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74LCX138MTC

Onsemi

74LCX138MTC by Onsemi

74LCX138MTC by Onsemi is a 16-terminal decoder with 6ns propagation delay, ideal for industrial applications. Operating at 2.5V to 3.6V, it offers inverted output polarity and standard input conditioning. With a compact design of 4.4mm width and 5mm length, this CMOS technology device is surface mountable and has a max seated height of 1.2mm.

Median Price

$0.342

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Arrow

USA . 30 parts In-Stock

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Adafruit Industries

USA . 2,500 parts In-Stock

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Rochester

USA . 45,218 parts In-Stock

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$0.255

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DigiKey

USA . 45,218 parts In-Stock

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Digiode

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Vyrian

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Bristol Electronics

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Forefront Electronics and Design

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DigiKey Marketplace

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

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PC Components Company LLC

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Carlin Systems, Inc.

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Corphita

USA . 1,698 parts In-Stock

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Component Stockers USA

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Corohmni

South Africa . 584 parts In-Stock

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Continental Prestige Electronics

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Native Components

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Cyclops Electronics Ltd (Excess)

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Speed Components Ltd (Excess)

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Supply Digital

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SupplyDigital Components

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UHIMA Technologies

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Overview

Unlock the power of efficient signal decoding with the 74LCX138MTC by Onsemi. Crafted with precision and quality, Onsemi's expertise shines through in this Decoder & Drivers category product. Perfect for a wide range of applications, this decoder offers fast propagation delays and a low nominal supply voltage, making it a valuable addition to any project. Experience seamless performance and reliability with the 74LCX138MTC, designed to elevate your electronics to the next level. Trust Onsemi for top-notch quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6 ns

The low propagation delay ensures fast processing and response times, making this decoder & driver efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage makes this product compatible with a wide range of applications, providing flexibility in design.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various input signals, making this decoder & driver versatile and widely usable.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easy to mount, making this product suitable for compact designs.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for stable performance and efficient signal transmission in the circuit.

Power Supplies (V): 3.3

The 3.3V power supply ensures reliable operation and compatibility with standard power sources.

No. of Terminals: 16

With 16 terminals, this decoder & driver can accommodate multiple input and output connections, enhancing connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB and allows for compact and efficient circuit designs.

Maximum I (ol): 24 Amp

The high maximum output current of 24 Amps enables this product to drive larger loads with ease and reliability.

Propagation Delay (tpd): 7.2 ns

With a propagation delay of 7.2 ns, this decoder & driver provides fast response times and efficient signal processing for optimal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows this product to function in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit layout and enables easy connection to other components.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm reduces the overall profile of the product, making it suitable for slim and compact designs.

Width: 4.4 mm

The narrow width of 4.4 mm enables the product to fit into tight spaces and facilitates efficient PCB layout.

Output Polarity: INVERTED

The inverted output polarity provides flexibility in signal processing and compatibility with various circuit configurations.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for operation in low-power applications and ensures energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product is easy to solder and integrate into manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering and robust connections during assembly.

Length: 5 mm

The compact length of 5 mm allows for space-saving installation and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that this product is designed to withstand harsh operating conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this decoder & driver offers low power consumption, high speed, and reliable performance, making it a popular choice for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and facilitates easy soldering, ensuring secure connections and robust assembly.

Packing Method: RAIL

The rail packing method allows for easy handling, storage, and transportation of the product, ensuring convenience in production and logistics.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enables dense packing of terminals on the PCB, maximizing connectivity and saving space in circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V provides headroom for input signals and ensures reliable operation within the specified voltage range.

Technical Specifications

Decoder & Drivers 74LCX138MTC attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX138MTC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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