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74ACT16244TTR

STMicroelectronics

74ACT16244TTR by STMicroelectronics

74ACT16244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8 ns and operates at a nominal voltage of 5V. It features 4 functions, supports dual ports, and is ideal for high-speed data transmission in military applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,099 parts In-Stock

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3,099

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Vyrian

USA . 2,904 parts In-Stock

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2,904

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Anansix

USA . 1,734 parts In-Stock

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1,734

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Resion

USA . 352 parts In-Stock

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352

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,854 parts In-Stock

1+ parts

$9.971

100+ parts

-

1k+ parts

$9.572

10k+ parts

$9.572

5,854

$9.971

-

$9.572

$9.572

IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$14.697

100+ parts

-

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$13.227

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919

$14.697

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$13.227

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AZTECH Wire

Italy . 318 parts In-Stock

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$18.280

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318

$18.280

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MKK Technologies

India . 2,143 parts In-Stock

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$27.637

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2,143

$27.637

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DigiPath Technology Company

USA . 2,143 parts In-Stock

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$27.637

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2,143

$27.637

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Microchip USA

USA . 344 parts In-Stock

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$48.126

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344

$48.126

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Native Components

USA . 290 parts In-Stock

1+ parts

$68.984

100+ parts

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$66.225

290

$68.984

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$66.225

Northwest PG Solutions

USA . 384 parts In-Stock

1+ parts

$75.883

100+ parts

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384

$75.883

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Component Stockers USA

USA . 561 parts In-Stock

1+ parts

$99.990

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561

$99.990

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Corphita

USA . 3,783 parts In-Stock

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3,783

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Parana Technologies

USA . 1,325 parts In-Stock

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$17.572

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1,325

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$17.572

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Overview

Elevate your designs with the 74ACT16244TTR from STMicroelectronics—where quality meets innovation. This robust bus driver and transceiver features a sleek, compact design perfect for space-constrained applications, delivering unparalleled performance in signal integrity and speed. Trust in STMicroelectronics’ reputation for excellence to enhance your projects across automotive, industrial, and consumer electronics, ensuring reliability and efficiency every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliable performance in a range of environmental conditions.

Propagation Delay At Nominal Supply: 8 ns

The low propagation delay enhances signal speed and efficiency, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space utilization on printed circuit boards.

No. of Functions: 4

This product supports multiple functions, providing flexibility for complex electronic designs.

Package Shape: RECTANGULAR

The rectangular shape is versatile and typically optimized for efficient layout on a PCB.

No. of Bits: 4

With four bits, the device can manage substantial data width for various applications while maintaining low power consumption.

Nominal Supply Voltage / Vsup (V): 5

The standard nominal supply voltage of 5V makes this product compatible with a wide range of existing systems.

Power Supplies (V): 5

Operating with standard 5V power supplies minimizes additional design considerations for power regulation.

No. of Terminals: 48

A higher number of terminals enables greater connectivity options for complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact packaging style is advantageous for space-constrained applications and contributes to lower overall system size.

Maximum I (ol): 24 Amp

The high output current capability is ideal for driving loads in demanding applications, providing reliable performance.

Propagation Delay (tpd): 10.3 ns

With a propagation delay of 10.3 ns, this product maintains fast switching speeds for efficient data handling.

Maximum Operating Temperature: 125 °C

Rated for a high operating temperature ensures reliable performance in challenging thermal environments.

Output Characteristics: 3-STATE

3-state output characteristics allow for better control in bus configurations, enabling sharing of data lines among multiple devices.

Minimum Operating Temperature: -55 °C

The extended temperature range allows for use in extremely cold environments, making it suitable for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions allow for versatile placements on PCBs, enabling more efficient designs.

No. of Ports: 2

With two ports, it enables communication between two devices, enhancing connectivity options in applications.

Maximum Seated Height: 1.2 mm

The low seated height is beneficial for low-profile designs, contributing to slimmer device profiles.

Width: 6.1 mm

Compact width allows for increased design flexibility, particularly in space-constrained applications.

Output Polarity: TRUE

True output polarity facilitates straightforward integration with various circuit configurations.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage ensures compatibility with a wider range of power sources.

Peak Reflow Temperature °C: 260

The high reflow temperature rating is suitable for robust manufacturing processes, ensuring reliability in production.

Length: 12.5 mm

Compact length contributes to minimal space usage on PCB, supporting high-density designs.

Temperature Grade: MILITARY

The military-grade specification ensures reliability and performance under harsh environmental conditions.

Technology: CMOS

CMOS technology provides low static power consumption while maintaining high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form promotes ease of soldering and improved mechanical support, enhancing assembly reliability.

Packing Method: TR

Tape and reel packing allows for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact layout and enables efficient routing on densely populated PCBs.

Control Type: ENABLE LOW

Low-enable control type simplifies circuit logic, making it easier to integrate with existing designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for some headroom in power supply variations, ensuring stable operation.

Technical Specifications

Bus Driver & Transceivers 74ACT16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

10.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ACT16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-628-1689, 5962016281689

NIIN

016281689

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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