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74LVC125ATTR

STMicroelectronics

74LVC125ATTR by STMicroelectronics

74LVC125ATTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 5.8 ns, operating b/w 1.65V and 3.6V. It features 4 functions in a compact 14-terminal package, ideal for high-speed data transmission in military applications. Its robust design supports temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 6,106 parts In-Stock

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Vyrian

USA . 4,860 parts In-Stock

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Bristol Electronics

USA . 3,186 parts In-Stock

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Dan-Mar Components

USA . 3,186 parts In-Stock

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Anansix

USA . 578 parts In-Stock

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Prism Electronics

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Digiode

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Semi Source

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Native Components

USA . 262 parts In-Stock

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$0.317

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$0.305

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Northwest PG Solutions

USA . 1,816 parts In-Stock

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$0.349

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$0.308

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Andel Nordic

Denmark . 5,787 parts In-Stock

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$3.899

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$3.743

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$3.743

AZTECH Wire

Italy . 314 parts In-Stock

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$11.210

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Microchip USA

USA . 266 parts In-Stock

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IDEA Electronic Components Group

UK . 1,840 parts In-Stock

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MKK Technologies

India . 2,232 parts In-Stock

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DigiPath Technology Company

USA . 2,232 parts In-Stock

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Perfect Parts

USA . 24,848 parts In-Stock

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Assy Fe

Spain . 15,000 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,646 parts In-Stock

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Overview

Unlock seamless connectivity with the 74LVC125ATTR from STMicroelectronics—a leader in innovation and reliability. Designed for efficiency, this high-performance bus driver excels in diverse applications, from automotive to industrial systems. Its compact form factor ensures easy integration while delivering rapid signal processing. Choose STMicroelectronics for exceptional quality and support, ensuring your projects thrive with unmatched performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and enhances thermal stability, making this product a reliable choice for various applications.

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay contributes to fast signal transmission, ideal for high-speed data communication systems.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCB layouts, saving board space.

No. of Functions: 4

Having multiple functions in a single package reduces components needed, leading to cost savings and simplified design.

Package Shape: RECTANGULAR

The rectangular shape is conducive for efficient use of PCB space and aligns well with standard mounting practices.

Nominal Supply Voltage / Vsup (V): 2.7

The standard nominal supply voltage ensures compatibility with a wide range of systems, providing flexibility in various applications.

Power Supplies (V): 3.3

A 3.3V power supply is common in digital circuits, making this driver suitable for integration with many existing systems.

No. of Terminals: 14

A sufficient number of terminals allows for comprehensive connectivity options in multi-channel applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for space-constrained designs, enabling miniaturization of electronic devices.

Maximum I (ol): 24 Amp

A high output current capability of 24 Amps ensures that this device can handle demanding loads in various applications.

Propagation Delay (tpd): 12 ns

A short propagation delay facilitates rapid signaling, making it suitable for fast processing applications.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature makes the product suitable for harsh environments, including industrial and automotive applications.

Output Characteristics: 3-STATE

The 3-state output capability allows for flexible bus sharing among multiple devices, enhancing communication efficiency.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures reliable performance in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Gold plating on terminals offers excellent conductivity and resistance to corrosion, improving long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatility in circuit design and easier routing of signals on PCBs.

No. of Ports: 2

Having two ports enhances interconnectivity options, enabling the device to be used in various configurations.

Maximum Seated Height: 1.2 mm

A low seated height supports compact design requirements, ideal for modern, slim-profile electronics.

Width: 4.4 mm

A narrow width allows for increased density in PCB layout, maximizing component placement efficiency.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels in digital circuits.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate at a minimum supply voltage of 1.65V provides flexibility for low-power applications.

Length: 5 mm

A compact length contributes to an overall reduction in PCB footprint, making it easy to design into tight spaces.

Temperature Grade: MILITARY

A military-grade rating indicates this product can withstand extreme conditions, ideal for defense and aerospace applications.

Technology: CMOS

CMOS technology enhances power efficiency and allows for high-speed operation, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and enhance mechanical stability, ensuring a reliable and rugged connection.

Packing Method: TR

Tape and reel packing provides convenient handling and automated assembly options, speeding up manufacturing processes.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65 mm allows for tighter layouts and increased density in modern electronic designs.

Control Type: ENABLE LOW

Low enable control simplifies interfacing with control logic, improving usability in embedded systems.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6V ensures versatility across various applications that require different voltage levels.

Technical Specifications

Bus Driver & Transceivers 74LVC125ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVC125ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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