Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI32170-C-GM1 by Silicon Labs is a telecom IC with 42 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package is ideal for industrial telecom applications due to its compact size and surface mount capability.
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Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.
The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving design.
Operating at a low nominal supply voltage of 3.3V helps in reducing power consumption and heat generation, making it energy-efficient.
The industrial temperature grade ensures reliable operation in harsh environments with temperature fluctuations, making it suitable for industrial applications.
Other Function Telecom Interface ICs SI32170-C-GM1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
JESD-30 Code:
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SI32170-C-GM1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
ROHM
Silicon Standard
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3203F
Idec
ROTARY SWITCH;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
BAV99
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
CYBT-353027-02
Infineon Technologies
Infineon's CYBT-353027-02 is a square-shaped, surface-mountable telecom IC with 19 terminals. Operating b/w -30°C to 85°C, it has a seated height of 1.75mm and terminal pitch of 1.05mm. Ideal for telecom circuits, this microelectronic assembly is suitable for various applications requiring compact design and reliable performance.
USB3740B-AI9-TR
USB3740B-AI9-TR by Microchip is a telecom IC with 10 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is ideal for telecom circuit applications.
WL1837MODGIMOCT
Texas Instruments
WL1837MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for industrial applications requiring high-speed communication in compact spaces.
SJA1105ELY
NXP Semiconductors
NXP Semiconductors' SJA1105ELY is a telecom IC with AEC-Q100 screening. It features TIN SILVER COPPER terminal finish, 260°C peak reflow temp, and MSL of 3. Ideal for telecom circuit applications requiring high reliability in automotive environments.
RCB-F9T-0
U-blox Ag
TELECOM CIRCUIT;
SN65DSI83TPAPRQ1
SN65DSI83TPAPRQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 105°C, with a data rate of 1 Mbps and nominal voltage of 1.8V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.
450-0178R
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TMS3705EDRQ1
TMS3705EDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring AEC-Q100 screening level in a small outline package.
BMD-340-A-R
BMD-340-A-R by U-blox Ag is a surface mount telecom IC with a data rate of 2 Mbps. It operates in industrial temperature range (-40 to 85°C) and has MSL level 3. Ideal for applications requiring high-speed data transmission in harsh environments.
BGT24LTR11N16E6327XTSA1
BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.
ZOE-M8G-0
ZOE-M8G-0 by U-blox Ag is a telecom IC with 51 terminals in a square grid array package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 1.8V and thin profile design, it's ideal for telecom circuit applications.
BGM15MA12E6327XTSA1
BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.
WFM200S022XNA3R
Silicon Labs
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
HT12D(18DIP)
Holtek Semiconductor
HT12D(18DIP) by Holtek Semiconductor is a CMOS telecom IC with 18 terminals. It operates at temperatures from -20°C to 70°C and supports power supplies of 2.4V to 12V. This rectangular, plastic package is ideal for telecom circuit applications.
OPA380AIDGKTG4
OPA380AIDGKTG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at temperatures from -40 to 125°C. It features a supply voltage of 3/5V, low supply current of 0.0088mA, and is designed for automotive applications. This CMOS technology IC comes in a small outline package with gull wing terminals and is suitable for telecom circuits.
BMD-345-A-R
453-00059C
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
MAYA-W160-00B
PN5321A3HN/C106;55
NXP Semiconductors' PN5321A3HN/C106;55 is a telecom IC with 40 terminals, operating b/w -30 to 85°C. It has a nominal voltage of 3.4V and terminal pitch of 0.5mm. This chip carrier package is suitable for various telecom circuit applications due to its compact size and surface mount capability.
CYBLE-416045-02
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 43; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SI32170-C-GM1R
SI32919-A-FSR
Other Telecom ICs;
SI32391-B-GM
Skyworks Solutions
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SI32391-B-FM
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SI32919-A-FS
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Package Code: SOP; Maximum Operating Temperature: 70 Cel; Terminal Pitch: 1.27 mm; Maximum Seated Height: 1.75 mm;
SI32919-A-GS
SI32170-C-FM1
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 42; Package Code: HVBCC; Package Shape: RECTANGULAR;
SI32171-C-FM1
SI32172-C-FM1
SI32172-C-GM1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 42; Package Code: HVBCC; Package Shape: RECTANGULAR;
SI32173-C-FM1
SI32175-C-FM1
SI32176-C-FM1
SI32176-C-GM1
SI32177-C-FM1
SI32177-C-GM1
SI32171-C-GM1R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 42; Package Code: VFLGA; Package Shape: RECTANGULAR;
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