Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec APO-320-G-H is a 20-contact IC socket with brass contacts finished in gold over nickel. It features a polyester housing and is designed for DIP20 devices. Ideal for chip carrier applications due to its rectangular contact configuration and reliable gold finish.
Median Price
$6.160
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AZTECH Wire
$12.050
Argo Parts USA
Continental Prestige Electronics
Netroflash
Polyester material provides good insulation and heat resistance, ensuring the chip carrier socket is durable and reliable.
Designed specifically for DIP20 devices, ensuring a perfect fit and secure connection for the integrated circuits.
Brass contacts offer excellent conductivity and corrosion resistance, ensuring reliable electrical connections.
With 20 contacts, this chip carrier socket can accommodate a wide range of integrated circuit devices, making it versatile and practical.
The gold and nickel plating on the contacts provides excellent conductivity and corrosion resistance, ensuring reliable connections for mating.
The gold and nickel plating on the contacts for termination ensures a durable and long-lasting connection for the integrated circuits.
Designed specifically as an IC socket, ensuring compatibility with a wide range of integrated circuit devices.
The rectangle contact configuration ensures a secure and stable connection for the integrated circuits, reducing the risk of signal loss or interference.
Chip Carrier IC & Component Sockets APO-320-G-H attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APO-320-G-H Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
Won-top Electronics
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
XR2A-4221-N
Omron
IC SOCKET; Manufacturer Series: XR2;
69802-044LF
Amphenol Communications Solutions
Amphenol's 69802-044LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for surface mount applications, it offers high insulation resistance and dielectric voltage withstand capabilities.
95.15.2SMA
Finder
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
VCF4-1002
TE Connectivity
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
XR2C-1011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10);
69802-144LF
Amphenol's 69802-144LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts made of PHOSPHOR BRONZE, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for surface mount applications, it offers high insulation resistance and dielectric voltage withstand capabilities.
ZA8-20-2-1.00-Z-10
Samtec
IC SOCKET;
ICF-328-T-O-TR
Samtec's ICF-328-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It utilizes liquid crystal polymer housing material and has a mating contact pitch of 0.1 inch. Ideal for DIP28 devices, it offers surface mount termination and operates b/w -55°C to 125°C.
XR2A-2478
ICF-316-T-I-TR
Samtec's ICF-316-T-I-TR is a Chip Carrier IC Socket with 16 contacts, rated at 1A. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP16 devices. With liquid crystal polymer housing and surface mount termination, it operates b/w -55°C to 125°C, making it ideal for various electronic applications.
P7S-14F-END
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 14;
PR3-BSC1/2X21
Phoenix Contact
RELAY SOCKET;
XR2A-1421-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER;
350-10-117-00-001000
Mill-max Mfg
350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
342-90-139-00-591000
Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
326-93-109-41-002000
Mill-max Mfg 326-93-109-41-002000 is a PLASTIC IC SOCKET for SIP9 devices with 9 BERYLLIUM COPPER contacts. Features Tin/Lead finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
XR2T-3211-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T;
60431011
Aptiv
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
XR2A-1811-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
115-47-632-41-003000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Material: NOT SPECIFIED; Contact Finish (Termination): TIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APO-320-G-A1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; JESD-609 Code: e4; Contact Config: RECTANGLE;
APO-320-G-A
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Termination): GOLD OVER NICKEL; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APO-320-G-C
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: BRASS; Contact Finish (Termination): GOLD OVER NICKEL; JESD-609 Code: e4;
APO-320-G-J
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Terminal Pitch (mm): 2.54;
APO-320-G-R
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 20;
APO-320-G-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APO-320-T-A1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: BRASS; Contact Config: RECTANGLE; JESD-609 Code: e3;
APO-320-T-A
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): TIN OVER NICKEL (50);
APO-320-T-C
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): TIN OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0;
APO-320-T-H
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Config: RECTANGLE;
APO-320-T-R
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): TIN OVER NICKEL;
APO-320-T-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0;
APO-324-G-A1
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 24; Contact Finish (Termination): GOLD OVER NICKEL;
APO-324-G-A
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4;
APO-324-G-C
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0;
APO-324-G-H
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Material: BRASS; Additional Features: STANDARD: UL 94V-0;
APO-324-G-J
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Mating Contact Pitch (inch): 0.1;
APO-324-G-R
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYESTER; Contact Material: BRASS; Contact Config: RECTANGLE; JESD-609 Code: e4;
APO-320-G-B
IC SOCKET; Device Type Used On: DIP20; Contact Material: BRASS; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 20;
APO-324-G-B
IC SOCKET; Device Type Used On: DIP24; No. of Contacts: 24; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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