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74ALVCH16244TTR

STMicroelectronics

74ALVCH16244TTR by STMicroelectronics

74ALVCH16244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3 ns, supporting up to 24 A output. It operates b/w 1.65 V and 3.6 V, making it ideal for high-speed data applications in military environments. Its compact design features a thin profile and dual terminals for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,419 parts In-Stock

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Digiode

USA . 2,713 parts In-Stock

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2,713

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Anansix

USA . 602 parts In-Stock

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602

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Distributors (Availability)

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Andel Nordic

Denmark . 187 parts In-Stock

1+ parts

$6.903

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$6.627

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$6.627

187

$6.903

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$6.627

$6.627

IDEA Electronic Components Group

UK . 1,041 parts In-Stock

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$8.887

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-

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$7.998

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1,041

$8.887

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$7.998

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AZTECH Wire

Italy . 618 parts In-Stock

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$11.870

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$11.870

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MKK Technologies

India . 724 parts In-Stock

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$16.712

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$16.712

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DigiPath Technology Company

USA . 724 parts In-Stock

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$16.712

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724

$16.712

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Microchip USA

USA . 106 parts In-Stock

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$20.775

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Perfect Parts

USA . 2,941 parts In-Stock

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Northwest PG Solutions

USA . 1,013 parts In-Stock

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$3.384

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Native Components

USA . 407 parts In-Stock

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$3.349

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Corphita

USA . 155 parts In-Stock

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Parana Technologies

USA . 60 parts In-Stock

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$10.626

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Overview

Elevate your designs with the 74ALVCH16244TTR from STMicroelectronics—a trusted name in innovation and quality. This advanced bus driver & transceiver delivers exceptional performance with minimal propagation delays, ensuring seamless data transfer in your applications. Its compact, thin-profile package is perfect for space-constrained environments, making it ideal for consumer electronics, industrial automation, and telecommunications. Experience reliability and efficiency that enhance your projects, empowering you to push boundaries and achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and reliability, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 3 ns

A low propagation delay enhances the speed of data transfer, making the device ideal for high-speed applications.

Surface Mount: YES

Surface mount technology enables easier integration into tight spaces on PCBs, saving valuable board real estate.

No. of Functions: 4

This multi-functionality allows for versatility in design, reducing component count and aiding in a more efficient layout.

Package Shape: RECTANGULAR

The rectangular shape accommodates various PCB designs and provides a compact solution for connectivity.

No. of Bits: 4

The 4-bit configuration supports moderate data transmission, suitable for many standard applications.

Nominal Supply Voltage / Vsup: 2.7 V

The nominal supply voltage makes it compatible with a variety of low-voltage systems, ensuring energy efficiency.

Load Capacitance (CL): 50 pF

A lower load capacitance allows for faster switching times, improving overall performance in signal integrity.

Power Supplies (V): 3.3

Operating at 3.3V allows this device to interface seamlessly with modern digital logic levels.

No. of Terminals: 48

A higher number of terminals provides extensive connectivity options, making it versatile for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline design minimizes space requirements and is particularly suited for portable and compact devices.

Maximum I (ol): 24 Amp

The capability to handle high output current (24A) enables this device to be used in power-intensive applications.

Propagation Delay (tpd): 5.1 ns

An optimal propagation delay ensures fast data transmission, reducing latency in communication between devices.

Maximum Operating Temperature: 125 °C

A high operating temperature range increases the reliability of the product in extreme environments.

Output Characteristics: 3-STATE

3-state output allows for easier bus management, enabling multiple devices to connect without interference.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures functionality in cold climates, making this device robust in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances corrosion resistance and improves solderability, ensuring a reliable connection.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and reduce complexity in wiring configurations.

No. of Ports: 2

Two ports allow for bi-directional communication, enabling greater design flexibility in circuit configurations.

Maximum Seated Height: 1.2 mm

A low seated height is essential for ultra-thin designs, making it suitable for slim devices.

Width: 6.1 mm

A narrow width facilitates compact layouts, saving space and optimizing airflow in dense PCB designs.

Output Polarity: TRUE

The true output polarity ensures straightforward integration into systems that require standard logic levels.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage broadens compatibility with a variety of low-power applications.

Length: 12.5 mm

A compact length enhances design flexibility, accommodating diverse application sizes and layouts.

Temperature Grade: MILITARY

Military-grade specifications ensure higher reliability and performance under extreme conditions, suitable for critical applications.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operations, essential for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and make assembly processes simpler and more reliable.

Packing Method: TR

Tape and reel packing facilitates automatic insertion in manufacturing processes, increasing production efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density mounting on PCBs, catering to modern design trends.

Control Type: ENABLE LOW

The enable low control type provides simpler logic in circuit designs, enhancing usability and integration with other components.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures that the device can operate efficiently without risking damage.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ALVCH16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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