Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Device Type Used On: DIP24; No. of Contacts: 24; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4;
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Chip Carrier IC & Component Sockets APO-324-G-B attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
JESD-609 Code:
Compatible Device Type:
APO-324-G-B Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
BAV99LT1G
Onsemi
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Diodes Incorporated
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
LM555CMX
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
ULN2803ADWRG4
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
Alpha & Omega Semiconductor
CC0603KRX7R9BB103
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Starsea Electronics
XR2A-2468
Omron
IC SOCKET; Manufacturer Series: XR2;
228-1371-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 228-1371-00-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold-plated contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
551-10-155-18-121004
Mill-max Mfg
Mill-max Mfg's 551-10-155-18-121004 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni) and termination finish, housed in POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications.
110-13-628-41-001000
110-13-628-41-001000 by Mill-max Mfg is a PCT POLYESTER Chip Carrier IC Socket for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for electronic applications requiring reliable connections in integrated circuits.
XR2D-0804
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
510-93-168-17-101001
IC SOCKET; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED;
1-822473-7
TE Connectivity
TE Connectivity 1-822473-7 is a PLCC84 IC socket with POLYETHYLENE housing. Featuring 84 contacts, it has an insulation resistance of 1G ohm and dielectric voltage of 830VAC. Ideal for applications requiring a straight mounting style, this socket operates b/w -20°C to 85°C and can handle up to 1A current rating.
27E121
TE Connectivity's 27E121 is a Chip Carrier IC Socket with NYLON housing. It features 11 RND PIN-SKT contacts, rated for 15A current, and SCREW termination. Ideal for use on RELAY devices, this IC SOCKET measures 3.15" x 1.7" x 0.895", making it suitable for various electronic applications.
XR2T-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
8134-HC-5P2
TE Connectivity's 8134-HC-5P2 chip carrier socket features PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. With a wide temperature range (-65 to 125°C), it is ideal for IC applications requiring high insulation resistance (1G ohm) in straight mounting setups.
ICF-624-TM-O-TR
Samtec
ICF-624-TM-O-TR by Samtec is a chip carrier IC socket with 24 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is made of liquid crystal polymer. This socket is used on DIP24 devices and can operate in temperatures ranging from -55°C to 125°C.
114-87-624-41-117101
Preci-dip Sa
IC SOCKET; Device Type Used On: DIP24; Housing Material: PCT POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 24; Contact Finish (Mating): NOT SPECIFIED;
P2RFZ-05-E
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
P2R-05P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 5; Contact Finish (Termination): NOT APPLICABLE;
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
ICA-308-JGG
Samtec's ICA-308-JGG is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features wire wrap termination, gold over nickel finish, and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring a mating pitch of 0.1 inch and dielectric voltage of 1400VAC.
150-10-316-00-006101
150-10-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts plated with GOLD. It has 16 contacts for chip carrier ICs and components, suitable for various electronic applications requiring reliable connections.
93.01.7.024
Finder
RELAY SOCKET; Device Type Used On: RELAY;
PF113A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
XR2A-2205
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