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74ALVCH16245T

STMicroelectronics

74ALVCH16245T by STMicroelectronics

74ALVCH16245T by STMicroelectronics is a high-speed bus driver with a propagation delay of just 3 ns, supporting bidirectional data transfer. It operates at supply voltages b/w 1.65V and 3.6V, making it ideal for low-power applications. With a compact design and military-grade temperature range (-55 °C to 125 °C), it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,237 parts In-Stock

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7,237

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Digiode

USA . 4,866 parts In-Stock

1+ parts

-

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4,866

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Anansix

USA . 2,213 parts In-Stock

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2,213

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,233 parts In-Stock

1+ parts

$8.286

100+ parts

-

1k+ parts

$7.954

10k+ parts

$7.954

4,233

$8.286

-

$7.954

$7.954

IDEA Electronic Components Group

UK . 1,025 parts In-Stock

1+ parts

$14.724

100+ parts

-

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$13.251

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-

1,025

$14.724

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$13.251

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Microchip USA

USA . 456 parts In-Stock

1+ parts

$19.351

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-

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456

$19.351

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AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$22.090

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257

$22.090

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MKK Technologies

India . 326 parts In-Stock

1+ parts

$27.687

100+ parts

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326

$27.687

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DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$27.687

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326

$27.687

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Native Components

USA . 239 parts In-Stock

1+ parts

$128.390

100+ parts

-

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$123.254

239

$128.390

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$123.254

Northwest PG Solutions

USA . 956 parts In-Stock

1+ parts

$141.229

100+ parts

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956

$141.229

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Corphita

USA . 4,542 parts In-Stock

1+ parts

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4,542

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Parana Technologies

USA . 2,249 parts In-Stock

1+ parts

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100+ parts

$17.604

1k+ parts

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2,249

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$17.604

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Overview

Elevate your designs with the 74ALVCH16245T from STMicroelectronics—your go-to solution for high-performance bus driving and transceiving. Crafted with precision, this robust device ensures lightning-fast data transfer with minimal delay, perfect for cutting-edge applications in communications, automotive, and industrial sectors. Trust in STMicroelectronics’ legacy of quality and innovation to deliver reliability and efficiency, empowering you to achieve superior results effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 3 ns

With a low propagation delay, this product ensures fast signal processing, enhancing overall performance in high-speed applications.

Surface Mount: YES

The surface mount capability allows for compact PCB designs and automated assembly, improving manufacturing efficiency.

No. of Functions: 2

Having dual functions increases versatility, allowing multiple tasks to be handled by a single component, reducing board space requirements.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout design on PCBs and aids in optimized space usage.

No. of Bits: 8

An 8-bit configuration supports sufficient data handling, making it suitable for a wide range of applications including communication and data processing.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal voltage of 2.7V leads to lower power consumption, making this product energy-efficient and suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable operation under varied conditions, providing reliable performance.

Power Supplies (V): 3.3

Compatible with a 3.3V power supply, this product can be easily integrated into modern digital systems.

No. of Terminals: 48

A larger number of terminals enables more connections and functionalities in a single chip, promoting design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design help save space on PCB layouts, making it ideal for compact electronic devices.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amp, this product is capable of supporting high power applications, enhancing its applicability.

Propagation Delay (tpd): 6 ns

A propagation delay of 6 ns contributes to its suitability for high-speed communication systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can function reliably in extreme environments typical of industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for greater flexibility in design, enabling multiple outputs to share the same bus.

Minimum Operating Temperature: -55 °C

A wide temperature range from -55 °C to 125 °C makes this product suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options, enhancing design adaptability.

No. of Ports: 2

Having 2 ports enables bidirectional communication, enhancing the product's performance in data transfer applications.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm supports low-profile designs, ideal for compact electronic products.

Width: 6.1 mm

The 6.1 mm width provides a balanced footprint for integration into tight designs without compromising performance.

Output Polarity: TRUE

The true output polarity simplifies logic design, making it intuitive for engineers to work with.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a minimum supply voltage of 1.65V promotes compatibility with low-voltage systems, adding versatility.

Length: 12.5 mm

At 12.5 mm in length, this product is compact, contributing to space-saving designs.

Temperature Grade: MILITARY

Designed to meet military standards, this product is built for reliability and durability under extreme conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high density, enhancing performance and extending battery life.

Terminal Form: GULL WING

The gull wing terminal form allows for effective soldering, increasing manufacturing reliability.

Packing Method: TR

The tape and reel packing method facilitates efficient automation in handling and assembly.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser PCB layouts, providing flexibility in design.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances the product's functionality in communication and data transfer applications.

Control Type: COMMON CONTROL

Common control type simplifies the design process, providing ease of integration into existing systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V enables compatibility with higher voltage systems while maintaining operational integrity.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16245T attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ALVCH16245T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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