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SPC58EC80E3F0C1X

STMicroelectronics

SPC58EC80E3F0C1X by STMicroelectronics

SPC58EC80E3F0C1X by STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like CAN and UART. With a wide operating temp range (-40 °C to 105 °C) and low power consumption (1.2V nominal), it's perfect for reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,951 parts In-Stock

1+ parts

-

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8,951

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Digiode

USA . 4,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,187

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Anansix

USA . 1,466 parts In-Stock

1+ parts

-

100+ parts

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1,466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$11.780

100+ parts

-

1k+ parts

-

10k+ parts

-

388

$11.780

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IDEA Electronic Components Group

UK . 1,343 parts In-Stock

1+ parts

$28.790

100+ parts

-

1k+ parts

$25.911

10k+ parts

-

1,343

$28.790

-

$25.911

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MKK Technologies

India . 1,513 parts In-Stock

1+ parts

$54.139

100+ parts

-

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1,513

$54.139

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DigiPath Technology Company

USA . 1,513 parts In-Stock

1+ parts

$54.139

100+ parts

-

1k+ parts

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10k+ parts

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1,513

$54.139

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Microchip USA

USA . 2,101 parts In-Stock

1+ parts

$55.348

100+ parts

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2,101

$55.348

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Corphita

USA . 1,808 parts In-Stock

1+ parts

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1,808

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Parana Technologies

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

$34.423

1k+ parts

-

10k+ parts

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1,092

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$34.423

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Overview

Unlock unparalleled performance with the SPC58EC80E3F0C1X microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for automotive applications, this robust 32-bit unit excels in reliability and efficiency, ensuring optimal operation even in extreme environments. Benefit from its rich set of integrated features, including extensive connectivity and powerful processing capabilities, empowering your designs with cutting-edge technology tailored for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material is suitable for various environments, ensuring long-lasting performance.

Integrated Cache: YES

The presence of integrated cache improves processing efficiency by reducing access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

This low maximum supply voltage enhances energy efficiency, making it suitable for battery-powered devices.

On Chip Data RAM Width: 8

With 8-bit data RAM width, the microcontroller efficiently handles data processing for various applications.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability in automotive applications.

Package Shape: SQUARE

Square packages are easy to mount and optimize layout on PCBs, simplifying assembly.

Bit Size: 32

A 32-bit architecture provides increased performance compared to 8 or 16-bit microcontrollers, allowing for more complex computations.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style aids in thermal management and compact assembly in dense applications.

Minimum Supply Voltage: 1.14 V

A wide power supply range allows for flexibility in design and operation across various conditions.

Maximum Operating Temperature: 105 °C

This high operating temperature rating ensures reliable performance in harsh environments.

CPU Family: E200Z4

Part of a proven family, which guarantees compatibility and performance for complex applications.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, making it ideal for applications in outdoor or industrial automation.

ADC Channels: YES

Integrated ADC channels facilitate direct conversion of analog signals to digital data, simplifying system design.

DMA Channels: YES

Direct Memory Access (DMA) increases data throughput, freeing up the CPU for other tasks.

Terminal Position: QUAD

Quad terminals provide better connectivity and stability on printed circuit boards.

ROM Words: 4194304

Ample ROM storage allows for complex applications and firmware updates, enhancing product lifespan.

Maximum Seated Height: 1.2 mm

The low profile of the package is advantageous for applications requiring compact integration.

Width: 14 mm

This compact width makes it easier to fit onto smaller circuit boards without sacrificing functionality.

Data EEPROM Size: 128K

Sufficient EEPROM size for storing configuration settings and data retention even during power loss.

Boundary Scan: YES

Facilitates testing and debugging processes, simplifying production and reducing costs.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals broadens application possibilities, making it flexible for diverse tasks.

Maximum Clock Frequency: 40 MHz

High clock frequency enables faster processing, enhancing overall system performance.

Length: 14 mm

Minimal length contributes to a compact design, favorable for space-efficient projects.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables efficient instruction execution, leading to better performance in embedded systems.

No. of Timers: 12

Multiple timers allow for extensive timing control options, critical for time-sensitive applications.

RAM Bytes: 393216

Large RAM capacity supports complex algorithms and data processing, ideal for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide enhanced solder joint reliability and ease of assembly.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs allow for precise data acquisition from analog sensors, useful in applications requiring accuracy.

Maximum Supply Current: 50 mA

Low maximum supply current ensures better energy efficiency, extending battery life in portable devices.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage enhances compatibility with low-power systems and reduces overall energy use.

No. of DMA Channels: 64

64 DMA channels provide versatile data handling capabilities, improving data transfer efficiency.

No. of Serial I/Os: 26

A significant number of serial I/O options allows for versatile connections with various communication protocols.

PWM Channels: YES

PWM capability makes it excellent for controlling motors and other devices requiring variable power.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options ensure compatibility with a wide range of sensors and devices in multiple applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, enhancing product versatility.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for greater density of connections, optimizing the use of PCB space.

Format: FLOATING POINT

Floating-point format improves the processing of mathematical calculations and data handling in complex applications.

Speed: 160 rpm

Offers adequate speed for various applications, catering to both high and low-speed operational needs.

Low Power Mode: YES

Low power mode extends battery life and reduces heat generation, making it suitable for long-term usage in low-energy applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for the storage of easily manageable firmware, enhancing application performance.

Technical Specifications

Microcontrollers SPC58EC80E3F0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E3F0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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