Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLS-0116-T-10 is a 16-contact IC socket with gold finish for SIP16 devices. It features a plastic housing and rectangular contact configuration. Ideal for chip carrier applications, this component offers reliable connectivity in electronic systems.
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Netroflash
The plastic housing material provides durability and protection for the chip carrier, ensuring a long lifespan for the product.
Designed specifically for SIP16 devices, ensuring a perfect fit and optimal performance.
With 16 contacts, this chip carrier socket can accommodate a wide variety of integrated circuits, making it versatile for different applications.
The gold mating finish provides excellent conductivity and reliability for optimal signal transfer, especially with the thickness of 30µm.
Having gold termination finish ensures a secure connection and prevents corrosion, leading to stable performance over time.
Being an IC socket type, this product allows for easy insertion and removal of integrated circuits, facilitating maintenance and upgrades.
The rectangular contact configuration ensures a precise alignment of the chip carrier, minimizing the risk of misalignment and potential damage during installation.
Chip Carrier IC & Component Sockets HLS-0116-T-10 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
HLS-0116-T-10 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EU2B-YS303C
Idec
ROTARY SWITCH;
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
Goodwork Semiconductor
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
Lite-on Semiconductor
LAN8720AI-CP-TR
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Hitano Enterprise
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
SD-110-G-22-N
Samtec
SD-110-G-22-N by Samtec is a Chip Carrier IC Socket with 20 contacts, rated for 1A current. Featuring rectangular contact configuration and body dimensions of 1" length, 0.2" width, and 0.175" depth. It is used in DIP20 devices with a mating pitch of 0.1".
304-13-104-41-780000
Mill-max Mfg
Mill-max Mfg's 304-13-104-41-780000 is a POLYETHYLENE IC SOCKET for SIP4 devices with 4 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets, featuring RECTANGLE contact configuration.
XR2A-2465
Omron
IC SOCKET; Manufacturer Series: XR2;
2-1571552-4
TE Connectivity
TE Connectivity's 2-1571552-4 is a Chip Carrier IC Socket with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for DIP16 devices, it has a temperature range from -55°C to 105°C and dielectric voltage withstand of 1400VAC.
808-AG11D
Abb Installation Products
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
8444-21B1-RK-TR
3m Electronic Products Division
IC SOCKET; Housing Material: GLASS FILLED POLYPHENYLENE SULFIDE; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): MATTE TIN (160) OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0; No. of Contacts: 44;
251-5949-01-0602
The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.
PTF08A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 8; Contact Material: NOT APPLICABLE;
18364
Vicor
IC SOCKET; Device Type Used On: SIP5; Maximum Operating Temperature: 120 Cel; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
ICF-624-F-O
Samtec's ICF-624-F-O is a Chip Carrier IC Socket with 24 contacts, 15.24mm PCB row spacing, and liquid crystal polymer housing. It features gold flash over nickel contact finish, suitable for DIP24 devices in applications requiring a current rating of 1A and operating temperatures from -55°C to 125°C.
P3G-08
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
P2RF-08
XR2A-6411-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
PT14
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;
27E152
TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.
173-10-318-00-001000
173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
110-87-308-41-001101
Preci-dip Sa
110-87-308-41-001101 by Preci-dip Sa is a DIP8 IC socket with 7.62mm PCB contact row spacing and Beryllium Copper contacts. It features a housing made of Polycyclohexydimethylene Terephthalate-Polyester, gold flash mating contact finish, and can withstand temperatures from -55 to 125 °C. Ideal for applications requiring reliable connections in electronic devices.
27390
Struthers-dunn
RELAY SOCKET; Manufacturer Series: 27390; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 12; Additional Features: POLARIZED;
54020-32030LF
Amphenol Communications Solutions
The Amphenol Communications Solutions 54020-32030LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a dielectric voltage of 910VAC and insulation resistance of 1G ohm. Ideal for chip carrier applications, it operates b/w -40°C to 105°C with a current rating of 1A.
2-1437539-9
TE Connectivity 2-1437539-9 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular contact pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The socket has a housing made of polyester and operates within -55 to 125°C temperature range, terminated by soldering with insulation resistance of 5G ohm.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLS-0403-G-2
IC SOCKET; Device Type Used On: PGA12; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
HLS-0116-G-11
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-G-14
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED; No. of Contacts: 16;
HLS-0116-G-30
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
HLS-0116-G-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; No. of Contacts: 16; Contact Finish (Termination): GOLD;
HLS-0116-G-35
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-G-3
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; No. of Contacts: 16; Contact Finish (Termination): Gold (Au);
HLS-0116-S-22
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Contact Config: RECTANGLE;
HLS-0116-T-12
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Config: RECTANGLE;
HLS-0116-T-14
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
HLS-0116-T-2-L
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; Contact Finish (Mating): GOLD (30); Contact Config: RECTANGLE;
HLS-0116-T-22
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30); No. of Contacts: 16; JESD-609 Code: e4;
HLS-0116-T-30
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Additional Features: LOWPROFILE;
HLS-0116-T-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; JESD-609 Code: e4; No. of Contacts: 16; Contact Finish (Termination): GOLD;
HLS-0116-T-35
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-T-3
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Finish (Mating): GOLD (30); No. of Contacts: 16; JESD-609 Code: e4;
HLS-0116-TT-18
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; JESD-609 Code: e3;
HLS-0116-TT-2
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; No. of Contacts: 16; Contact Finish (Termination): Tin (Sn); Contact Material: NOT SPECIFIED;
HLS-0116-TT-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin (Sn);
HLS-0116-T-19
IC SOCKET; Device Type Used On: SIP16; Contact Material: NOT SPECIFIED; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Finish (Mating): GOLD (30);
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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