Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Length: 6 mm;
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Other Function Memory ICs M30082040054X0IWAR attributes and parameters. Explore more Other Function Memory ICs devices from Renesas Electronics
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M30082040054X0IWAR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Changzhou Starsea Electronics
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
BSS84-7-F
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
Loras Industries
TMS2708-45JL
TMS2708-45JL by Texas Instruments is a 1KX8 OTP ROM memory IC with 8192-bit density and 450 ns access time. It operates b/w 0 to 70°C, featuring a MOS technology in an IN-LINE package style. Ideal for applications requiring fast data retrieval and storage in commercial-grade environments.
TMS27P32A45
Other Memory ICs;
ST25DV64K-JFR6D3
STMicroelectronics
ST25DV64K-JFR6D3 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a small outline package and dual terminals, it offers a memory density of 65536 bits for various electronic devices.
TMS27C49-55NTL
ST25DV16K-IER6S3
ST25DV16K-IER6S3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a compact rectangular package style and gull wing terminals, it offers high memory density of 16384 bits for various functions.
MR2A16AVMA35R
Everspin Technologies
MR2A16AVMA35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, suitable for industrial applications. This low-profile, fine-pitch grid array package has 48 terminals and offers a memory density of 4,194,304 bits.
SN74AS870NT1
SN74AS870NT1 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The rectangular plastic/epoxy body makes it ideal for various other function memory circuits.
SN54AS871FH
SN54AS871FH by Texas Instruments is a TTL technology memory IC with 28 terminals in a square chip carrier package. Operating temperature range from -55°C to 125°C makes it suitable for military-grade applications. This surface-mount IC is designed for various functions requiring reliable performance in harsh environments.
SN74AS871FN3
SN74AS871FN3 by Texas Instruments is a TTL technology memory IC with 28 terminals in a square chip carrier package. Operating temperature range of 0-70°C makes it suitable for commercial applications. It features J bend terminals and is surface mountable, ideal for various electronic devices.
ST25DV04K-IER6C3
ST25DV04K-IER6C3 by STMicroelectronics is a 4Kx1 memory IC with CMOS technology. Operating at 3.3V, it has an industrial temperature grade and offers 4096-bit memory density. Ideal for applications requiring small outline, heat sink package style in surface mount configuration.
SN74170NP1
SN74170NP1 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. Ideal for commercial applications, it operates b/w 0°C to 70°C and features an in-line package style.
MR2A16ACMA35
MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.
TMS2150-9JL
TMS2150-9JL by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 90ns access time, 145mA max supply current, and operates at 5V. It is used in applications requiring fast memory access and low power consumption in commercial-grade environments.
TMS27C32-100NE4
TMS2716-45JL
TMS2716-45JL by Texas Instruments is a 2KX8 memory IC with 16384-bit density and 450 ns access time. It features 3-STATE output characteristics, suitable for commercial applications. Housed in a ceramic rectangular package with 24 terminals, it operates b/w 0 to 70°C, making it ideal for various electronic devices.
TMS2508-25JL
TMS2508-25JL by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density and 250ns access time. It features 3-STATE output, operates b/w 0 to 70°C, and has a rectangular ceramic package. Ideal for applications requiring common I/O type in commercial-grade environments.
M36LLR8860M1ZAQE
M36LLR8860M1ZAQE by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM. It operates at 1.8V with a max temp of 85 °C and supports surface mount applications. Ideal for compact devices requiring efficient memory solutions.
M36W108T120ZM1T
STMicroelectronics M36W108T120ZM1T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a CMOS technology, and supports a supply voltage range of 2.7V to 3.6V. This low-profile grid array package is suitable for commercial applications requiring high-density memory solutions.
SMJ27C210-25J
TMS27PC32-20NE
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M30082040054X0IWAY
Integrated Device Technology
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;
Renesas Electronics
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Length: 6 mm; No. of Words: 1048576 words;
M30082040108X0PWAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8; No. of Words Code: 1M;
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 1MX8; Memory Width: 8;
M30042040108X0ISAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Terminal Form: GULL WING;
M30082040054X0ISAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Terminal Pitch: 1.27 mm;
M30042040108X0ISAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Peak Reflow Temperature (C): 260;
M30042040054X0ISAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8; No. of Words: 524288 words;
M30042040054X0PSAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Memory Width: 8;
M30042040108X0IWAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: .8 mm; Peak Reflow Temperature (C): 260;
M30042040108X0PWAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Operating Mode: SYNCHRONOUS;
M30042040054X0PWAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES; Length: 6 mm;
M30082040054X0ISAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 2.16 mm; No. of Words Code: 1M;
M30042040054X0IWAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Moisture Sensitivity Level (MSL): 3;
M30042040108X0IWAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 5 mm; Terminal Position: DUAL;
M30042040054X0PSAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Organization: 512KX8;
M30042040108X0PSAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1; Surface Mount: YES;
M30042040108X0PSAY
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; Terminal Finish: TIN;
M30042040054X0ISAR
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Moisture Sensitivity Level (MSL): 3;
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