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74LCX138MTR

STMicroelectronics

74LCX138MTR by STMicroelectronics

74LCX138MTR by STMicroelectronics is a CMOS decoder with a fast propagation delay of 6.7 ns, operating at supply voltages b/w 2-3.6 V. It features a compact SO package and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed digital applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,450 parts In-Stock

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2,450

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Anansix

USA . 2,285 parts In-Stock

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2,285

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Vyrian

USA . 168 parts In-Stock

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168

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Digiode

USA . 52 parts In-Stock

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52

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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Distributors (Availability)

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Native Components

USA . 35 parts In-Stock

1+ parts

$6.110

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35

$6.110

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IDEA Electronic Components Group

UK . 699 parts In-Stock

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$18.245

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$16.421

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699

$18.245

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$16.421

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MKK Technologies

India . 2,373 parts In-Stock

1+ parts

$34.309

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2,373

$34.309

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DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$34.309

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2,373

$34.309

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A-Z Elektronik GmbH

Germany . 5,249 parts In-Stock

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5,249

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Parana Technologies

USA . 1,861 parts In-Stock

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$21.815

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1,861

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$21.815

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Corphita

USA . 1,392 parts In-Stock

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1,392

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Northwest PG Solutions

USA . 629 parts In-Stock

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$5.988

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629

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$5.988

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Overview

Unlock the potential of your designs with the 74LCX138MTR from STMicroelectronics, a leader in high-performance semiconductor solutions. This versatile decoder offers rapid signal processing and enhanced reliability for diverse applications, from industrial control systems to consumer electronics. With its robust temperature range and compact design, it ensures seamless integration and long-lasting performance, making it the ideal choice for engineers seeking quality and innovation. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and longevity, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 6.7 ns

A low propagation delay leads to faster signal processing, enhancing the overall speed of electronic circuits.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern circuit designs, saving space and improving performance.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of inputs, simplifying integration into existing systems.

Package Shape: RECTANGULAR

The rectangular shape is efficient for layout in PCB designs, providing flexibility in placement and reducing board space.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V makes this product suitable for low-power applications, helping to extend battery life in portable devices.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with many standard logic levels, making it versatile for various electronic applications.

No. of Terminals: 16

With 16 terminals, the product offers multiple connection options, allowing for complex routing and feature integration.

Package Style (Meter): SMALL OUTLINE

The small outline package enables high-density mounting on PCBs, accommodating modern miniaturized designs.

Maximum I (ol): 24 Amp

A high output current capability of 24A allows the driver to support power-hungry devices, making it ideal for robust applications.

Propagation Delay (tpd): 7.9 ns

Quick propagation delay of 7.9 ns further enhances responsiveness and timing accuracy in digital circuits.

Maximum Operating Temperature: 125 °C

Operating at high temperatures (up to 125 °C) makes this product suitable for harsh environments and demanding applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55 °C, it can function in extreme cold, ideal for aerospace and defense applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent solderability and long-term reliability, enhancing the product's performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options, allowing for efficient board layout customization.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm contributes to a slim profile which is advantageous for space-constrained designs.

Width: 3.9 mm

At 3.9 mm wide, it is compact enough for tight packaging requirements while still accommodating robust functionalities.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in certain applications, allowing for flexibility in interfacing with various components.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V enhances its suitability for low-voltage applications, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, it is optimized for reliable soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, accommodating modern assembly standards.

Length: 9.9 mm

The compact length of 9.9 mm fits well in space-limited electronic designs, optimizing circuit layout efficiency.

Temperature Grade: MILITARY

The military-grade temperature specifications indicate high reliability in extreme conditions, making it suitable for defense applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this product a great choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a suitable surface for PCBs, enhancing reliability in connection.

Packing Method: TR

Tray packing (TR) allows for easier handling during assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for precise spacing in layouts, aiding in effective signal routing and component placement.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring that appropriate handling and storage practices can be applied.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V supports broader application compatibility, enhancing versatility in design.

Technical Specifications

Decoder & Drivers 74LCX138MTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

7.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX138MTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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