Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec APO-320-G-H is a 20-contact IC socket with brass contacts finished in gold over nickel. It features a polyester housing and is designed for DIP20 devices. Ideal for chip carrier applications due to its rectangular contact configuration and reliable gold finish.
Median Price
$6.160
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Netroflash
Polyester material provides good insulation and heat resistance, ensuring the chip carrier socket is durable and reliable.
Designed specifically for DIP20 devices, ensuring a perfect fit and secure connection for the integrated circuits.
Brass contacts offer excellent conductivity and corrosion resistance, ensuring reliable electrical connections.
With 20 contacts, this chip carrier socket can accommodate a wide range of integrated circuit devices, making it versatile and practical.
The gold and nickel plating on the contacts provides excellent conductivity and corrosion resistance, ensuring reliable connections for mating.
The gold and nickel plating on the contacts for termination ensures a durable and long-lasting connection for the integrated circuits.
Designed specifically as an IC socket, ensuring compatibility with a wide range of integrated circuit devices.
The rectangle contact configuration ensures a secure and stable connection for the integrated circuits, reducing the risk of signal loss or interference.
Chip Carrier IC & Component Sockets APO-320-G-H attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APO-320-G-H Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
Surge Components
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
1N4148
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
DS18B20U
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Won-top Electronics
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Kingwell Technonlogy
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
PY08QN2-Y1
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
PY08QN
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
1-1393824-0
TE Connectivity
IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
PYFZ-08
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
326-93-108-41-003000
Mill-max Mfg
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
210-93-308-41-001000
210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
PY11QN2-Y1
RELAY SOCKET;
1-390262-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
HLT-1910-G-T
Samtec
The Samtec HLT-1910-G-T is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability.
1-1814655-5
TE Connectivity's 1-1814655-5 is a SIP20 IC socket with 20 contacts, rated at 1A current. It features thermoplastic polyester housing, solder termination, and rectangular PCB contact pattern. With a dielectric voltage of 1400VAC, it operates b/w -55°C to 125°C, ideal for chip carrier applications.
P6D-04P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
2-1571552-8
TE Connectivity's 2-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and uses thermoplastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55 to 105°C.
1-390261-3
TE Connectivity 1-390261-3 is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It has a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP14 devices, it features a rectangular contact pattern and uses solder termination.
95.05
Finder
Finder's 95.05 is a RELAY SOCKET with 8 SQ PIN-SKT contacts rated at 10A. It operates b/w -40°C to 70°C, featuring SNAP ON termination and a compact body measuring 3.09" x 0.622" x 2.965". Ideal for chip carrier IC applications due to its high current capacity and temperature range suitability.
HLT-1719-T-R
Samtec's HLT-1719-T-R is a plastic IC socket for PGA323 devices with 323 brass contacts. Features tin over nickel mating finish and tin with nickel termination. Ideal for chip carrier applications, offering reliable connectivity and durability in electronic assemblies.
XR2B-1611-N
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
APA-320-G-A1
Samtec APA-320-G-A1 is a 20-contact IC socket with brass contacts finished in gold over nickel. Its polyester housing makes it suitable for DIP20 devices. The rectangular contact configuration and gold termination enhance its performance in chip carrier applications.
A20-LC-TT
Assmann Wsw Components
A20-LC-TT by Assmann Wsw Components is a DIP20 IC socket with 20 contacts made of phosphor bronze and tin finish. Its housing material is polybutylene terephthalate, suitable for chip carrier applications. The contact configuration is rectangular, making it ideal for secure connections in electronic devices.
299-43-314-10-001000
The Mill-max Mfg 299-43-314-10-001000 is a plastic chip carrier IC socket with a DIP14 device type. It has a mating contact pitch of 0.1 inch and can handle a current rating of 3A. This IC socket is commonly used for right angle mounting in various electronic applications.
27E892
TE Connectivity's 27E892 is a POLYAMIDE chip carrier socket with 11 BLADE PIN-SKT contacts for RELAY devices. Featuring SCREW termination, it is ideal for IC SOCKET applications.
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APO-320-G-A1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; JESD-609 Code: e4; Contact Config: RECTANGLE;
APO-320-G-A
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Termination): GOLD OVER NICKEL; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APO-320-G-C
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: BRASS; Contact Finish (Termination): GOLD OVER NICKEL; JESD-609 Code: e4;
APO-320-G-J
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Terminal Pitch (mm): 2.54;
APO-320-G-R
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 20;
APO-320-G-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APO-320-T-A1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: BRASS; Contact Config: RECTANGLE; JESD-609 Code: e3;
APO-320-T-A
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): TIN OVER NICKEL (50);
APO-320-T-C
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): TIN OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0;
APO-320-T-H
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Config: RECTANGLE;
APO-320-T-R
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): TIN OVER NICKEL;
APO-320-T-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0;
APO-324-G-A1
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 24; Contact Finish (Termination): GOLD OVER NICKEL;
APO-324-G-A
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4;
APO-324-G-C
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0;
APO-324-G-H
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Material: BRASS; Additional Features: STANDARD: UL 94V-0;
APO-324-G-J
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Mating Contact Pitch (inch): 0.1;
APO-324-G-R
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Material: BRASS; Contact Config: RECTANGLE; JESD-609 Code: e4;
APO-320-G-B
IC SOCKET; Device Type Used On: DIP20; Contact Material: BRASS; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 20;
APO-324-G-B
IC SOCKET; Device Type Used On: DIP24; No. of Contacts: 24; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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