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74ALVCH16374TTR

STMicroelectronics

74ALVCH16374TTR by STMicroelectronics

74ALVCH16374TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 4.2 ns, supporting up to 8 bits. It operates b/w 1.65V and 3.6V, making it ideal for high-speed applications in compact designs. Its robust construction ensures reliability in military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,819 parts In-Stock

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Anansix

USA . 271 parts In-Stock

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Digiode

USA . 147 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 367 parts In-Stock

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$2.020

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367

$2.020

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Northwest PG Solutions

USA . 2,100 parts In-Stock

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$2.222

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$2.222

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Andel Nordic

Denmark . 2,416 parts In-Stock

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$2.878

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$2.763

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$2.763

2,416

$2.878

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$2.763

AZTECH Wire

Italy . 175 parts In-Stock

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$18.760

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175

$18.760

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IDEA Electronic Components Group

UK . 2,022 parts In-Stock

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$25.828

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$23.245

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$25.828

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$23.245

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MKK Technologies

India . 1,641 parts In-Stock

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$48.568

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$48.568

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DigiPath Technology Company

USA . 1,641 parts In-Stock

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$48.568

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$48.568

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QUARKTWIN TECHNOLOGY LTD

USA . 6,361 parts In-Stock

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Microchip USA

USA . 5,420 parts In-Stock

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Corphita

USA . 3,996 parts In-Stock

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Perfect Parts

USA . 1,518 parts In-Stock

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Parana Technologies

USA . 297 parts In-Stock

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$30.881

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Overview

Elevate your designs with the 74ALVCH16374TTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance bus driver and transceiver delivers unmatched speed and reliability, ideal for demanding applications like data communication and signal processing. Its compact, robust design ensures seamless integration while optimizing power efficiency. Experience superior quality and performance that empowers your projects to thrive, delivering exceptional value to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures that the product is robust and suitable for a variety of environments.

Propagation Delay At Nominal Supply: 4.2 ns

A low propagation delay enhances the speed of data transmission, making the device ideal for high-frequency applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and reduces assembly costs.

No. of Functions: 2

Having multiple functions enhances versatility and can simplify circuit design by reducing the number of components.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient space utilization on PCBs, allowing for dense circuit layouts.

No. of Bits: 8

An 8-bit width supports common data sizes, making the device compatible with a wide range of applications.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7 V enables low-power operation, making it suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures compatibility with various circuits while maintaining signal integrity.

Power Supplies (V): 3.3

Operating at 3.3 V power supplies makes this device compatible with most modern digital devices.

No. of Terminals: 48

With 48 terminals, the device offers extensive connectivity options for complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design are ideal for space-constrained applications.

Maximum I (ol): 24 Amp

A high output current capability of 24 Amp allows the device to handle demanding loads.

Propagation Delay (tpd): 6.5 ns

A propagation delay of 6.5 ns further enhances performance, providing fast signal response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates suitability for harsh environments and high-performance applications.

Output Characteristics: 3-STATE

3-state output characteristics help minimize bus contention in multi-device systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides reliable synchronization and minimizes the effects of signal noise.

Minimum Operating Temperature: -55 °C

Operating at very low temperatures enhances performance in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures excellent corrosion resistance and improves solderability.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and component placement.

No. of Ports: 2

Two ports allow for versatile data routing and communication between different parts of a system.

Maximum Seated Height: 1.2 mm

A low maximum seated height enhances compatibility with various compact designs.

Width: 6.1 mm

A width of 6.1 mm makes it suitable for dense applications where space is limited.

Output Polarity: TRUE

True output polarity ensures predictable and reliable signal levels.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65 V allows operation in low-power applications, extending battery life.

Length: 12.5 mm

A compact length of 12.5 mm is advantageous for modern electronics aimed at reducing size.

Temperature Grade: MILITARY

Military-grade temperature ratings assure reliability and performance in strict application environments.

Maximum Frequency At Nominal Supply: 300000000 Hz

A high maximum frequency capability enables the device to handle fast data rates efficiently.

Technology: CMOS

CMOS technology supports low power consumption while ensuring high performance and scalability.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and ease of soldering during assembly.

Packing Method: TR

Tape and reel packing ensures efficient handling and automated assembly in high-volume manufacturing.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact design layouts suitable for advanced PCB technology.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, which can be managed with appropriate packaging and handling.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for integration in various electronic systems.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16374TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

300000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74ALVCH16374TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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