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NM27C256QM250

Rochester Electronics

NM27C256QM250 by Rochester Electronics

UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,855 parts In-Stock

1+ parts

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2,855

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Digiode

USA . 312 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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312

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Vyrian

USA . 182 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 263 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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263

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Technical Specifications

EPROM NM27C256QM250 attributes and parameters. Explore more EPROM devices from Rochester Electronics

Specs

Maximum Access Time:

250 ns

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

5.72 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

NM27C256QM250 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Rochester Electronics

For over 40 years Rochester's growing supplier authorizations enable us to provide the world's largest source of semiconductors. In partnership with over 70 leading component manufacturers, we provide our valued customers with a continuous source of critical semiconductors. Today the Rochester Semiconductor Lifecycle Solution™ offers the world’s largest range of semiconductors with over 15 billion finished devices in stock, combined with extensive manufacturing capabilities from the world's largest die bank at over 12 Billion. Rochester’s growing product and service portfolio continues to provide an authorized source of supply to customers around the world directly, in partnership with our authorized distribution network and through leading-edge e-commerce platforms.

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