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TDA8024TT

Philips Semiconductors

TDA8024TT by Philips Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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Digiode

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Anansix

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LWI Electronics Inc

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Corohmni

South Africa . 1,881 parts In-Stock

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Microchip USA

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One Stop Electronics

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UNI Independent Distributors

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Perfect Parts

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Corphita

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Infinite Electronics LLP (Excess)

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Kepictronics

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8024TT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TDA8024TT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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