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74LVC245AMTR

STMicroelectronics

74LVC245AMTR by STMicroelectronics

74LVC245AMTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 6.3 ns, operating b/w 1.65V and 3.6V. It features a dual-port design and supports bidirectional data flow, making it ideal for high-speed communication in compact electronic systems. Its military-grade temperature range ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,067 parts In-Stock

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5,067

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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3,000

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Anansix

USA . 1,020 parts In-Stock

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Digiode

USA . 959 parts In-Stock

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959

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Connector Distribution Corp

USA . 10 parts In-Stock

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10

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Right Parts Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 455 parts In-Stock

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$5.760

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455

$5.760

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Andel Nordic

Denmark . 4,239 parts In-Stock

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$8.182

100+ parts

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$7.854

10k+ parts

$7.854

4,239

$8.182

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$7.854

$7.854

IDEA Electronic Components Group

UK . 1,226 parts In-Stock

1+ parts

$15.652

100+ parts

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$14.087

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$15.652

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$14.087

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Microchip USA

USA . 496 parts In-Stock

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$16.636

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496

$16.636

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AZTECH Wire

Italy . 1,070 parts In-Stock

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$21.580

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1,070

$21.580

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MKK Technologies

India . 1,056 parts In-Stock

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$29.432

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$29.432

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$29.432

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$29.432

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Kepictronics

USA . 46,000 parts In-Stock

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Metaverse IC Inc.

Canada . 40,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,019 parts In-Stock

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Corphita

USA . 1,507 parts In-Stock

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Parana Technologies

USA . 1,401 parts In-Stock

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$18.714

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$18.714

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Northwest PG Solutions

USA . 1,311 parts In-Stock

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$5.645

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$5.645

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Elevate your designs with the 74LVC245AMTR from STMicroelectronics—a trusted leader in semiconductor innovation. This high-performance bus driver and transceiver delivers unmatched reliability and speed with a low propagation delay, ensuring seamless data transfer in dynamic applications. Its compact design and robust features make it ideal for everything from consumer electronics to industrial automation. Choose STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 6.3 ns

A low propagation delay enhances performance in high-speed data communications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient utilization of board space.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space-saving layouts on printed circuit boards.

No. of Bits: 8

An 8-bit width allows for a wide range of data transmission, suitable for many digital applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V supports low-power applications and improves energy efficiency.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, making it easy to integrate into modern digital systems.

No. of Terminals: 20

With 20 terminals, the device provides ample connection options for versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for high-density placement on PCBs, saving space and reducing costs.

Maximum I (ol): 24 Amp

The ability to handle up to 24 Amps makes this driver robust enough for demanding applications.

Propagation Delay (tpd): 12 ns

A propagation delay of 12 ns supports fast switching speeds, essential for high-performance circuits.

Maximum Operating Temperature: 125 °C

Designed for high-temperature environments, ensuring reliable operation in harsh conditions.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in signal control and communication between multiple devices.

Minimum Operating Temperature: -55 °C

Operation at -55 °C allows this product to be utilized in extreme low-temperature applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning facilitates easier and more efficient mounting on various PCB layouts.

No. of Ports: 2

Having 2 ports allows for flexible data routing and communication in bidirectional systems.

Maximum Seated Height: 2.65 mm

A low seated height ensures a compact form factor without compromising functionality.

Width: 7.5 mm

The narrow width enables space-efficient designs in small electronic devices.

Output Polarity: TRUE

True output polarity simplifies integration with other logic devices in a system.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate down to 1.65V broadens the scope for low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

Accommodates modern soldering techniques, ensuring robust connections during assembly.

Peak Reflow Temperature °C: 260

Compatible with high-temperature soldering processes, ensuring reliability and durability of solder joints.

Length: 12.8 mm

The compact length is ideal for crowded circuit boards requiring efficient layout.

Temperature Grade: MILITARY

MILITARY grade components are designed for durability and reliability in extreme conditions.

Technology: CMOS

CMOS technology provides low power consumption and high integration, making it a preferred choice in digital applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical strength.

Packing Method: TR

Tape and reel packaging allows for automated assembly lines and easy handling.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, simplifying PCB design and layout.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities enhance communication versatility in various digital systems.

Control Type: COMMON CONTROL

Common control type simplifies the design process, allowing for straightforward system integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures suitable handling procedures to maintain performance and reliability during assembly.

Maximum Supply Voltage (Vsup): 3.6 V

Operating up to 3.6V allows compatibility with a range of devices, enhancing versatility.

Technical Specifications

Bus Driver & Transceivers 74LVC245AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

74LVC245AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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