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74AC245TTR

STMicroelectronics

74AC245TTR by STMicroelectronics

74AC245TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 11.5 ns, operating at supply voltages of 3.3V to 6V. It features a dual-port design and supports bidirectional data flow, ideal for high-speed communication in military applications. Its compact SOIC package ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,792 parts In-Stock

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6,792

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Anansix

USA . 1,571 parts In-Stock

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1,571

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Digiode

USA . 318 parts In-Stock

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318

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 276 parts In-Stock

1+ parts

$0.665

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-

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276

$0.665

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Northwest PG Solutions

USA . 435 parts In-Stock

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$0.732

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435

$0.732

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Andel Nordic

Denmark . 502 parts In-Stock

1+ parts

$8.007

100+ parts

-

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$7.687

10k+ parts

$7.687

502

$8.007

-

$7.687

$7.687

AZTECH Wire

Italy . 1,062 parts In-Stock

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$11.840

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1,062

$11.840

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IDEA Electronic Components Group

UK . 1,368 parts In-Stock

1+ parts

$13.241

100+ parts

-

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$11.917

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1,368

$13.241

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$11.917

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MKK Technologies

India . 1,663 parts In-Stock

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$24.898

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1,663

$24.898

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DigiPath Technology Company

USA . 1,663 parts In-Stock

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$24.898

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1,663

$24.898

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Microchip USA

USA . 457 parts In-Stock

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$29.718

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457

$29.718

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Component Stockers USA

USA . 481 parts In-Stock

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$99.990

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481

$99.990

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Corphita

USA . 3,489 parts In-Stock

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3,489

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Parana Technologies

USA . 2,066 parts In-Stock

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$15.831

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2,066

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$15.831

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Overview

Unlock seamless data communication in your designs with the 74AC245TTR from STMicroelectronics. Renowned for exceptional quality and innovation, STMicroelectronics delivers this robust bus driver & transceiver to ensure efficient, reliable performance in demanding applications. With its compact design, low propagation delay, and wide voltage compatibility, the 74AC245TTR enhances system efficiency, empowering you to achieve greater reliability and speed in your projects. Choose excellence; experience the STMicroelectronics advantage!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making the product suitable for a range of applications.

Propagation Delay At Nominal Supply: 11.5 ns

With a low propagation delay, this device supports fast data transfer rates, enhancing overall system performance.

Surface Mount: YES

The surface mount design allows for more compact circuit layouts and easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, accommodating more components.

No. of Bits: 8

An 8-bit architecture enables the product to handle a significant amount of data simultaneously, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes this product compatible with many low-power digital circuits, conserving energy.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V operation adds versatility, allowing integration into different systems easily.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for various interfacing needs in applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style makes it ideal for applications with space constraints, while also ensuring high performance.

Maximum I (ol): 12 Amp

The capacity to handle up to 12 Amps ensures that this device can support high current loads without compromising performance.

Propagation Delay (tpd): 11.5 ns

With consistent propagation delay, users can optimize system timing and performance, particularly in high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this product to perform reliably in extreme thermal environments.

Output Characteristics: 3-STATE

The 3-state output feature enables effective bus sharing, making it suitable for multi-device communication.

Minimum Operating Temperature: -55 °C

With a tolerance for very low temperatures, this product is suitable for harsh environments, including military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances reliability and reduces oxidation, ensuring better connectivity over time.

Terminal Position: DUAL

The dual terminal position design allows for flexible mounting and easy integration into various circuit designs.

No. of Ports: 2

Having multiple ports enhances communication capabilities, making it ideal for applications that require multiple connections.

Maximum Seated Height: 1.2 mm

The low seated height contributes to a compact layout, making this component ideal for tight spaces in electronic designs.

Width: 4.4 mm

The narrow width aids in minimizing space usage on a PCB, allowing for a more efficient design layout.

Output Polarity: TRUE

True output polarity ensures that the driver can properly communicate in a standard digital logic environment.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for compatibility with various power sources, enhancing flexibility in design.

Length: 6.5 mm

The compact length supports high-density circuit board designs, ideal for modern electronic applications.

Temperature Grade: MILITARY

The military-grade temperature classification signifies superior reliability and robustness under extreme conditions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption while maintaining high speed and performance.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and mechanical strength, enhancing assembly reliability.

Packing Method: TR

The TR packing method simplifies handling and manufacturing processes, improving supply chain efficiency.

Terminal Pitch: 0.65 mm

A fine terminal pitch is ideal for high-density applications, making the component suitable for state-of-the-art electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities enhance the versatility of the device in various type of applications.

Control Type: COMMON CONTROL

The common control type allows for streamlined operation across multiple devices, simplifying design complexity.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of up to 6V adds flexibility in system design while accommodating various power levels.

Technical Specifications

Bus Driver & Transceivers 74AC245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74AC245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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