Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Boundary Scan: YES;
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Microprocessors R7S721030VLFP#YJ0 attributes and parameters. Explore more Microprocessors devices from Renesas Electronics
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R7S721030VLFP#YJ0 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
Micro Commercial Components
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
P1022NXN2HFB
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPC860TCZQ50D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MCIMX6U5EVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MPC823VR81B2T
MPC823VR81B2T by Freescale Semiconductor is a CMOS microprocessor with a max peak reflow temperature of 260°C. It has a moisture sensitivity level of 3 and is commonly used in various applications requiring RISC-based peripheral ICs.
AM5706BCBDDA
Texas Instruments AM5706BCBDDA microprocessor features 32-bit external data bus, 16-bit address bus, and integrated cache. Ideal for industrial applications with low power mode, operating temperature range of -40 to 105 °C, and max clock frequency of 32 MHz.
CS80C286-25
Rochester Electronics
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;
MIMXRT1166DVM6A
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6S1AVM08AC
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
ATSAMA5D36A-CNR
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
AM3352BZCZA100
AM3352BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
MCF54455VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
P2041NXN7NNC
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;
AT91SAM9G45-CU
Microchip Technology
AT91SAM9G45-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 50 MHz, 37 DMA channels, and operates in low power mode. This processor is commonly used in applications requiring high-speed processing and low power consumption.
SCC68070CCA84
Philips Semiconductors
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
MCF5327CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
AM3894CCYG135
The Texas Instruments AM3894CCYG135 is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 27 MHz, suitable for applications requiring high-speed processing. With a package style of grid array, fine pitch, it is ideal for use in devices where compact size and efficient performance are essential.
MCIMX6X2AVN08AB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
SPC5123YVY400B
NXP Semiconductors' SPC5123YVY400B microprocessor features 32-bit address and external data bus width, with a max clock frequency of 35 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85°C and offers low power mode for energy efficiency.
MPC860PCVR50D4
NXP Semiconductors' MPC860PCVR50D4 microprocessor features 32-bit address and external data bus width, operates at a max clock frequency of 50 MHz. Ideal for applications requiring low power mode, it is a RISC-based processor with integrated cache and boundary scan capabilities.
MPC8313EVRAFFC
The NXP Semiconductors MPC8313EVRAFFC is a 32-bit microprocessor with integrated cache and 66.67 MHz max clock frequency. It operates at a voltage range of 0.95V to 1.05V, suitable for low power mode applications in various electronic devices requiring high-speed processing capabilities. The package style is grid array with heat sink/slug, making it ideal for compact designs with limited space constraints.
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R7S721021VLFP#AA1
Renesas Electronics
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;
R7S721001VCBG
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;
R7S721010VCFP
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 256; Package Code: LFQFP; Package Shape: SQUARE;
R7S721020VLFP#AA1
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP176,1.0SQ,20;
R7S721034VCBG#AC0
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 176; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
R7S721030VLFP
R7S721030VLFP#AA0
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Speed: 400 rpm;
R7S721031VCBG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 233; Package Code: LFBGA; Package Shape: SQUARE; Width: 15 mm;
R7S721000VCFP
R7S721011VCBG
R7S721021VLFP
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; RAM Words: 3145728;
R7S721030VCFP#AA0
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
R7S721020VLFP
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; RAM Words: 3145728;
R7S721020VCBG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 176; Package Code: LFBGA; Package Shape: SQUARE; Low Power Mode: YES;
R7S721030VCBG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 176; Package Code: LFBGA; Package Shape: SQUARE; RAM Words: 3145728;
R7S721021VCFP
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE; Boundary Scan: YES;
R7S721000VCBG
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
R7S721030VCBG#AC0
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 176; Package Code: LFBGA; Package Shape: SQUARE;
R7S721020VCFP
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Width: 24 mm;
Supply Digital Components
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12,000 In-Stock
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