideal for compact applications.

Maximum I (ol): 24 Amp

Supports a high output current capacity, excellent for driving loads in applications needing significant power.

Propagation Delay (tpd): 9.4 ns

This propagation delay is favorable for applications requiring quick response times and efficient data processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates reliability in harsh environments, ideal for industrial or military applications.

Output Characteristics: 3-STATE

3-state output capability enhances flexibility in bus systems, allowing multiple devices to share the same data lines.

Minimum Operating Temperature: -55 °C

Its suitability for extreme low temperatures makes this product reliable for cryogenic and extreme condition applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent solderability and corrosion resistance, prolonging product lifespan.

Terminal Position: DUAL

Dual terminal position aids in flexible mounting options on PCBs, facilitating easier integration.

No. of Ports: 2

Having 2 ports allows for direct communication lines, suitable for dual data streams or connections.

Maximum Seated Height: 2.65 mm

A low seated height contributes to compact designs and spaces where height restrictions are critical.

Width: 7.5 mm

A moderate width allows for standardization in PCB layouts without compromising other elements.

Output Polarity: TRUE

The true output polarity is suitable for a variety of digital circuits, ensuring compatibility with logic levels.

Minimum Supply Voltage (Vsup): 1.65 V

The broad range of supply voltage compatibility ensures flexibility in diverse applications and energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for effective soldering processes, ensuring reliable connections and overall circuit integrity.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature capability ensures compatibility with various soldering techniques.

Length: 12.8 mm

The length provides a balance between compactness and functionality, fitting well into many layouts.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring high reliability and durability in critical applications.

Technology: CMOS

CMOS technology is known for low power consumption and high speed, which is ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are beneficial for automated soldering processes, enhancing assembly efficiency.

Packing Method: TR

Tape and reel packing allows for easy handling and automated assembly, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with various PCB layouts and ease of soldering.

Moisture Sensitivity Level (MSL): 3

Level 3 moisture sensitivity indicates reliability in varied environmental conditions, particularly in packaging and handling.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage ensures compatibility with more powerful systems, enabling higher performance levels.

Technical Specifications

Bus Driver & Transceivers 74LVC573AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

9.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74LVC573AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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