Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLS-0116-T-10 is a 16-contact IC socket with gold finish for SIP16 devices. It features a plastic housing and rectangular contact configuration. Ideal for chip carrier applications, this component offers reliable connectivity in electronic systems.
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Vyrian
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Astute Electronics Inc
Nova Conductors
AZTECH Wire
$5.320
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$5.010
$4.910
Argo Parts USA
Continental Prestige Electronics
Netroflash
The plastic housing material provides durability and protection for the chip carrier, ensuring a long lifespan for the product.
Designed specifically for SIP16 devices, ensuring a perfect fit and optimal performance.
With 16 contacts, this chip carrier socket can accommodate a wide variety of integrated circuits, making it versatile for different applications.
The gold mating finish provides excellent conductivity and reliability for optimal signal transfer, especially with the thickness of 30µm.
Having gold termination finish ensures a secure connection and prevents corrosion, leading to stable performance over time.
Being an IC socket type, this product allows for easy insertion and removal of integrated circuits, facilitating maintenance and upgrades.
The rectangular contact configuration ensures a precise alignment of the chip carrier, minimizing the risk of misalignment and potential damage during installation.
Chip Carrier IC & Component Sockets HLS-0116-T-10 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
HLS-0116-T-10 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WT
Yangzhou Yangjie Electronics
2N7002
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
XR2A-2205
Omron
IC SOCKET; Manufacturer Series: XR2;
1-1393143-7
TE Connectivity
IC SOCKET; Housing Material: POLYESTER; No. of Contacts: 16; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
DRSED
Crydom
RELAY SOCKET; Manufacturer Series: ED; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): NOT APPLICABLE;
XR2A-4202
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
XR2A-4021-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4;
M12883/45-01
First Switchtech
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD;
XR2H-2811-N
08-3518-10M
Aries Electronics
The Aries Electronics 08-3518-10M is a chip carrier IC socket with a rectangular PCB contact pattern and a 7.62mm row spacing. It is used for DIP18 devices, has 8 contacts, and can handle a current rating of 3A. Its housing material is nylon46 and it has a max operating temperature of 105°C.
8PFA
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
RXZE2M114
Schneider Electric Sa
RELAY SOCKET;
HLT-1217-T-T
Samtec
The Samtec HLT-1217-T-T is a plastic IC socket with 204 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA204 devices, it offers reliable connectivity with Tin-Ni termination. Ideal for chip carrier applications requiring high contact count and secure connections.
416-43-226-41-001000
Mill-max Mfg
The Mill-max Mfg 416-43-226-41-001000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
ICA-314-JGG-H
Samtec's ICA-314-JGG-H is a 14-contact IC socket with brass contacts and gold over nickel mating finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for chip carrier IC applications requiring reliable connections with gold termination finish.
XR2A-2015
3-1393143-2
IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
DIL16SMDM
Fischer Elektronik & Kg
IC SOCKET; Device Type Used On: DIP16; Contact Finish (Termination): Tin (Sn); No. of Contacts: 16; Contact Finish (Mating): GOLD; JESD-609 Code: e3;
95.05SPA
Finder
RELAY SOCKET; Housing Material: PLASTIC; No. of Contacts: 8;
XR2C-1611-N
IC SOCKET; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
510-93-168-17-101002
Mill-max Mfg 510-93-168-17-101002 is a Chip Carrier IC Socket with 168 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It is used on PGA168 devices with rectangular PCB contact pattern and polycyclohexydimethylene terephthalate-polyester housing material.
110-93-628-41-801000
110-93-628-41-801000 by Mill-max Mfg is a Chip Carrier IC Socket with 28 contacts. It features Gold over Nickel contact finish for mating and Tin/Lead with Nickel barrier for termination. Ideal for DIP28 devices, this plastic housing socket is designed for rectangular contact configuration.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLS-0403-G-2
IC SOCKET; Device Type Used On: PGA12; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
HLS-0116-G-11
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-G-14
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED; No. of Contacts: 16;
HLS-0116-G-30
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
HLS-0116-G-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; No. of Contacts: 16; Contact Finish (Termination): GOLD;
HLS-0116-G-35
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-G-3
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; No. of Contacts: 16; Contact Finish (Termination): Gold (Au);
HLS-0116-S-22
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Contact Config: RECTANGLE;
HLS-0116-T-12
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Config: RECTANGLE;
HLS-0116-T-14
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
HLS-0116-T-2-L
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; No. of Contacts: 16; Contact Finish (Mating): GOLD (30); Contact Config: RECTANGLE;
HLS-0116-T-22
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30); No. of Contacts: 16; JESD-609 Code: e4;
HLS-0116-T-30
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Additional Features: LOWPROFILE;
HLS-0116-T-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; JESD-609 Code: e4; No. of Contacts: 16; Contact Finish (Termination): GOLD;
HLS-0116-T-35
IC SOCKET; Device Type Used On: SIP16; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e4; No. of Contacts: 16;
HLS-0116-T-3
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Finish (Mating): GOLD (30); No. of Contacts: 16; JESD-609 Code: e4;
HLS-0116-TT-18
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; JESD-609 Code: e3;
HLS-0116-TT-2
IC SOCKET; Device Type Used On: SIP16; Housing Material: PLASTIC; No. of Contacts: 16; Contact Finish (Termination): Tin (Sn); Contact Material: NOT SPECIFIED;
HLS-0116-TT-32
IC SOCKET; Device Type Used On: SIP16; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin (Sn);
HLS-0116-T-19
IC SOCKET; Device Type Used On: SIP16; Contact Material: NOT SPECIFIED; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Finish (Mating): GOLD (30);
Supply Digital Components
$106.00
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