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KU80386EXTC33

Rochester Electronics

KU80386EXTC33 by Rochester Electronics

KU80386EXTC33 by Rochester Electronics is a 32-bit microprocessor with 26-bit address bus width and 16-bit external data bus width. Operating at a max clock frequency of 66 MHz, it is ideal for industrial applications requiring low power mode and boundary scan capability. The processor features a quad terminal position in a flatpack package style, suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

USA . 128 parts In-Stock

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128

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Vyrian

USA . 90 parts In-Stock

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90

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Fibra_Brandt Electronic GMBH

Germany . 16 parts In-Stock

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LWI Electronics Inc

India . 7 parts In-Stock

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Ampacity Inc.

Singapore . 583 parts In-Stock

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$1.000

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$1.000

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Corohmni

South Africa . 190 parts In-Stock

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$21.191

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MARBEL Systems

Belgium . 672 parts In-Stock

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$23.865

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Texas Native Microelectronics

USA . 687 parts In-Stock

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$27.431

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$24.139

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Kenton Components

USA . 2,881 parts In-Stock

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$32.917

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$28.967

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Qasali Group International

UK . 862 parts In-Stock

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$74.064

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$65.176

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Alle Elektronik GmbH

Germany . 4,351 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 1,498 parts In-Stock

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Continental Prestige Electronics

USA . 1,191 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Corphita

USA . 69 parts In-Stock

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Netroflash

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Overview

Unlock the full potential of your electronics with the KU80386EXTC33 by Rochester Electronics. As a leading manufacturer in the industry, Rochester Electronics guarantees top-notch quality and reliability. This microprocessor offers unparalleled performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value, benefits, and advantages to customers looking to take their projects to the next level. Experience the difference with the KU80386EXTC33 and elevate your electronics game today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the microprocessor lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and allows for reliable operation in various conditions.

Address Bus Width: 26

The wide address bus width of 26 bits enables the microprocessor to access a large memory space, facilitating complex computing tasks and data processing.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board, making it ideal for compact electronic devices.

Bit Size: 32

The 32-bit size of the microprocessor allows for handling larger chunks of data at once, improving overall processing speed and efficiency.

No. of Terminals: 132

The ample number of terminals provides connectivity options for various peripherals and components, enhancing the versatility of the microprocessor.

Package Style (Meter): FLATPACK

The flatpack package style offers a slim profile, reducing the overall footprint of the microprocessor on the circuit board and enabling space-saving designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures efficient power consumption and allows for operation in power-constrained environments.

Maximum Operating Temperature: 117 °C

The high maximum operating temperature of 117°C ensures reliability and performance in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 117°C enables the microprocessor to function reliably in extreme temperature conditions.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections to the circuit board, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57mm enables slim and compact device designs, ideal for space-constrained applications.

Width: 24.13 mm

The moderate width of 24.13mm offers a balance between space efficiency and connectivity options, suitable for a wide range of device sizes.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer between the microprocessor and external peripherals, improving overall system performance.

Maximum Clock Frequency: 66 MHz

The high maximum clock frequency of 66 MHz allows for fast processing speeds, suitable for demanding computational tasks and real-time data processing.

Length: 24.13 mm

The compact length of 24.13mm offers a balanced form factor for easy integration into various electronic devices, without compromising on performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the microprocessor suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor specifically designed for peripheral control, this IC type is optimized for efficient data processing and communication with external devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the circuit board, enhancing signal integrity and reducing the risk of signal loss.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard and widely compatible with existing power supply systems, ensuring easy integration and reliable operation.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting on the circuit board, maximizing connectivity options in a limited space.

Format: FIXED POINT

The fixed-point format simplifies arithmetic calculations and data processing, making the microprocessor ideal for applications that require precise numerical operations.

Speed: 33 rpm

The speed of 33 rpm indicates the processing efficiency of the microprocessor, suitable for moderate to high-speed applications that require quick data analysis and response.

Low Power Mode: YES

The low power mode option helps in reducing power consumption during idle or low-demand periods, enhancing energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors KU80386EXTC33 attributes and parameters. Explore more Microprocessors devices from Rochester Electronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Low Power Mode:

YES

No. of Terminals:

132

Maximum Operating Temperature:

117 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

4.57 mm

Speed:

33 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

KU80386EXTC33 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-485-0289, 5962014850289

NIIN

014850289

Manufacturer Highlights

Rochester Electronics

For over 40 years Rochester's growing supplier authorizations enable us to provide the world's largest source of semiconductors. In partnership with over 70 leading component manufacturers, we provide our valued customers with a continuous source of critical semiconductors. Today the Rochester Semiconductor Lifecycle Solution™ offers the world’s largest range of semiconductors with over 15 billion finished devices in stock, combined with extensive manufacturing capabilities from the world's largest die bank at over 12 Billion. Rochester’s growing product and service portfolio continues to provide an authorized source of supply to customers around the world directly, in partnership with our authorized distribution network and through leading-edge e-commerce platforms.

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