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74LVC14ATTR

STMicroelectronics

74LVC14ATTR by STMicroelectronics

74LVC14ATTR by STMicroelectronics is a CMOS Schmitt Trigger with a propagation delay of just 5 ns, operating b/w 1.65V and 3.6V. It features six functions in a compact 14-terminal package, ideal for high-speed logic applications. Its robust design supports military-grade temperatures from -55 °C to 125°C.

Median Price

$0.133

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 27 parts In-Stock

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-

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$0.133

27

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$0.133

Distributors (In-Stock)

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Digiode

USA . 4,238 parts In-Stock

1+ parts

$0.390

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4,238

$0.390

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Vyrian

USA . 2,482 parts In-Stock

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2,482

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Anansix

USA . 1,708 parts In-Stock

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1,708

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Prism Electronics

USA . 36 parts In-Stock

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36

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Distributors (Availability)

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Corohmni

South Africa . 27 parts In-Stock

1+ parts

$0.289

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-

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27

$0.289

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Corphita

USA . 1,250 parts In-Stock

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$0.369

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1,250

$0.369

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Component Stockers USA

USA . 63 parts In-Stock

1+ parts

$0.400

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63

$0.400

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Northwest PG Solutions

USA . 1,673 parts In-Stock

1+ parts

$2.648

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$2.648

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Microchip USA

USA . 373 parts In-Stock

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$21.103

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373

$21.103

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IDEA Electronic Components Group

UK . 1,773 parts In-Stock

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$25.761

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$23.185

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1,773

$25.761

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$23.185

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$39.636

100+ parts

$36.069

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$32.502

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500

$39.636

$36.069

$32.502

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MKK Technologies

India . 723 parts In-Stock

1+ parts

$48.442

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723

$48.442

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DigiPath Technology Company

USA . 723 parts In-Stock

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$48.442

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$48.442

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QUARKTWIN TECHNOLOGY LTD

USA . 21,421 parts In-Stock

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Perfect Parts

USA . 20,905 parts In-Stock

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20,905

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Parana Technologies

USA . 1,688 parts In-Stock

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$30.801

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1,688

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$30.801

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Native Components

USA . 439 parts In-Stock

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$2.335

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439

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$2.335

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Overview

Unlock new possibilities in your designs with the 74LVC14ATTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile logic gate delivers exceptional performance and reliability, ideal for a wide range of applications from industrial automation to consumer electronics. Experience the benefits of fast propagation delays and robust temperature tolerance, ensuring your projects run smoothly under any conditions. Elevate your engineering game with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for varied applications.

Propagation Delay At Nominal Supply: 5 ns

The low propagation delay ensures fast signal processing, enhancing the overall speed of the digital circuit.

Surface Mount: YES

Surface mount capability allows for compact board designs and automated assembly, optimizing manufacturing efficiency.

No. of Functions: 6

With 6 functions, this logic gate offers versatility, enabling a wide range of logic configurations in a single package.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout design and space-saving on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V ensures compatibility with low-voltage systems, making this product energy-efficient.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable performance in various circuit loads, ensuring reliability in high-frequency applications.

Power Supplies (V): 3.3

Standard power supply voltage of 3.3V provides compatibility with most contemporary electronic designs.

No. of Terminals: 14

Having 14 terminals allows for more complex connections and integration into various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile optimize space on PCBs while maintaining a sleek design that's easy to integrate.

Propagation Delay (tpd): 14 ns

A propagation delay of 14 ns strikes a balance between speed and effectiveness, suitable for many high-speed applications.

Maximum Operating Temperature: 125 °C

Operating up to 125 °C demonstrates robustness, making this component suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product is ideal for extreme conditions found in military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances conductivity and prevents oxidation, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, enhancing design adaptability.

Maximum Seated Height: 1.2 mm

A low seated height minimizes profile in compact designs, contributing to thinner overall assembly.

Width: 4.4 mm

A compact width makes it suitable for densely packed PCBs, facilitating high-density designs.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65V broadens the range of compatibility for various low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum peak reflow temperature time of 30 seconds ensures compatibility with advanced PCB soldering techniques.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C ensures reliability during assembly processes.

Length: 5 mm

A small length allows for space-efficient designs and fitting into compact enclosures.

Temperature Grade: MILITARY

The military-grade temperature rating indicates enhanced durability and is suitable for defense and aerospace applications.

Schmitt Trigger: YES

Integration of a Schmitt trigger allows for cleaner signal transitions, reducing noise and improving signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal design ensures stable and reliable connections in various soldering processes.

Packing Method: TR

Tape and reel packing method facilitates automatic placement, increasing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for dense PCB layouts, accommodating modern compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

The flexibility to operate up to 3.6V expands the range of applications and circuit designs that can utilize this component.

Technical Specifications

Logic Gates 74LVC14ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC14ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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