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M38510/20304BEX

Qp Semiconductor

M38510/20304BEX by Qp Semiconductor

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

M38510/20304BEX by Qp Semiconductor
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Digiode

USA . 4,429 parts In-Stock

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Vyrian

USA . 1,571 parts In-Stock

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Anansix

USA . 1,484 parts In-Stock

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One Stop Electronics

USA . 618 parts In-Stock

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$22.000

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618

$22.000

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UNI Independent Distributors

Spain . 4,986 parts In-Stock

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Corphita

USA . 4,230 parts In-Stock

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Technical Specifications

OTP ROM M38510/20304BEX attributes and parameters. Explore more OTP ROM devices from Qp Semiconductor

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-XDIP-T16

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X4

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

M38510/20304BEX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Qp Semiconductor

P Semiconductor is a privately held California company incorporated in October 1985. QP Semiconductor was formed initially to provide semiconductor assembly, electrical test and qualification services to the military, aerospace and high reliability industries. The company has since evolved into a true fabless semiconductor company with a complete range of manufacturing capability by establishing product design and fab foundry relationships to complement its assembly, test and qualification capability. The products and services offered, focus on providing total parts solutions for DMS, (Diminished Manufacturing Sources) and EOL (End of Life) semiconductor components to the military, aerospace and high reliability markets. QP Semiconductor was acquired by British company e2v in October, 2008.

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