Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Sockets and Chip Carriers;
Median Price
$1.078
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
< 1k
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Continental Prestige Electronics
$1.056
Argo Parts USA
Netroflash
$1.024
$1.003
AZTECH Wire
$13.287
D01-997.2042 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Harwin is a world-leading specialist in reliable and high-performance technologies for demanding applications. Through innovation, advanced technologies, service and inspiration we help customers to realize competitive advantage by solving demanding connectivity challenges. Harwin aim to be the first-choice supplier of mission-critical and high-performance connectivity solutions. We keep investing in the latest computer aided design and engineering facilities to drive advancements and retain our position as the industry’s innovators. We also replace equipment on a five-year cycle.
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
Bytesonic Electronics
SR3P-05
Idec
Idec's SR3P-05 chip carrier IC socket has 11 RND PIN-SKT contacts, rated for 10A current. With a temperature range of -5 to 40°C, it is ideal for relay applications requiring secure screw terminations. Measuring 2.165" x 1.654" x 1.122", this RELAY SOCKET offers reliable connectivity in various electronic devices.
GFZ-30-03-G-10-AD
Samtec
The Samtec GFZ-30-03-G-10-AD is an IC socket with 300 contacts, made of beryllium copper with gold over nickel finish. It is designed for LGA300 devices and features a housing material of liquid crystal polymer. Ideal for chip carrier applications due to its high-quality contact materials and construction.
40-6508-311
Aries Electronics
Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
XR2B-2401-N
Omron
IC SOCKET; Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
PLCC-032-F-N-TR
The Samtec PLCC-032-F-N-TR is a Chip Carrier IC Socket with 32 contacts, made of Liquid Crystal Polymer. It has a bellowed contact style and gold flash over nickel finish. Suitable for PLCC32 devices, it operates b/w -65°C to 110°C, ideal for applications requiring a current rating of 1A.
110-87-320-41-001101
Preci-dip Sa
110-87-320-41-001101 by Preci-dip Sa is a DIP20 IC socket with 20 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. With a PCB contact row spacing of 7.62mm, it is ideal for applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
4-1437508-0
TE Connectivity
TRANSISTOR SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
3-1437530-5
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Additional Features: UL94V-0; No. of Contacts: 20;
XR2D-0804
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
XR2C-3215
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
27E152
TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.
HLT-1719-T-R
Samtec's HLT-1719-T-R is a plastic IC socket for PGA323 devices with 323 brass contacts. Features tin over nickel mating finish and tin with nickel termination. Ideal for chip carrier applications, offering reliable connectivity and durability in electronic assemblies.
XR2A-2205
IC SOCKET; Manufacturer Series: XR2;
1-1437539-7
TE Connectivity 1-1437539-7 is a DIP14 IC SOCKET with 14 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses solder termination. This chip carrier socket is commonly used in applications requiring a mating contact pitch of 0.1 inch and operates within -55 to 105°C temperature range.
PLCC-032-T-N
Samtec's PLCC-032-T-N is a 32-contact IC socket with Liquid Crystal Polymer housing. Featuring bellowed contact style, it operates b/w -55°C to 105°C. Ideal for PLCC32 devices, it has surface mount termination and measures 0.7" x 0.8" x 0.2".
788-312
Wago
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
PT14
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;
PYF08M
RELAY SOCKET;
GFZ-30-01-G-10-AD
The Samtec GFZ-30-01-G-10-AD is a Chip Carrier IC Socket with 300 contacts. It features Beryllium Copper contact material and Gold over Nickel finish for mating. Designed for LGA300 devices, it utilizes Liquid Crystal Polymer housing material for high performance in electronic applications.
4-1571552-8
TE Connectivity's 4-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and PCT-plastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55°C to 105°C.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
D01-9923246
Harwin PLC
IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
D01-9922046
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYAMIDE46; No. of Contacts: 20; Contact Material: NOT APPLICABLE; Additional Features: 94V-0;
D01-997.3242
D01-9972021
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Manufacturer Series: D01-997; Contact Finish (Termination): Tin/Lead (Sn/Pb); Contact Finish (Mating): NOT SPECIFIED;
D01-9972101
IC SOCKET; Device Type Used On: SIP21; Housing Material: POLYESTER; Manufacturer Series: D01-997; No. of Contacts: 21; Contact Finish (Mating): NOT SPECIFIED;
D01-9972121
IC SOCKET; Device Type Used On: SIP21; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; No. of Contacts: 21;
D01-9972221
IC SOCKET; Device Type Used On: SIP22; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 22;
D01-9972301
IC SOCKET; Device Type Used On: SIP23; Housing Material: POLYESTER; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0;
D01-9972321
IC SOCKET; Device Type Used On: SIP23; Housing Material: POLYESTER; No. of Contacts: 23; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
D01-9972401
IC SOCKET; Device Type Used On: SIP24; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Manufacturer Series: D01-997; No. of Contacts: 24;
D01-9972421
IC SOCKET; Device Type Used On: SIP24; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 24;
D01-9972521
IC SOCKET; Device Type Used On: SIP25; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED; Manufacturer Series: D01-997;
D01-9972601
IC SOCKET; Device Type Used On: SIP26; Housing Material: POLYESTER; No. of Contacts: 26; Additional Features: STANDARD: UL 94V-0; Manufacturer Series: D01-997;
D01-9972621
IC SOCKET; Device Type Used On: SIP26; Housing Material: POLYESTER; Manufacturer Series: D01-997; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
D01-9972701
IC SOCKET; Device Type Used On: SIP27; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 27;
D01-9972721
IC SOCKET; Device Type Used On: SIP27; Housing Material: POLYESTER; Manufacturer Series: D01-997; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0;
D01-9972801
IC SOCKET; Device Type Used On: SIP28; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Manufacturer Series: D01-997; Contact Finish (Mating): NOT SPECIFIED;
D01-9972821
IC SOCKET; Device Type Used On: SIP28; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Manufacturer Series: D01-997; Contact Finish (Mating): NOT SPECIFIED;
D01-9972901
IC SOCKET; Device Type Used On: SIP29; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 29;
D01-9972921
IC SOCKET; Device Type Used On: SIP29; Housing Material: POLYESTER; No. of Contacts: 29; Manufacturer Series: D01-997; Contact Material: NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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