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74LCX139TTR

STMicroelectronics

74LCX139TTR by STMicroelectronics

74LCX139TTR from STMicroelectronics is a CMOS decoder/driver with a fast propagation delay of 6.2 ns and operates at supply voltages b/w 2-3.6 V. It features a compact SOIC package, ideal for space-constrained applications. With dual functions and military-grade reliability, it's perfect for high-performance digital circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,650 parts In-Stock

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5,650

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Digiode

USA . 3,348 parts In-Stock

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3,348

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Anansix

USA . 2,205 parts In-Stock

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2,205

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 154 parts In-Stock

1+ parts

$7.835

100+ parts

-

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154

$7.835

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Native Components

USA . 101 parts In-Stock

1+ parts

$9.702

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-

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101

$9.702

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$10.670

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-

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687

$10.670

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Northwest PG Solutions

USA . 1,040 parts In-Stock

1+ parts

$10.672

100+ parts

$9.605

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-

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1,040

$10.672

$9.605

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IDEA Electronic Components Group

UK . 824 parts In-Stock

1+ parts

$29.597

100+ parts

-

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$26.638

10k+ parts

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824

$29.597

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$26.638

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MKK Technologies

India . 2,269 parts In-Stock

1+ parts

$55.656

100+ parts

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2,269

$55.656

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DigiPath Technology Company

USA . 2,269 parts In-Stock

1+ parts

$55.656

100+ parts

-

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2,269

$55.656

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Corphita

USA . 3,833 parts In-Stock

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3,833

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Parana Technologies

USA . 1,905 parts In-Stock

1+ parts

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$35.388

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1,905

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$35.388

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Perfect Parts

USA . 20 parts In-Stock

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20

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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9

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Overview

Unlock unparalleled performance with the 74LCX139TTR from STMicroelectronics—a leader in high-quality semiconductor solutions. Designed for efficiency, this decoder and driver excels in diverse applications, delivering swift response times and low power consumption. With its robust construction and military-grade reliability, you can trust in its durability. Elevate your projects with a component that combines innovation, precision, and exceptional value for maximum impact.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 6.2 ns

A low propagation delay indicates fast switching speed, enhancing performance in high-speed digital circuits.

Surface Mount: YES

Surface mount capability allows for compact design and efficient manufacturing processes, especially beneficial in high-density applications.

Input Conditioning: STANDARD

Standard input conditioning means it can work reliably with common input signals, making integration into existing systems easier.

No. of Functions: 2

The capability of performing two functions increases flexibility and reduces the need for multiple components in a design.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient use of space on PCBs while maintaining a sleek profile.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V is optimal for low-power applications, enhancing battery life in portable devices.

Power Supplies (V): 3.3

Compatibility with a 3.3V power supply makes it suitable for modern digital circuits and devices, ensuring widespread application.

No. of Terminals: 16

With 16 terminals, this device can accommodate a variety of connections, making it versatile for different use cases.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for space-saving designs, which are crucial in compact electronic devices.

Maximum I (ol): 24 Amp

A high maximum output current of 24 Amps ensures robust performance, suitable for applications requiring substantial power handling.

Propagation Delay (tpd): 7.3 ns

The propagation delay of 7.3 ns allows for rapid signal changes, supporting high-frequency operation and efficiency.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C enables use in harsh environments, adding reliability in extreme conditions.

Minimum Operating Temperature: -55 °C

A wide temperature range from -55 °C ensures functionality in cold environments, perfect for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating improves corrosion resistance and solderability, enhancing long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning offers flexible mounting options, facilitating easier integration into various PCB layouts.

Maximum Seated Height: 1.2 mm

A low seated height allows for integration in tight spaces, advantageous in compact and miniaturized electronic designs.

Width: 4.4 mm

A narrow width provides a sleek design and compatibility with high-density PCB layouts, promoting efficient use of space.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in certain applications requiring specific logic levels, increasing versatility.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V makes this device versatile and applicable in low-voltage systems.

Length: 5 mm

A compact length contributes to overall space savings in PCB layouts, essential for miniaturized electronic designs.

Temperature Grade: MILITARY

Military temperature grading denotes high reliability and durability under extreme environmental conditions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, ideal for modern digital designs.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, enhancing performance in various applications.

Packing Method: TR

The tray packing method allows for easy handling and automated assembly, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch provides a balance between compact layout and ease of soldering, facilitating efficient PCB design.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows compatibility with a wide range of voltage systems, enhancing utility in diverse applications.

Maximum Power Supply Current (ICC): 0.01 mA

Extremely low maximum power supply current maximizes energy efficiency, making it an excellent choice for battery-operated devices.

Technical Specifications

Decoder & Drivers 74LCX139TTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LCX139TTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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