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74LVC32AMTR

STMicroelectronics

74LVC32AMTR by STMicroelectronics

74LVC32AMTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 5 ns, operating b/w 1.65V and 3.6V. It features four functions with dual inputs in a compact SO package, ideal for high-speed digital applications. Its robust design supports military-grade temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 5,802 parts In-Stock

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Anansix

USA . 1,605 parts In-Stock

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Digiode

USA . 486 parts In-Stock

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486

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Microchip USA

USA . 467 parts In-Stock

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$0.340

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467

$0.340

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IDEA Electronic Components Group

UK . 313 parts In-Stock

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$10.773

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$9.696

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313

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$9.696

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MKK Technologies

India . 1,080 parts In-Stock

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$20.258

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DigiPath Technology Company

USA . 1,080 parts In-Stock

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$20.258

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$20.258

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AZTECH Wire

Italy . 322 parts In-Stock

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$21.030

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Native Components

USA . 467 parts In-Stock

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$24.040

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Northwest PG Solutions

USA . 2,044 parts In-Stock

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$26.444

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$23.800

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$26.444

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Kepictronics

USA . 41,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,283 parts In-Stock

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Parana Technologies

USA . 526 parts In-Stock

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$12.881

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Overview

Unlock the potential of your designs with the 74LVC32AMTR from STMicroelectronics—where innovation meets reliability! This high-performance logic gate delivers rapid propagation delays and operates seamlessly in a range of temperatures, making it perfect for automotive, industrial, and consumer applications. With STMicroelectronics' renowned commitment to quality, you can trust that this product enhances efficiency while providing unmatched durability and performance. Experience unparalleled value and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides excellent durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

A low propagation delay ensures high-speed performance, making this logic gate ideal for applications requiring quick signal processing.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact circuits and enhances PCB space efficiency.

No. of Functions: 4

With four functions available in a single package, it provides versatility and flexibility for designers, reducing component count.

No. of Inputs: 2

Two inputs per function facilitates a variety of logical operations, allowing for complex logic implementations in a simple manner.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs and allows for straightforward placement and soldering.

Nominal Supply Voltage / Vsup: 2.7 V

Operating at a nominal supply voltage of 2.7V makes this logic gate energy-efficient, contributing to overall power savings in the design.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, it ensures compatibility with a wide range of other components, promoting reliable circuit performance.

Power Supplies (V): 3.3

Standard power supply of 3.3V aligns with common digital logic levels, providing convenience in power design.

No. of Terminals: 14

A 14-terminal configuration offers sufficient connections for complex functions while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enabling higher density designs.

Maximum I (ol): 24 Amp

This high output current capability allows it to drive a significant load, making it suitable for powering multiple downstream devices.

Propagation Delay (tpd): 12 ns

A propagation delay of 12 ns ensures the capability for moderate-speed operations, suitable for various digital communication applications.

Maximum Operating Temperature: 125 °C

Withstand high temperatures up to 125 °C, this logic gate is reliable in demanding environments and industrial applications.

Minimum Operating Temperature: -55 °C

A wide operating temperature range allows the device to function effectively in extreme conditions, enhancing its reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures superior conductivity and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning accommodates more complex circuit designs and allows for flexibility in PCB layout.

Maximum Seated Height: 1.75 mm

A low seated height promotes compatibility with other components in tight spaces, optimizing the design flexibility.

Width: 3.9 mm

A narrow width facilitates placement in densely populated boards, making it ideal for modern compact electronic designs.

Minimum Supply Voltage (Vsup): 1.65 V

Low operating voltage capability down to 1.65V enhances energy efficiency, making it suitable for battery-powered applications.

Length: 8.65 mm

A compact length ensures space-saving in circuit designs while maintaining necessary functionality.

Temperature Grade: MILITARY

The military-grade specification ensures strict quality and reliability, making it suitable for high-stakes environments.

Technology: CMOS

The CMOS technology allows for low power consumption and integration, benefiting battery-operated and portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and reliability in assembly, making it easy to work with in manufacturing.

Packing Method: TR

Using a tape and reel (TR) packing method makes handling and automated placement during assembly efficient and streamlined.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances space and connectivity, allowing for effective soldering while promoting ease of routing on PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

Capability to operate at a maximum voltage of 3.6V offers flexibility in various power supply circuits, accommodating diverse application needs.

Technical Specifications

Logic Gates 74LVC32AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74LVC32AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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