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74LCX138M

Onsemi

74LCX138M by Onsemi

74LCX138M by Onsemi is a CMOS decoder with 6 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has inverted output polarity. With a small outline package style and surface mount capability, it offers high performance in compact designs.

Median Price

$0.804

Lifecycle Status

Suppliers In-Stock

33

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1k+

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Arrow

USA . 84 parts In-Stock

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$0.213

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Element14

Singapore . 1,257 parts In-Stock

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$0.833

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Chip1Stop

Japan . 84 parts In-Stock

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Rochester

USA . 40,787 parts In-Stock

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DigiKey

USA . 40,787 parts In-Stock

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Verical

USA . 31,089 parts In-Stock

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RS (Exports)

UK . 240 parts In-Stock

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$0.790

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Freelance Electronics

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Vyrian

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Digiode

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Ozdisan Elektronik

Türkiye . 26 parts In-Stock

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Chip Stock

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DigiKey Marketplace

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BCID Electronics Ltd.

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Semi Source

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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Anansix

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LIBRA Elektronik GmbH

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Bristol Electronics

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Flex Direct, LLC

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Atlantic Semiconductor

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LWI Electronics Inc

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Manoshevitz Elec. Sales

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Extreme Components

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ZD Integrated Circuits Inc.

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PC Components Company LLC

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J2 Sourcing AB

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Fibra_Brandt Electronic GMBH

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Inventory MP

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Lantek

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Corohmni

South Africa . 493 parts In-Stock

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Ampacity Inc.

Singapore . 21,336 parts In-Stock

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Corphita

USA . 7,303 parts In-Stock

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Native Components

USA . 1,270 parts In-Stock

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IDEA Electronic Components Group

UK . 1,344 parts In-Stock

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MKK Technologies

India . 811 parts In-Stock

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DigiPath Technology Company

USA . 811 parts In-Stock

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Continental Prestige Electronics

USA . 9,200 parts In-Stock

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Kulean Microsystems

USA . 7,632 parts In-Stock

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Problanco Electronics

Mexico . 6,929 parts In-Stock

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SupplyDigital Components

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Perfect Parts

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Kepictronics

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Authorized Procurement Solutions

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TANS Electronics

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Supply Digital

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Parana Technologies

USA . 2,117 parts In-Stock

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Northwest PG Solutions

USA . 1,793 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 528 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Microchip USA

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GreenTree Electronics

Israel . 176 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 38 parts In-Stock

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Fairview Electronics Ltd

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Overview

Unleash the power of precise decoding with the 74LCX138M by Onsemi. Crafted with superior quality and expertise, this decoder & driver offers lightning-fast propagation delay, making it perfect for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing existing systems, this product delivers unparalleled performance and reliability. Unlock the potential of your projects with the 74LCX138M and experience the difference that top-notch technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the decoder & drivers lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 6 ns

With a fast propagation delay of 6 ns at nominal supply voltage, this decoder & drivers offer quick response times, ensuring efficient operation.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage of 2.5V makes these decoder & drivers energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, these decoder & drivers can withstand harsh environmental conditions, making them reliable for industrial use.

Technical Specifications

Decoder & Drivers 74LCX138M attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX138M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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